HPCwire: HiPC 2009 Issues Call for Participation

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February 04, 2009

HiPC 2009 Issues Call for Participation

Feb. 4 -- The 16th annual IEEE International Conference on High Performance Computing (HiPC 2009) will be held in Cochin, India, during Dec. 16-19, 2009. It will serve as a forum to present the current work by researchers from around the world, and act as a venue to provide stimulating discussions and highlight high performance computing (HPC) activities in Asia. The conference has a history of attracting participation from reputed researchers from all over the world.

The 15th HiPC Conference held in Bangalore, India, in December 2008, had 46 contributed papers chosen from 317 submissions from 27 countries. The conference included technical paper sessions, keynotes from leading HPC researchers, a poster paper session, an exhibition, an industry session with presentations from leading HPC companies, a HPC user community meeting, tutorials on hot topics in computing and networking, and several workshops focused on emerging areas. The 14th HiPC Conference, held in Goa, India, in December 2007, had 52 contributed papers that were selected from over 253 submissions from 31 countries and approximately 300 participants attended the meeting, and 13th HiPC Conference held in Bangalore, India, in December 2006, had 52 contributed papers that were selected from over 335 submissions from 40 countries. The HiPC attendance is approximately 300 with a good mix of participants from India and the rest of the world. Further information about HiPC 2009 and the HiPC series of meetings is available on the conference Web site at http://www.hipc.org.

HiPC 2009 will focus on the design and analysis of high performance computing and networking systems and their scientific, engineering, and commercial applications. In addition to technical sessions consisting of contributed papers, the conference will include invited presentations, a poster session, tutorials, and vendor presentations.

Important Dates

April       04, 2009   Conference Paper Submission Begins
May         15, 2009   Conference Paper Submission Ends
May         15, 2009   Workshop Proposals Due
May         18, 2009   Tutorial Proposals Due
July        17, 2009   Notification of Acceptance/Rejection
August      17, 2009   Camera-Ready Paper Submission
September   14, 2009   Student Symposium Submissions Due
October     19, 2009   Student Symposium Accept/Reject Decisions
November    09, 2009   Early Registration Deadline

Co-sponsored by:

IEEE Computer Society Technical Committee on Parallel Processing (TCPP)
ACM SIGARCH
European Association for Theoretical Computer Science
IFIP Working Group on Concurrent Systems
National Association of Software and Service Companies (NASSCOM)
Manufacturers' Association for Information Technology (MAIT)

Held in cooperation with:

Indian Institutes of Technology
Institute of Technology, Banaras Hindu University, Varanasi
Software Technology Parks of India
Tata Institute of Fundamental Research, India

Venue and Meeting Information

The advance program will be available in July 2009. Check the conference Web site at http://www.hipc.org for updated information.

Call for Papers

Authors are invited to submit original unpublished manuscripts that demonstrate current research in all areas of high performance computing including design and analysis of parallel and distributed systems, embedded systems, and their applications in scientific, engineering and commercial areas.

Topics of interest include but are not limited to:

High-Performance Computing
Parallel and Distributed Algorithms
Parallel Languages and Programming Environments
Load Balancing, Scheduling and Resource Management
Fault-Tolerant Algorithms and Systems
Scientific/Engineering/Commercial Applications and Workloads
Emerging Applications such as Biotechnology and Nanotechnology
Cluster and Grid Computing
Peer-to-peer Algorithms and Networks
Heterogeneous Computing
Wireless and Mobile Computing
Communication/Sensor Networks and Embedded Applications
Interconnection Networks and Architectures
Scalable Servers and Systems
High Performance/Scalable Storage Systems
Power-Efficient and Reconfigurable Architectures
Compiler Technologies for High-Performance Computing
Software Support and Advanced Micro-architecture Techniques
Operating Systems for Scalable High-Performance Computing

Manuscript Guidelines

Submitted manuscripts should be structured as technical papers and may not exceed 10 letter size (8.5 x 11) pages including figures, tables and references using the IEEE format for conference proceedings -- print area of 6-1/2 inches (16.51 cm) wide by 8-7/8 inches (22.51 cm) high, two-column format with columns 3-1/16 inches (7.85 cm) wide with a 3/8 inch (0.81 cm) space between them, single-spaced 10-point Times fully justified text. For more information, see ftp://pubftp.computer.org/Press/Outgoing/proceedings/.

Submissions not conforming to these guidelines may be returned without review. Authors should submit the manuscript in PDF format and make sure that the file will print on a printer that uses letter size (8.5 x 11) paper. The official language of the meeting is English.

Manuscript submission will start on April 4, 2009. Manuscript submission procedures will then be available over the Web at http://www.hipc.org. Electronic submissions must be in the form of a readable PDF file.

