Visit additional Tabor Communication Publications
November 04, 2009
Nov. 3 -- At SC09, the 22nd annual supercomputing conference, Inphi will launch its Isolation Memory Buffer, the industry's first component based on Inphi's innovative Isolation Memory Buffer (iMB) technology. The iMB memory architecture enables servers to take full advantage of multicore and virtualization technologies. Inphi's iMB component is driving the creation of LR-DIMMs, a new class of memory modules able to deliver upward of four times the memory capacity and nearly double the bandwidth.
Visit Inphi's Booth #1255 to see the first public demonstration of Inphi's Isolation Memory Buffer product (iMB01-GS01). Inphi will show bandwidth-intensive applications running side-by-side on comparably configured systems with and without the Inphi isolation memory buffer.
Sameer Kuppahalli, product marketing manager of the DDR3 Memory Buffer Program at Inphi Corp., will give a technical presentation titled "Meeting the Growing Demands for Memory Capacity and Available Bandwidth in Server and HPC Applications" on Wed., Nov. 18 at 3:30 p.m. in Room E143-144.
Twice a day at SC09, Inphi will hold a drawing to give away an Amazon Kindle device. Attendees can enter the drawing by visiting Inphi's booth.
SC09 will take place Nov. 14-20, 2009. Inphi will be in Booth #1255 at SC09, at the Oregon Convention Center in Portland, Ore.
More information on Inphi's new Isolation Memory Buffer based on iMB technology will be available in the SC09 virtual press room, www.virtualpressoffice.com/kit/InphiSC09.
SC09 will be the 22nd consecutive year of the SC (Supercomputing) Conference Series, the international conference for high-performance computing, networking, storage and analysis. The technical program, which is the heart of this event, has addressed virtually every area of scientific and engineering research, as well as technical development, innovation and education. Established 21 years ago, the SC Conference Series has built a diverse community of participants that include researchers, scientists, computer manufacturing personnel, program managers, journalists and congressional staffers. This diversity is one of the conference's main strengths, making it a yearly "must attend" forum for stakeholders throughout the technical computing community.
Inphi Corporation, a high-speed analog semiconductor company, provides leading-edge interface components that operate at critical interfaces within cloud computing environments, addressing the bandwidth, capacity and power issues faced by datacenters and 40G/100G networks. By leveraging its core competencies in advanced analog circuit design, signal integrity, power management, packaging and process technologies, Inphi has taken a leadership role in the markets it serves. Inphi's more than 150 analog components push the boundaries of existing server, storage and broadband networking applications while paving the way for new ones. To learn more about Inphi, visit www.inphi.com.
Source: Inphi Corp.
The Xeon Phi coprocessor might be the new kid on the high performance block, but out of all first-rate kickers of the Intel tires, the Texas Advanced Computing Center (TACC) got the first real jab with its new top ten Stampede system.We talk with the center's Karl Schultz about the challenges of programming for Phi--but more specifically, the optimization...
Although Horst Simon was named Deputy Director of Lawrence Berkeley National Laboratory, he maintains his strong ties to the scientific computing community as an editor of the TOP500 list and as an invited speaker at conferences.
Supercomputing veteran, Bo Ewald, has been neck-deep in bleeding edge system development since his twelve-year stint at Cray Research back in the mid-1980s, which was followed by his tenure at large organizations like SGI and startups, including Scale Eight Corporation and Linux Networx. He has put his weight behind quantum company....
May 16, 2013 |
When it comes to cloud, long distances mean unacceptably high latencies. Researchers from the University of Bonn in Germany examined those latency issues of doing CFD modeling in the cloud by utilizing a common CFD and its utilization in HPC instance types including both CPU and GPU cores of Amazon EC2.
May 15, 2013 |
Supercomputers at the Department of Energy’s National Energy Research Scientific Computing Center (NERSC) have worked on important computational problems such as collapse of the atomic state, the optimization of chemical catalysts, and now modeling popping bubbles.
May 10, 2013 |
Program provides cash awards up to $10,000 for the best open-source end-user applications deployed on 100G network.
May 09, 2013 |
The Japanese government has revealed its plans to best its previous K Computer efforts with what they hope will be the first exascale system...
May 08, 2013 |
For engineers looking to leverage high-performance computing, the accessibility of a cloud-based approach is a powerful draw, but there are costs that may not be readily apparent.
05/10/2013 | Cleversafe, Cray, DDN, NetApp, & Panasas | From Wall Street to Hollywood, drug discovery to homeland security, companies and organizations of all sizes and stripes are coming face to face with the challenges – and opportunities – afforded by Big Data. Before anyone can utilize these extraordinary data repositories, however, they must first harness and manage their data stores, and do so utilizing technologies that underscore affordability, security, and scalability.
04/15/2013 | Bull | “50% of HPC users say their largest jobs scale to 120 cores or less.” How about yours? Are your codes ready to take advantage of today’s and tomorrow’s ultra-parallel HPC systems? Download this White Paper by Analysts Intersect360 Research to see what Bull and Intel’s Center for Excellence in Parallel Programming can do for your codes.
In this demonstration of SGI DMF ZeroWatt disk solution, Dr. Eng Lim Goh, SGI CTO, discusses a function of SGI DMF software to reduce costs and power consumption in an exascale (Big Data) storage datacenter.
The Cray CS300-AC cluster supercomputer offers energy efficient, air-cooled design based on modular, industry-standard platforms featuring the latest processor and network technologies and a wide range of datacenter cooling requirements.