CSCS Top Right Frontpage
HPCwire

Since 1986 - Covering the Fastest Computers
in the World and the People Who Run Them

Language Flags

Visit additional Tabor Communication Publications

Datanami
Digital Manufacturing Report
HPC in the Cloud
Green Computing Report

Tabor Communications
Corporate Video

E4 Introduces the CARMA CLUSTER Powered by SECO


SCANDIANO, Nov. 12 – E4 Computer Engineering, Italian leading manufacturer for HPC environments, has announced the launch of a new series to add to its wide product portfolio, the CARMA cluster series powered by SECO.

The E4 CARMA cluster series powered by SECO offers a range of low-power, low-energy appliances designed to appeal to the HPC world thanks to the pairing of a heterogeneous ARM+GPU (NVIDIA Tegra 3 + Quadro GPU). In fact, with the present generation of ARM CPUs it is not possible to address algorithm based on Floating Points arithmetic, therefore most of scientific application are excluded. CUDA enabled Quadro GPU broadens the range of applications that can be addressed and gives huge boost to performance.

While ARM products are still currently limited by the 32-bit support, early adopters and developers need to start working on real systems to assess the capabilities of these high energy efficient solutions.

Leveraging the wide market adoption of the NVIDIA Tegra platform in the mobile space, E4 and SECO have delivered a real, cost effective and competitive server solution with immediate availability. The series is aimed to seismic processing, signal and image processing, video analytics, traffic analysis and many other applications. The range has two main platforms able to host carrier boards for Qseven modules, the CARMA microcluster and the CARMA cluster. The CARMA microcluster comes in a 5U form factor and contains up to 8 CARMA blades and 1 management node (x86 based) while the
CARMA cluster is a 3U appliance containing up to 12 CARMA2 blades (high density blades, each CARMA2 blades contains 2 CARMA nodes for a gross total of 2 ARM CPUs + 2 Quadro 1000) or 12 DARMA blades (4 ARM CPUs per blade). DARMA and CARMA2 can be mixed into the same chassis.

Also, all blades comply with Qseven standard, so the MB contains only I/O devices while the CPU component can be selected from a wide range of SoC options, in order to ensure a smooth and progressive transition from the x86 platform into the ARM environment. Qseven technology provides the highest flexibility while decreasing engineering costs, in fact the CPU architecture can be swappedre-using the same carrier board without any modification.

Launching the product at SC12 in Salt Lake City at the ARM’s stand (booth #122), E4 Computer Engineering is confident that the CARMA CLUSTER series powered by SECO will easily represent exciting news for the HPC community aiming to achieve great performance results with much less power consumption involved. “We felt an immediate connection with SECO in terms of experimentation and innovation,- said Simone Tinti, HPC Team Leader of E4 Computer Engineering- the CARMA DEV kit on which our series is based has proved to be one of the most interesting devices to create low power, low-energy high performance appliances which will be welcomed by all HPC users.”

About E4 Computer Engineering

E4 Computer Engineering: Workstations, server, storage and solution
Established in 2002, E4 Computer Engineering designs and manufactures high performance systems which aim to accomplish both industrial and scientific research requirements and to reach a variety of customers ranging from universities to computing centers. E4’s focus is on HPC although our expertise extends to all segments of IT. Thanks to the established experience and the outstanding quality of our solutions, E4 is acknowledged and appreciated as a valuable technology vendor by prestigious organizations like C.E.R.N.in Geneva. We design each system individually, after a thorough analysis of the customer’s requirements and we make avail of our strong and solid partnership with the most important technology vendors, to deliver highly personalized, cost effective and power saving solutions.

About SECO

SECO, world-leading company in electronic embedded solutions, over its 30 years of experience has shown the ability to adapt its know-how to new, challenging customers’ needs, and to provide cutting edge solutions to its partners.

On the strength of its know-how and in contrast with recent outsourcing policy, SECO has always set the entire production cycle in Italy, from the development stage to mass distribution. Thanks to new, innovative solutions and great research and design activities together with the partnership with major scientific Universities and worldwide leading companies, SECO went International becoming a global market-leading company providing solutions to modern challenges.

-----

Source: E4 Computer Engineering

Sponsored Links

High-Performance Computing in Action
Businesses that want to be on the cutting edge of their industries are increasingly turning to high-performance computing (HPC) solutions to handle complex compute processes and speed up their rate of innovation. Download this Executive Brief to see how businesses in energy, life sciences and entertainment put HPC solutions to work in their operations.

Webinar: Programming Heterogeneous X64+GPU Systems Using OpenACC
Join Michael Wolfe as he compares the advantages and costs of using both low-level models and the directive-based OpenACC model for programming accelerated heterogeneous systems. Registration is free.

