The Leading Source for Global News and Information Covering the Ecosystem of High Productivity Computing
March 02, 2007
Researchers have used the world's thinnest material to create the world's smallest transistor – a breakthrough that could spark the development of a new type of super-fast computer chip.
Professor Andre Geim and Dr Kostya Novoselov from The School of Physics and Astronomy at The University of Manchester, reveal details of transistors that are only one atom thick and less than 50 atoms wide, in the March issue of Nature Materials.
They believe this innovation will allow the rapid miniaturisation of electronics to continue when the current silicon-based technology runs out of steam.
In recent decades, manufacturers have crammed more and more components onto integrated circuits. As a result, the number of transistors and the power of these circuits has roughly doubled every two years. This has become known as Moore's Law.
But the speed of cramming is now noticeably decreasing, and further miniaturisation of electronics is to experience its most fundamental challenge in the next ten to 20 years, according to the semiconductor industry roadmap.
Two years ago, Professor Andre Geim and his colleagues discovered a new class of materials that can be viewed as individual atomic planes pulled out of bulk crystals.
These one-atom-thick materials and particularly graphene – a gauze of carbon atoms resembling a chicken wire – have rapidly become one of the hottest topics in physics.
The first graphene-based transistor was reported by The University of Manchester team at the same time as the discovery of graphene, and other groups have recently reproduced the result (1).
But these graphene transistors were very 'leaky' (2), which has limited possible applications and ruled out important ones, such as their use in computer chips and other electronic circuits with a high density of transistors.
Now the Manchester team has found an elegant way around the problem and made graphene-based transistors suitable for use in future computer chips.
Page: 1 of 3(Digg, Technorati, more)
SDSC and Appro Next-Generation Supercomputer: SC09 Video Interview
Learn how SDSC and Appro are pushing the envelope and have come up with a supercomputer design that delivers 32 "supernodes".
Appro Ready-To-Go-Clusters – Quickly deploy ANSYS & Intel Cluster Ready Solutions
Offering a fully integrated Ready-To-Go Cluster based on the Appro GreenBlade System supporting up to 28 blade nodes in a half-size standard rack cabinet, including master nodes and switches.
Feb 09 | eWeek Europe | Company says new high-end servers will deliver "intelligent performance." Read more...
Feb 09 | EE Times | Wireless technology promises energy-efficient chip-to-chip communication. Read more...
Feb 08 | eWeek | A new kind of Rocky Mountain high. Read more...
Feb 08 | Computerworld | Chip maker hopes to bring CPU-GPU processors to servers in two years. Read more...
Feb 05 | Technology Review | IBM has created graphene transistors that leave silicon ones in the dust. Read more...
Jan 12 | | In-depth look at vSMP Foundation server virtualization technology, technical implementation, use cases and capabilities. The technical whitepaper provides an architectural overview and details on the three vSMP Foundation products: vSMP Foundation for SMP, vSMP Foundation for Cluster and vSMP Foundation for Cloud.
Jan 18 | | This white paper discusses Gore’s copper cable assemblies, and how they continue to exceed the standards for providing reliable, cost-effective solutions for high-performance computer applications.
Jan 11 | | LLNL is home to some of the fastest computers in the world. In 2012, LLNL expects to have the Sequoia supercomputing cluster operational with a projected performance of over 20 PFLOP/s. These systems will focus on strengthening the foundations of predictive simulation through running large suites of complex simulations and then comparing model predictions with experimental data. To visualize this project’s large amount of data, LLNL requested an Appro Supercomputing Cluster specifically designed to support interactive data analysis.
Join this online panel discussion for live Q&A with leading industry experts, analysts, and end-users to discuss the latest innovations, best practices, barriers to implementation, and measurable benefits of server virtualization with a particular focus on today's real world solutions.
Learn about scalable fault-tolerant architectures and examples of energy efficient and scalable supercomputing clusters using dual QDR InfiniBand to combine capacity computing with network failover capabilities with the help of programming languages such as MPI and a robust Linux cluster management package.
LIVE@SCO9: The IBM team discusses new innovations in hardware, software and services that help clients better understand their workloads and get insight from their R&D efforts. Technology demonstrations include the soon-to-be-released Power7 HPC processor, the DCS990 system with 2.4 petabytes of storage, the xCAT management tool, secure HPC cloud computing and more. Winners of two HPCwire Readers' and Editors’ Choice Awards! Take the IBM virtual tour at SC09 or more information go online to: http://www-03.ibm.com/systems/deepcomputing/sc09.html