Aspen
NetApp
HPCwire

Since 1986 - Covering the Fastest Computers
in the World and the People Who Run Them

Language Flags

Visit additional Tabor Communication Publications

Datanami
Digital Manufacturing Report
HPC in the Cloud
Green Computing Report

Tabor Communications
Corporate Video

Intel Teams Up with Leading Researchers to Make Football Helmets Safer


* Intel collaborated with several industry experts to improve football helmet safety by using Intel technology-based supercomputers and workstations to simulate a human brain's reaction to collisions.
* Intel worked with Mayo Clinic on faster diagnostics of medical scans using upcoming supercomputing chip design called "Intel MIC" ("Mike") so players spend less time on the bench and more time on the field.
* Future technologies could include helmets with built-in Intel Atom chips that measure and feed real-time data to medical personnel.

NEW ORLEANS, Nov. 15 -- Intel Corporation today announced that it is collaborating with industry experts and several universities to tackle the issue of football-related head injuries.

Using supercomputers and workstations based on present and future Intel processor technology, researchers are simulating collisions to study the impact on the brain, and use that information to design new football helmets that reduce the risk of short- and long-term injuries.

Intel, working with Riddell, the premier designer and developer of helmets and protective equipment, and researchers from the Thayer School of Engineering (Dartmouth), Wayne State University, University of Northern Colorado and Texas State University-San Marcos, demonstrated simulations during an event at the SC10 conference in New Orleans.

In this demonstration, simulated impacts are processed on Intel Xeon Processor-based Workstations and Clusters, or a group of linked computers, to rapidly compute, visualize and assess the risk of injury in an impact event. The simulations are based on computer models from partner universities, some of which include actual data from on-field impacts using the Riddell HITS (Head Impact Telemetry System), a proprietary in-helmet technology that provides real-time data regarding head impacts. These models show visualization of the stresses on the brain and can allow for comparisons between impacts that are found to result in a concussion and similar impacts that cause no injury.

"Computer simulations have been instrumental in designing improved brain injury criteria," said Dr. Igor Szczyrba with the University of Northern Colorado. "In the near future, they can also help doctors diagnose actual brain injuries."

Separately, attending the event and discussing the importance of using safe equipment to prevent injuries, was Drew Brees, quarterback of the New Orleans Saints and Super Bowl XLIV MVP.

While no equipment can prevent 100 percent of injuries, Intel is also working with Mayo Clinic to accelerate the ability to process medical scans. In this application, cranial scans running on Intel Many Integrated Core (MIC) architecture co-processors were accelerated by up to 18 times.

During the event, Intel also discussed future technologies, based on its Intel Atom processors, which could be embedded in helmets and wirelessly feed data into servers and cloud networks that measure injury risk and impact in real-time. When combined with impact simulation, this could better safeguard players by identifying potential injuries quickly so that medical personnel can respond faster and have information as soon as they reach the player on the field.

Intel, with its top-ranked Intel Xeon chip-based supercomputers, has been a leader in using parallel processing to solve complex problems. Some of this urgent and groundbreaking research is made possible by Intel MIC architecture, which could run up to trillions of calculations per second, and includes in its targets high-performance computing segments such as scientific research, exploration and climate modeling. The first Intel MIC product, codenamed "Knights Corner," will be made on Intel's 22-nanometer (nm) manufacturing process -- transistor structures packed as small as 22 billionths of a meter -- and will use Moore's Law to scale tens of Intel processing cores on a single chip. While the vast majority of workloads will still run best on award-winning Intel Xeon processors, Intel MIC architecture will add more business opportunities for highly parallel applications.

About Intel

Intel (NASDAQ: INTC), the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

-----

Source: Intel Corp.

Sponsored Links

Webinar: Programming Heterogeneous X64+GPU Systems Using OpenACC
Join Michael Wolfe as he compares the advantages and costs of using both low-level models and the directive-based OpenACC model for programming accelerated heterogeneous systems. Registration is free.

High-Performance Computing in Action
Businesses that want to be on the cutting edge of their industries are increasingly turning to high-performance computing (HPC) solutions to handle complex compute processes and speed up their rate of innovation. Download this Executive Brief to see how businesses in energy, life sciences and entertainment put HPC solutions to work in their operations.