Accelerate your science with Seneca
One of the first HPC providers installing a 4X NVIDIA Kepler K-20 cluster. Invites you to a free evaluation on Seneca’s NVIDIA K20 Kepler cluster, pre-loaded with AMBER, NAMD, LAMMPS

May 24, 2013

May 23, 2013

May 22, 2013

May 21, 2013

May 20, 2013

May 17, 2013

May 16, 2013

May 15, 2013

May 14, 2013

May 13, 2013


Most Read Features

Most Read Around the Web

Most Read This Just In

Cray CS300-LC

Feature Articles

Exascale Advocates Stand on Nuclear Stockpiles

In quieter times, sounding the bell of funding big science with big systems tends to resonate further than when ears are already burning with sour economic and national security news. For exascale's future, however, the time could be ripe to instill some sense of urgency....
Read more...

NSF Forges Further Beyond FLOPs

In a recent solicitation, the NSF laid out needs for furthering its scientific and engineering infrastructure with new tools to go beyond top performance, Having already delivered systems like Stampede and Blue Waters, they're turning an eye to solving data-intensive challenges. We spoke with the agency's Irene Qualters and Barry Schneider about..
Read more...

CERN, Google Drive Future of Global Science Initiatives

Large-scale, worldwide scientific initiatives rely on some cloud-based system to both coordinate efforts and manage computational efforts at peak times that cannot be contained within the combined in-house HPC resources. Last week at Google I/O, Brookhaven National Lab’s Sergey Panitkin discussed the role of the Google Compute Engine in providing computational support to ATLAS, a detector of high-energy particles at the Large Hadron Collider (LHC).
Read more...

Short Takes

NASA Builds 'Climate in a Box'

May 23, 2013 | The study of climate change is one of those scientific problems where it is almost essential to model the entire Earth to attain accurate results and make worthwhile predictions. In an attempt to make climate science more accessible to smaller research facilities, NASA introduced what they call ‘Climate in a Box,’ a system they note acts as a desktop supercomputer.
Read more...

Building Supercomputers with Raspberries

May 22, 2013 | At some point in the not-too-distant future, building powerful, miniature computing systems will be considered a hobby for high schoolers, just as robotics or even Lego-building are today. That could be made possible through recent advancements made with the Raspberry Pi computers.
Read more...

Running Computational Fluid Dynamics in the Cloud

May 16, 2013 | When it comes to cloud, long distances mean unacceptably high latencies. Researchers from the University of Bonn in Germany examined those latency issues of doing CFD modeling in the cloud by utilizing a common CFD and its utilization in HPC instance types including both CPU and GPU cores of Amazon EC2.
Read more...

Computing the Physics of Bubbles

May 15, 2013 | Supercomputers at the Department of Energy’s National Energy Research Scientific Computing Center (NERSC) have worked on important computational problems such as collapse of the atomic state, the optimization of chemical catalysts, and now modeling popping bubbles.
Read more...

Sponsored Whitepapers

Best Practices in Big Data Storage

05/10/2013 | Cleversafe, Cray, DDN, NetApp, & Panasas | From Wall Street to Hollywood, drug discovery to homeland security, companies and organizations of all sizes and stripes are coming face to face with the challenges – and opportunities – afforded by Big Data. Before anyone can utilize these extraordinary data repositories, however, they must first harness and manage their data stores, and do so utilizing technologies that underscore affordability, security, and scalability.

Progress in Parallel: the Bull Parallel Programming Center

04/15/2013 | Bull | “50% of HPC users say their largest jobs scale to 120 cores or less.” How about yours? Are your codes ready to take advantage of today’s and tomorrow’s ultra-parallel HPC systems? Download this White Paper by Analysts Intersect360 Research to see what Bull and Intel’s Center for Excellence in Parallel Programming can do for your codes.

Sponsored Multimedia

SGI DMF ZeroWatt Disk Solution

In this demonstration of SGI DMF ZeroWatt disk solution, Dr. Eng Lim Goh, SGI CTO, discusses a function of SGI DMF software to reduce costs and power consumption in an exascale (Big Data) storage datacenter.

Cray CS300-AC Cluster Supercomputer Air Cooling Technology Video

The Cray CS300-AC cluster supercomputer offers energy efficient, air-cooled design based on modular, industry-standard platforms featuring the latest processor and network technologies and a wide range of datacenter cooling requirements.

SC12 Editorial Feature HPCwire Soundbite sponsored by ISC

HPC Job Bank


Featured Events


  • June 16, 2013 - June 20, 2013
    ISC'13
    Leipzig,
    Germany

  • June 17, 2013 - June 18, 2013
    Forecast 2013
    San Francisco, CA
    United States





HPCwire Events