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March 15, 2013
March 15 — The increased density of electronic components and subsystems in military electronic systems exacerbates the thermal management challenges facing engineers. The military platforms that host these systems often cannot physically accommodate the large cooling systems needed for thermal management, meaning that heat can be a limiting factor for performance of electronics and embedded computers.
DARPA introduced the Intrachip/Interchip Enhanced Cooling (ICECool) program in June 2012 to explore ‘embedded’ thermal management. The premise of ICECool is to bring microfluidic cooling inside the substrate, chip or package, including thermal management in the earliest stages of electronics design. One track of the program, ICECool Fundamentals, has already begun basic research into microfabrication and evaporative cooling techniques. Under the new ICECool Applications Track, DARPA now seeks performers from the electronics and high-performance computing (HPC) communities to demonstrate microfluidic cooling in monolithic microwave integrated circuits (MMICs) and embedded HPC modules.
“DARPA wants two things from this solicitation: ICECool concepts and techniques that can be readily integrated into the commercial off-the-shelf supply chain, and development and implementation of electrical-thermal-mechanical co-design techniques,” said Avram Bar-Cohen, DARPA program manager. “To get there, we believe those already working with MMICs and HPC modules can add microfluidic cooling to established technologies. This is an open solicitation, and I encourage researchers within these communities and others to present their ideas.”
DARPA chose MMIC chips and HPC modules as demonstrators because of their military relevance and previous Agency work with these devices. Microfluidic cooling for RF MMIC power amplifiers has the potential to dramatically reduce the size, weight and power (SWaP) requirements for a variety of RF systems like radar, communications and electronic warfare. DARPA has previously supported work with gallium nitride, a wide-bandgap material used for MMIC chips. Intrachip/interchip cooling methods may now improve the efficiency and output power of these devices.
Microfluidic cooling is also sought for HPC systems such as embedded computers that may be used for fire control and on-board data processing and fusing; such applications are performed by SWaP-sensitive systems. The Agency hopes that the demonstration of new cooling methods will complement the development of embedded, energy-efficient computing devices and architectures that is under DARPA’s Power Efficiency Revolution for Embedded Computing Technologies (PERFECT) program.
In a recent solicitation, the NSF laid out needs for furthering its scientific and engineering infrastructure with new tools to go beyond top performance, Having already delivered systems like Stampede and Blue Waters, they're turning an eye to solving data-intensive challenges. We spoke with the agency's Irene Qualters and Barry Schneider about..
Large-scale, worldwide scientific initiatives rely on some cloud-based system to both coordinate efforts and manage computational efforts at peak times that cannot be contained within the combined in-house HPC resources. Last week at Google I/O, Brookhaven National Lab’s Sergey Panitkin discussed the role of the Google Compute Engine in providing computational support to ATLAS, a detector of high-energy particles at the Large Hadron Collider (LHC).
The Xeon Phi coprocessor might be the new kid on the high performance block, but out of all first-rate kickers of the Intel tires, the Texas Advanced Computing Center (TACC) got the first real jab with its new top ten Stampede system.We talk with the center's Karl Schultz about the challenges of programming for Phi--but more specifically, the optimization...
May 22, 2013 |
At some point in the not-too-distant future, building powerful, miniature computing systems will be considered a hobby for high schoolers, just as robotics or even Lego-building are today. That could be made possible through recent advancements made with the Raspberry Pi computers.
May 16, 2013 |
When it comes to cloud, long distances mean unacceptably high latencies. Researchers from the University of Bonn in Germany examined those latency issues of doing CFD modeling in the cloud by utilizing a common CFD and its utilization in HPC instance types including both CPU and GPU cores of Amazon EC2.
May 15, 2013 |
Supercomputers at the Department of Energy’s National Energy Research Scientific Computing Center (NERSC) have worked on important computational problems such as collapse of the atomic state, the optimization of chemical catalysts, and now modeling popping bubbles.
May 10, 2013 |
Program provides cash awards up to $10,000 for the best open-source end-user applications deployed on 100G network.
May 09, 2013 |
The Japanese government has revealed its plans to best its previous K Computer efforts with what they hope will be the first exascale system...
05/10/2013 | Cleversafe, Cray, DDN, NetApp, & Panasas | From Wall Street to Hollywood, drug discovery to homeland security, companies and organizations of all sizes and stripes are coming face to face with the challenges – and opportunities – afforded by Big Data. Before anyone can utilize these extraordinary data repositories, however, they must first harness and manage their data stores, and do so utilizing technologies that underscore affordability, security, and scalability.
04/15/2013 | Bull | “50% of HPC users say their largest jobs scale to 120 cores or less.” How about yours? Are your codes ready to take advantage of today’s and tomorrow’s ultra-parallel HPC systems? Download this White Paper by Analysts Intersect360 Research to see what Bull and Intel’s Center for Excellence in Parallel Programming can do for your codes.
In this demonstration of SGI DMF ZeroWatt disk solution, Dr. Eng Lim Goh, SGI CTO, discusses a function of SGI DMF software to reduce costs and power consumption in an exascale (Big Data) storage datacenter.
The Cray CS300-AC cluster supercomputer offers energy efficient, air-cooled design based on modular, industry-standard platforms featuring the latest processor and network technologies and a wide range of datacenter cooling requirements.