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November 14, 2011
Molex Showcases HPC Interconnect Technology, Expertise at SC11
Company thought leaders showcase depth of knowledge with technical demonstrations, presentation and a range of products/solutions in Booth 4709
LISLE, Ill., Nov. 14 – Molex Incorporated will showcase its proven expertise in high-speed, high-density and high-signal integrity interconnect technology at Super Computing 2011, November 12 – 18, Seattle, WA. The company’s portfolio includes a wide range of products and solutions from electrical and fiber optic interconnects to switches and application tooling. In addition, company thought leaders will conduct ongoing product demonstrations in booth 4709 and Molex’s advanced technical market manager for industry standards, Jay Neer, will present a technical paper on Enhanced Thermal Solutions for 25 Gbps Pluggable I/Os on Wednesday, November 16, 2:00 p.m. in room WSCC 613/614.
Technical Paper Presentation
Wednesday, November 16, 2:00 p.m., room WSCC 613/614: Jay Neer will provide an overview of thermal solutions implemented on current 10 Gbps pluggable I/Os for the single channel (SFP+), quad channel (QSFP+) and 10/12 Channel (CXP) form factors, along with a snapshot of activities progressing within various organizations to address the additional cooling requirements that accompany next generation 25 Gbps interconnect solutions.
Products Showcased
Molex will have on display the following high-speed interconnect products and solutions:
- CMOS Photonics Based Connectivity Solutions: In a collaborative partnership with Luxtera, Molex recently demonstrated a 100 Gbps integrated optical transceiver. These CMOS silicon photonics chip-based devices and end-to-end systems will enable next generation 100 Gbps optical interconnect applications.
- Quad Small Form-factor Pluggable (QSFP+) QDR and FDR Active Optical Cable (AOC) Assemblies: Providing the longest link distance and lowest power consumption on the market today, the assemblies achieve 40 and 56 Gbps data rates over long reaches of up to 4 km (2.49 miles) using only 0.78 W per cable end.
- z-Quad Small Form-factor Pluggable Plus (zQSFP+) Interconnect Solution: Designed for next-generation high-density applications found in high performance computing, telecommunications, data networking, test and measurement and medical diagnostic equipment.
- iPass+™ (HSC) CXP Copper and Optical Systems: Enables twelve channels of 10 Gbps data for up to 120 Gbps of total bandwidth; with the enhanced-footprint integrated connectors enabling ten channels of 10 Gbps data, for up to 100 Gbps of total bandwidth.
- zSFP+ Connector Solutions: Supports 25 Gbps applications, with backward compatibility for 10 Gbps Ethernet and 16 Gbps Fiber Channel applications.
Product Demonstrations
The demonstrations will take place in Molex booth 4709 and showcase the company’s commitment to developing next-generation solutions for its customers:
- zQSFP+ 28 Gbps Demonstration: In partnership with Texas Instruments, Sanjay Gajendra, product marketing manager, will demonstrate Molex’s breakthrough 28 Gbps transmission technology over copper cables. This demonstration highlights the advanced signal conditioning performance of TI’s retimer technology and Molex’s zQSFP+ connectors, essential for enabling 100 Gbps interconnects.
- QSFP+ AOC Fourteen Data Rate (FDR) Demonstration: Adit Narasimha, manager, new product development, and Mehrdad Saberi, application engineering manager, will demonstrate the world’s first CMOS photonics based FDR QSFP AOC. FDR represents the next speed step in InfiniBand interconnects, providing 56 Gbps of total bandwidth. Molex’s AOCs have a reach of up to 4000 meters, greatly exceeding the reach of copper cables and competitive products while also achieving world class low power consumption of 1.1 W.
To receive information on other Molex products and industry solutions, please sign up for our e-nouncement newsletter at www.molex.com/link/register/.
About Molex Incorporated
Providing more than connectors, Molex delivers complete interconnect solutions for a number of markets including high performance computing, data communications, telecommunications, consumer electronics, industrial, automotive, medical, military, lighting and solar. Established in 1938, the company operates 39 manufacturing locations in 16 countries. The Molex website is www.molex.com. Follow us at www.twitter.com/molexconnectors, watch our videos at www.youtube.com/molexconnectors, connect with us at www.facebook.com/molexconnectors and read our blog at www.connector.com.
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Source: Molex
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