Manuscripts must be received by May 15, 2009. Manuscripts should demonstrate current research in any area of high performance computing. All manuscripts will be reviewed and will be judged on correctness, originality, technical strength, significance, quality of presentation, and interest and relevance to the conference attendees.

Submitted papers must represent original unpublished research that is not currently under review for any other conference or journal. Papers not following these guidelines will be rejected without review and further action may be taken, including (but not limited to) notifications sent to the heads of the institutions of the authors and sponsors of the conference.

Submissions received after the due date, exceeding length limit, or not appropriately structured may also not be considered. Authors may contact the Program Chair at the address below for further information or clarification.

Notification of review decisions will be mailed by July 17, 2009. Camera-ready papers are due by Aug. 17, 2009. A published proceedings will be available at the conference.

Program Chair:

Yuanyuan Yang, State University of New York at Stony Brook, Email: yang@ece.sunysb.edu

Best Paper Awards

Best paper awards, sponsored by Infosys, will be given for outstanding contributed papers.

Workshops

Proposals are solicited for workshops to be held in conjunction with the main conference. Interested individuals should submit a proposal by May 15, 2009, to the Workshops Chair. Additional details and submission guidelines will be available at the conference Web site.

Workshops Chair:

Manimaran Govindarasu, Iowa State University, Email: gmani@iastate.edu

Student Research Symposium

HiPC 2009 will feature the second student research symposium on High Performance Computing (HPC) aimed at stimulating and fostering student research, and providing an international forum to highlight student research accomplishments. The symposium will also expose students to the best practices in HPC in academia and industry. The one-day symposium will feature brief presentations by student authors on their research, followed by a poster exhibit. Short invited talks by leading HPC researchers/ practitioners will be included in the program. The symposium reception will provide an opportunity for students to interact with HPC researchers and practitioners (and recruiters) from academia and industry. To be considered, students should submit a 5 page extended abstract of their research. Submission procedures will be available at the Student Symposium Web site, accessible from http://www.hipc.org, after Aug. 17, 2009. For additional details, see the conference Web site or contact the Symposium Co-Chairs.

Symposium Co-Chairs:

Ashok Srinivasan, Florida State University, Email: student_symposium@hipc.org
Rajeev Thakur, Argonne National Laboratory, Email: student_symposium@hipc.org

Tutorials

Proposals are solicited for tutorials to be held at the meeting. Interested individuals/groups should submit a proposal by May 18, 2009 to the Tutorials Chair. The proposal (5 pages maximum) should include a brief description of the intended audience, a lecture outline, and a vita for each lecturer. For additional details, contact the Tutorials Chair.

Tutorials Chair:

Rajeev Sivaram, Google, USA, Email: rajeev.sivaram@gmail.com

Industry Exhibition

Companies and R&D laboratories are encouraged to present their exhibits at the meeting. Additionally, a full day of vendor presentations is planned. Further details can be obtained at the conference Web site or by contacting the Industry Liaison Chair.

Industry Co-Chairs:

Rama K. Govindaraju, Google, USA, Email: rama.govindaraju@gmail.com
Ramamurthy Badrinath, HP, India, Email: ramamurthy.badrinath@hp.com

User/Industry Symposium on HPC Technologies, Applications & Experience

The symposium will bring together providers and users of HPC to provide a forum for presenting the state-of-the-art in HPC platforms and technologies, for discussing best practices and for exchanging experiences. HPC applications and the experiences of application developers will be of special interest to this mini symposium. The symposium will consist of invited as well as contributed talks by leading experts from industry, research laboratories and universities, as well as panels and open discussions. For further details and to submit abstract, visit the conference Web site.

Symposium Co-Chairs:

Rama K. Govindaraju, Google, USA, Email: rama.govindaraju@gmail.com
Ramamurthy Badrinath, HP, India, Email: ramamurthy.badrinath@hp.com

Travel Scholarships for Students from India

HiPC 2009 will be awarding travel scholarships to students from Indian Engineering Colleges to encourage them to attend the conference. This merit-based scholarship will cover their travel and accommodation expenses. The last date of application is Oct. 31, 2009. For more details, visit the conference Web site or contact the Scholarships Co-Chairs.

