SAN JOSE, Calif., April 27 — Super Micro Computer, Inc., a global leader in high-performance, high-efficiency server, storage technology and green computing announces its investor relations schedule for upcoming non deal roadshows and conferences.
April 28 – April 30, Howard Hideshima, CFO, and Perry Hayes, SVP, will represent Supermicro for individual investor meetings in Houston, Dallas, Kansas City, and Chicago hosted by Sterne Agee CRT.
May 6 – May 8, Howard Hideshima, CFO, and Perry Hayes, SVP, will represent Supermicro for individual investor meetings in New York and Boston hosted by Susquehanna International Group.
May 12 – 13, Howard Hideshima, CFO, and Perry Hayes, SVP, will represent Supermicro for individual investor meetings in Milwaukee and Minneapolis hosted by Stifel Nicolaus.
May 20, Howard Hideshima, CFO, and Perry Hayes, SVP, will represent Supermicro for individual investor meetings in London hosted by Sterne Agee CRT.
May 27, Howard Hideshima, CFO, and Perry Hayes, SVP, will represent Supermicro at the DA Davidson Technology Conference in New York and will meet with individual investors.
May 28, Howard Hideshima, CFO, and Perry Hayes, SVP, will represent Supermicro for individual investor meetings in New York hosted by Needham & Co.
June 4, Howard Hideshima, CFO, and Perry Hayes, SVP, will represent Supermicro for a presentation and meetings with individual investors in Boston at the Three Part Advisors’ East Coast Ideas Conference.
June 12, Howard Hideshima, CFO, and Perry Hayes, SVP, will represent Supermicro for individual investor meetings in San Francisco hosted by Needham & Co.
Visit www.supermicro.com for additional product information.
About Super Micro Computer, Inc.
Supermicro, a global leader in high-performance, high-efficiency server technology and innovation is a premier provider of end-to-end green computing solutions for Data Center, Cloud Computing, Enterprise IT, Hadoop/Big Data, HPC and Embedded Systems worldwide. Supermicro’s advanced Server Building Block Solutions offer a vast array of components for building energy-efficient, application-optimized, computing solutions. Architecture innovations include Twin, TwinPro, FatTwin, Ultra, MicroCloud, MicroBlade, SuperBlade, Double-Sided Storage, Battery Backup Power (BBP) modules and WIO/UIO.
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Source: Super Micro Computer, Inc.