Accelerate your science with Seneca
One of the first HPC providers installing a 4X NVIDIA Kepler K-20 cluster. Invites you to a free evaluation on Seneca’s NVIDIA K20 Kepler cluster, pre-loaded with AMBER, NAMD, LAMMPS

May 24, 2013

May 23, 2013

May 22, 2013

May 21, 2013

May 20, 2013

May 17, 2013

May 16, 2013

May 15, 2013

May 14, 2013

May 13, 2013


Most Read Features

Most Read Around the Web

Most Read This Just In

Cray CS300-LC

Feature Articles

Exascale Advocates Stand on Nuclear Stockpiles

In quieter times, sounding the bell of funding big science with big systems tends to resonate further than when ears are already burning with sour economic and national security news. For exascale's future, however, the time could be ripe to instill some sense of urgency....
Read more...

NSF Forges Further Beyond FLOPs

In a recent solicitation, the NSF laid out needs for furthering its scientific and engineering infrastructure with new tools to go beyond top performance, Having already delivered systems like Stampede and Blue Waters, they're turning an eye to solving data-intensive challenges. We spoke with the agency's Irene Qualters and Barry Schneider about..
Read more...

CERN, Google Drive Future of Global Science Initiatives

Large-scale, worldwide scientific initiatives rely on some cloud-based system to both coordinate efforts and manage computational efforts at peak times that cannot be contained within the combined in-house HPC resources. Last week at Google I/O, Brookhaven National Lab’s Sergey Panitkin discussed the role of the Google Compute Engine in providing computational support to ATLAS, a detector of high-energy particles at the Large Hadron Collider (LHC).
Read more...

Short Takes

NASA Builds 'Climate in a Box'

May 23, 2013 | The study of climate change is one of those scientific problems where it is almost essential to model the entire Earth to attain accurate results and make worthwhile predictions. In an attempt to make climate science more accessible to smaller research facilities, NASA introduced what they call ‘Climate in a Box,’ a system they note acts as a desktop supercomputer.
Read more...

Building Supercomputers with Raspberries

May 22, 2013 | At some point in the not-too-distant future, building powerful, miniature computing systems will be considered a hobby for high schoolers, just as robotics or even Lego-building are today. That could be made possible through recent advancements made with the Raspberry Pi computers.
Read more...

Running Computational Fluid Dynamics in the Cloud

May 16, 2013 | When it comes to cloud, long distances mean unacceptably high latencies. Researchers from the University of Bonn in Germany examined those latency issues of doing CFD modeling in the cloud by utilizing a common CFD and its utilization in HPC instance types including both CPU and GPU cores of Amazon EC2.
Read more...

Computing the Physics of Bubbles

May 15, 2013 | Supercomputers at the Department of Energy’s National Energy Research Scientific Computing Center (NERSC) have worked on important computational problems such as collapse of the atomic state, the optimization of chemical catalysts, and now modeling popping bubbles.
Read more...

Sponsored Whitepapers

Best Practices in Big Data Storage

05/10/2013 | Cleversafe, Cray, DDN, NetApp, & Panasas | From Wall Street to Hollywood, drug discovery to homeland security, companies and organizations of all sizes and stripes are coming face to face with the challenges – and opportunities – afforded by Big Data. Before anyone can utilize these extraordinary data repositories, however, they must first harness and manage their data stores, and do so utilizing technologies that underscore affordability, security, and scalability.

Progress in Parallel: the Bull Parallel Programming Center

04/15/2013 | Bull | “50% of HPC users say their largest jobs scale to 120 cores or less.” How about yours? Are your codes ready to take advantage of today’s and tomorrow’s ultra-parallel HPC systems? Download this White Paper by Analysts Intersect360 Research to see what Bull and Intel’s Center for Excellence in Parallel Programming can do for your codes.

Sponsored Multimedia

SGI DMF ZeroWatt Disk Solution

In this demonstration of SGI DMF ZeroWatt disk solution, Dr. Eng Lim Goh, SGI CTO, discusses a function of SGI DMF software to reduce costs and power consumption in an exascale (Big Data) storage datacenter.

Cray CS300-AC Cluster Supercomputer Air Cooling Technology Video

The Cray CS300-AC cluster supercomputer offers energy efficient, air-cooled design based on modular, industry-standard platforms featuring the latest processor and network technologies and a wide range of datacenter cooling requirements.

SC12 Editorial Feature HPCwire Soundbite sponsored by ISC

HPC Job Bank


Featured Events


  • June 16, 2013 - June 20, 2013
    ISC'13
    Leipzig,
    Germany

  • June 17, 2013 - June 18, 2013
    Forecast 2013
    San Francisco, CA
    United States





HPCwire Events