Visit additional Tabor Communication Publications
November 17, 2008
Engenio 7900 HPC system enhancements reduce power consumption and footprint; maximize storage performance with fewer connections
AUSTIN, Texas, Nov. 17 -- SC08 -- LSI Corporation today introduced its new Engenio DE6900 high-density SATA drive enclosure and 8Gb/s Fibre Channel (8GFC) host connectivity as enhancements to its flagship LSI Engenio 7900 HPC storage system. Designed for compute-intensive applications and high-bandwidth workloads, the 7900 HPC storage system combines leading-edge performance with enterprise-class availability and reliability features for applications requiring continuous high-speed data accessibility.
"The amount of cooled, raised floor available at commercial and government-sponsored, high-performance datacenters is at a premium," said Steve Hochberg, senior director of HPC segment at LSI. "When combined with the low-cost, high-density SATA drive enclosure and 8Gb/s Fibre Channel connections, the 7900 HPC storage system provides organizations with dramatic savings on power consumption and floor space while continuing to provide high performance for data-intensive applications."
High-density enclosure improves energy efficiency by 30 percent
Based on sixth-generation LSI architecture, the Engenio DE6900 high-density SATA drive enclosure enhances the 7900 HPC system's ability to handle the massive data requirements of high-performance computing (HPC) applications. The DE6900 is a 4U, 19-inch rack-mountable drive enclosure capable of housing a total of sixty 3.5-inch low-cost, high-capacity SATA drives for a maximum capacity of 60TB in a single enclosure.
The new enclosure offers a 2.8X density increase compared to the current sixteen-drive Fibre Channel (FC) enclosure, enabling more drives per unit of rack space and scaling capacity to 480 SATA drives within the same footprint. The increased density translates into more than 30 percent savings on power consumption and greater than 65 percent savings on floor space to achieve similar performance and capacity. High-efficiency power supplies and variable-speed cooling fans further reduce power consumption.
"Escalating floor space requirements and rising energy costs are among the top concerns of high-performance computing customers today," said Ian Miller, senior vice president of sales and marketing at Cray Inc. "The new high-density enclosure from LSI allows the 7900 HPC system to directly address these concerns. We look forward to delivering the solution to our customers."
Serviceability and data availability are enhanced with easy access front-load drive trays and dampeners for controlled drawer movement -- avoiding I/O degradation from acceleration and deceleration of drives. All drives are active when drawers are open allowing individual drives to be replaced without impacting the operation of other drives. Safety is also enhanced by the reduction of forward-hanging mass during service operations.
"For many years, Silicon Graphics and LSI have worked hand-in-glove to provide HPC customers with a family of tightly-integrated, highly efficient, high-performance storage solutions," said Kurt Kuckein, SGI InfiniteStorage product line manager. "With today's announcements, we're able to offer our customers a high-density storage solution on our flagship mixed workload storage system, the InfiniteStorage 4600, increasing scalability while simultaneously lowering power consumption."
Maximize storage performance with 8GFC host connectivity
The 7900 HPC is one of the industry's first storage systems to offer 8GFC host connectivity. The sixteen 8GFC host interfaces enable organizations to consolidate, simplify and lower the cost of SAN infrastructure by decreasing the number of host and switch ports required to deliver equivalent or increased performance.
With the addition of 8GFC to the existing field-replaceable host interface options, including 4GFC and 20Gb/s InfiniBand interfaces, the 7900 HPC storage system is designed to quickly and easily adapt to evolving infrastructure, application and capacity requirements. Users can mix host interfaces, RAID levels (0, 1, 3, 5, 6 and 10) and disk drives within a single system -- optimizing price/performance and future proofing existing FC SAN investments.
The Engenio 7900 HPC storage system is available today through select OEM partners. The system will be on display in the LSI booth # 344 at the Supercomputing '08 (SC08) conference, which takes place Nov. 15-21 at the Austin Convention Center.
Additional information on the 7900 HPC system is available at http://www.lsi.com/7900hpc/.
LSI Corporation (NYSE:LSI) is a leading provider of innovative silicon, systems and software technologies that enable products, which seamlessly bring people, information and digital content together. The company offers a broad portfolio of capabilities and services including custom and standard product ICs, adapters, systems and software that are trusted by the world's best known brands to power leading solutions in the storage and networking markets. More information is available at http://www.lsi.com/.
Source: LSI Corp.
The Xeon Phi coprocessor might be the new kid on the high performance block, but out of all first-rate kickers of the Intel tires, the Texas Advanced Computing Center (TACC) got the first real jab with its new top ten Stampede system.We talk with the center's Karl Schultz about the challenges of programming for Phi--but more specifically, the optimization...
Although Horst Simon was named Deputy Director of Lawrence Berkeley National Laboratory, he maintains his strong ties to the scientific computing community as an editor of the TOP500 list and as an invited speaker at conferences.
Supercomputing veteran, Bo Ewald, has been neck-deep in bleeding edge system development since his twelve-year stint at Cray Research back in the mid-1980s, which was followed by his tenure at large organizations like SGI and startups, including Scale Eight Corporation and Linux Networx. He has put his weight behind quantum company....
May 16, 2013 |
When it comes to cloud, long distances mean unacceptably high latencies. Researchers from the University of Bonn in Germany examined those latency issues of doing CFD modeling in the cloud by utilizing a common CFD and its utilization in HPC instance types including both CPU and GPU cores of Amazon EC2.
May 15, 2013 |
Supercomputers at the Department of Energy’s National Energy Research Scientific Computing Center (NERSC) have worked on important computational problems such as collapse of the atomic state, the optimization of chemical catalysts, and now modeling popping bubbles.
May 10, 2013 |
Program provides cash awards up to $10,000 for the best open-source end-user applications deployed on 100G network.
May 09, 2013 |
The Japanese government has revealed its plans to best its previous K Computer efforts with what they hope will be the first exascale system...
May 08, 2013 |
For engineers looking to leverage high-performance computing, the accessibility of a cloud-based approach is a powerful draw, but there are costs that may not be readily apparent.
05/10/2013 | Cleversafe, Cray, DDN, NetApp, & Panasas | From Wall Street to Hollywood, drug discovery to homeland security, companies and organizations of all sizes and stripes are coming face to face with the challenges – and opportunities – afforded by Big Data. Before anyone can utilize these extraordinary data repositories, however, they must first harness and manage their data stores, and do so utilizing technologies that underscore affordability, security, and scalability.
04/15/2013 | Bull | “50% of HPC users say their largest jobs scale to 120 cores or less.” How about yours? Are your codes ready to take advantage of today’s and tomorrow’s ultra-parallel HPC systems? Download this White Paper by Analysts Intersect360 Research to see what Bull and Intel’s Center for Excellence in Parallel Programming can do for your codes.
In this demonstration of SGI DMF ZeroWatt disk solution, Dr. Eng Lim Goh, SGI CTO, discusses a function of SGI DMF software to reduce costs and power consumption in an exascale (Big Data) storage datacenter.
The Cray CS300-AC cluster supercomputer offers energy efficient, air-cooled design based on modular, industry-standard platforms featuring the latest processor and network technologies and a wide range of datacenter cooling requirements.