Scholarships Co-Chairs:

Sumam David, NITK, India, Email: sumam@ieee.org
Madhusudan Govindaraju, SUNY Binghamton, Email: mgovinda@cs.binghamton.edu

HiPC 2009 Organization

General Co-Chairs
Manish Parashar, Rutgers University
Rajeev Muralidhar, Intel, India

Vice General Co-Chairs
Rajendra V. Boppana, University of Texas at San Antonio
Rama Govindaraju, Google, USA

Program Chair
Yuanyuan Yang, State University of New York at Stony Brook

Program Vice Chairs

Algorithms: Xiaotie Deng, City University of Hong Kong

Applications: Omer Rana, Cardiff Univ., UK

Architecture: Angelos Bilas, FORTH and University of Crete, Greece

Communication Networks: Xin Yuan, Florida State University

Mobile and Sensor Computing: Simon Dobson, UCD, Ireland

Systems Software: Gagan Agrawal, Ohio State University

Steering Chair
Viktor K. Prasanna, University of Southern California

Production Chair
Animesh Pathak, INRIA, France

Workshops Chair
Manimaran Govindarasu, Iowa State University

Student Research Symposium Co-Chairs
Ashok Srinivasan, Florida State University
Rajeev Thakur, Argonne National Laboratory

Tutorials Chair
Rajeev Sivaram, Google, USA

Industry Liaison Co-Chairs
Rama K. Govindaraju, Google, USA
Ramamurthy Badrinath, HP, India

HiPC User/Industry Symposium Co-Chairs
Rama K. Govindaraju, Google, USA
Ramamurthy Badrinath, HP, India

Cyber Co-Chairs
Yinglong Xia, University of Southern California
Ananth Narayan, Intel, India

Finance Co-Chairs
Ajay Gupta, Western Michigan University
Thondiyil Venugopalan, India

Local Coordination Co-Chairs
Raghavendra Buddi, Netapp, India
Kalyana Krishna, Talentain, India

Publications Chair
Sushil K. Prasad, Georgia State University

Publicity Co-Chairs
Avinash Srinivasan, Bloomsburg University, USA
Manisha Gajbe, Georgia Institute of Technology

Registration Co-Chairs
Sally Jelinek, Electronic Design Associates, USA
Jyothsna Kasturirengan, Fiberlink, India

Scholarships Co-Chairs
Sumam David, NITK, India
Madhusudan Govindaraju, SUNY Binghamton

Steering Committee
P. Anandan, Microsoft Research, India
David A. Bader, Georgia Institute of Technology
Ramamurthy Badrinath, HP, India
Rudramuni B., Dell India R&D, Bangalore, India
Frank Baetke, HP, USA
R. Govindarajan, Indian Institute of Science, India
Harish Grama, IBM, India
Manish Gupta, India Systems and Technology Lab, IBM, India
Vittal Kini, Intel, India
Ashwini Nanda, Computational Research Lab., India
Viktor K. Prasanna, University of Southern California (Chair)
Venkat Ramana, Cray-Hinditron, India
Sartaj Sahni, University of Florida
Lokendra Shastry, Infosys, India
Santosh Sreenivasan, Talentain Technologies, India
V. Sridhar, Satyam Computer Services Ltd., India
Harrick M. Vin, Tata Research, Development and Design Center (TRDDC), Pune, India

Steering Committee 2009 membership also includes the general co-chairs, program chairs and vice general co-chairs from 2008, 2009 and 2010.

Program Committee

Algorithms:
Mikhail Atallah, Purdue University
Robert S. Germain, IBM T.J. Watson Research Center, USA
Amir Khuller, University of Maryland
Dariuzs Kowalski, University of Liverpool, UK
Zhi-Zhong Chen, Tokyo Denki University, Japan
Pierluigi Crescenzi, University of Florence, Italy
Haodi Feng, Shandong University, China
Matteo Frigo, University of Paderborn, Germany
Rudolf Fleischer, Fudan University, China
Phalguni Gupta, Indian Institute of Technology, Kanpur, India
Xiao-Dong Hu, Academy of Mathematics & Systems Science, Chinese Academy of Sciences, China
Christos Kaklamanis, University of Patras, Greece
Monaldo Mastrolilli, University of Lugano, Switzerland
Ulrich Meyer, Frankfurt University, Germany
Sanguthevar Rajasekaran, University of Connecticut
Andrew Rau-Chaplin, University of Dalhousie, Canada
Ulrich Rude, University of Erlangen Nuremberg, Germany
Jesper Larsson Traeff, NEC Laboratories, Europe
Denis Trystram, Informatique et Distribution (ID)-IMAG, Grenoble, France
DS Wang, Tsinghua University, China
Wenan Zang, University of Hong Kong, China
Philippas Tsigas, Chalmers University of Technology, Sweden
Geppino Pucci, University of Padova,Italy
Tian-Ming Bu, East China Normal University
Mao-cheng Cai, Academy of Mathematics & Systems Science, Chinese Academy of Sciences, China

