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November 11, 2009
3Leaf Systems to Showcase Scalable x86 SMP Systems at SC09
Company to demonstrate new dynamic datacenter solutions
SANTA CLARA, Calif., Nov. 11 -- 3Leaf Systems, an innovator of ASIC and software technologies that enable the dynamic datacenter, will showcase the company's recently launched Dynamic Data Center Solutions at Supercomputing 2009 (SC09). 3Leaf Systems will demonstrate the application of the company's scalable x86-based shared memory systems for a variety of high-performance computing applications, including computational fluid dynamics, oil and gas reservoir modeling and bio-science research.
3Leaf Systems will be at SC09 at the Portland Oregon Convention Center in Portland, Ore., Nov. 16-20, 2009. The company will be represented at the following booths: 3Leaf Systems Booth #3093, AMD Booth #1417, and Supermicro Booth #2355
SC09 is recognized globally as the premier international conference on high-performance computing, networking, storage and analysis. This premier international conference includes a globally attended technical program, workshops, tutorials, an exhibit area, demonstrations and hands-on learning.
About 3Leaf Systems
3Leaf Systems develops innovative ASIC/software technologies that enable the Dynamic Data Center. 3Leaf Systems allows customers to merge previously separate CPU, I/O and memory resources from multiple x86-based systems into one large computing "fabric" so resources can be instantly delivered to demanding applications, just-in-time, as needed. By leveraging cost-optimized components to build performance-optimized systems, 3Leaf Systems solutions make datacenter infrastructure more agile and flexible while dramatically reducing capital and operational costs. A privately held company based in Santa Clara, Calif., investors in 3Leaf Systems include Alloy Ventures, Enterprise Partners, Intel Capital, LSI, and Storm Ventures. For more information, visit www.3leafsystems.com or call 408-572-5900.
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Source: 3Leaf Systems
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