Applications:
Manish Parashar, Rutgers University
Ken Hawick, Massey University, New Zealand
Massimo Cafaro, University of Salento, Lecce, Italy
Andreas Schreiber, German Aerospace/DLR, Germany
Shantenu Jha, LSU/CCT
David Berholdt, Oak Ridge National Lab
David Walker, Cardiff University, UK
Mark Cameron, CSIRO, Australia
Matthias Hovestadt, Technische Universitaet Berlin, Germany
Bruno Schulze, LNCC (National Laboratory for Scientific Computing), Brasil
Guijun Wang, Boeing, USA
Alan Sussman, University of Maryland
Odej Kao, TU Berlin, Germany
Anshul Gupta, IBM T.J. Watson, USA
D. T. Singh, Genvea BioSciences, Singapore
Lois Curfmann McInnes, Argonne National Lab
Rod Hose, University of Sheffield, UK

Architecture:
Rajeev Balasubramonian, University of Utah
Mats Brorsson, Royal Institute of Technology, Sweden
Marcelo Cintra, University of Edinburgh, UK
Toni Cortes, Polytechnic University of Catalonia, Spain
Wu-chun Feng, Virginia Tech
Jose Flich, Polytechnic University of Valencia, Spain
Georgi Gaydadjiev, Delft University of Technology, The Netherlands
Ananth Grama, Purdue Univeristy
Sanjeev Kumar, PatternInsight, USA
Andreas Moshovos, University of Toronto, Canada
Scott Pakin, Los Alamos National Laboratory
Timothy Pinkston, University of Southern California
Vassos Soteriou, Cyprus University of Technology, Cyprus
Eno Thereska, Microsoft, UK
Pedro Trancoso, University of Cyprus, Cyprus
Vijay Pai, Purdue University
Parthasarathy Ranganathan, Hewlett Packard Labs, USA
Peter Varman, Rice Univesrity
Vinod Viswanath, Intel Corporation, USA
Sudhakar Yalamanchili, Georgia Tech

Communication Networks:
Zhenhai Duan, Florida State University
Ahmad Faraj, IBM, USA
Kartik Gopalan, SUNY at Binghamton
Wei Huang, VMware, USA
Minglu Li, Shanghai Jiaotong University, China
Xiao Li, Michigan State University
Rami Melhem, University of Pittsburgh
Srihari Nelakuditi, University of South Carolina
DK Panda, Ohio State University
Fabrizio Petrini, IBM T.J. Watson Research Center, USA
Federico Silla, Universidad Politecnica de Valencia, Spain
Craig Stunkel, IBM T.J. Watson Research Center, USA
Jie Wu, Florida Atlanta University and NSF
Cheng-Zhong Xu, Wayne State University, USA
Yuanyuan Yang, SUNY Stony Brook
Weikuan Yu, Oak Ridge National Lab
Xin Yuan, Florida State University
Zhenghao Zhang, Florida State University

Mobile and Sensor Computing:
Giuseppe Amato, CNR, Italy
Ozalp Babaoglu, University of Bologna, Italy
Torsten Braun, University of Bern, Switzerland
Kieran Delaney, Cork Institute of Technology, Ireland
Qing Cao, University of Illinois at Urbana-Champaign
Hakima Chaouchi, IT Sud Paris, France,
Simon Dobson, UCD Dublin, Ireland
Karin Hummel, University of Vienna, Austria
Dario Pompili, Rutgers University
Roy Sterritt, University of Ulster, UK
Djamal Zeghlache, TEELCOM & Management Sud-Paris, France
Paolo Santi, CNR, Italy
Andreas Timm-Giel, Universitat Bremen, Germany
Hongwei Zhang, Wayne State University, USA

Systems Software:
Gerald Sabin, RNET Technologies, USA
A. Rountev, Ohio State University
R. Govindarajan, India
Sriram Krishnamoorthy, PNL
Arun Chauhan, Indiana University
Beth Plale, Indiana University
Umit Catalyurek, Ohio State University
Madhusudhan Govindaraju, SUNY Binghamton
Kuan-Ching Li, Providence University, Taiwan
Weikuan Yu, Oak Ridge National Labs
Pavan Balaji, Argonne National Labs
Feng Qin, Ohio State University
Radu Teodorescu, Ohio State University
Yeh-Ching Chung, National Tsing Hua University, Taiwan
Doug Thain, Notre Dame University
Amol Ghoting, IBM Research, USA
Henrique Andrade, IBM Research, USA
Renato Ferreira, UFMG, Brazil
Sanjeev Aggarwal, IIT Kanpur, India
Yuan-shin Hwang, National Taiwan Ocean University, Taiwan
Jaejin Li, Seoul National University, Korea

-----

Source: HiPC 2009

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