The Leading Source for Global News and Information Covering the Ecosystem of High Productivity Computing
October 27, 2006
AMD has completed its approximately $5.4 billion acquisition of ATI Technologies Inc. With approximately 15,000 employees, the company merges AMD's microprocessor technology with ATI's expertise in graphics, chipsets and consumer electronics products.
"Today marks a historic day for our employees, our partners and our customers as we officially welcome ATI into the AMD family," said AMD Chairman and CEO Hector Ruiz. "On day one, we are delivering a winning set of complementary technologies, igniting a new level of innovation and continuing to champion choice for the industry. Thanks to the strength of our talented employees, the new AMD now has a full range of intellectual property (IP) in microprocessors, graphics, chipsets and consumer electronics to deliver open platforms and integrated solutions. In the near term, customers gain a new level of choice, and in the long term, we believe the possibilities for innovation are truly limitless."
Under the terms of the transaction, AMD acquired all of the outstanding common shares of ATI for a combination of approximately $4.3 billion in cash and 58 million shares of AMD common stock, based on the number of shares of ATI common stock outstanding on October 24, 2006. All outstanding options and restricted stock units (RSUs) of ATI were assumed. The value of the ATI acquisition of approximately $5.4 billion is based upon the closing stock price of AMD common stock on October 24, 2006 of $20.32 per share and excludes the value of assumed equity awards. AMD financed the cash portion of the transaction with a combination of cash and new debt. AMD obtained a $2.5 billion term loan from Morgan Stanley Senior Funding, Inc., which, together with combined existing cash, cash equivalents, and marketable securities balances of approximately $1.8 billion, provided full funding for the transaction.
AMD's and ATI's combined platform development and technical support teams will be co-located in Taipei and Shanghai. Combined with the existing Austin and Toronto locations, these sites offer research and development and customer support.
AMD plans to deliver a range of integrated platforms in 2007 to serve key markets, including: commercial clients; mobile computing; and gaming and media computing. PC users will benefit from innovations intended to extend battery life on the next-generation AMD Turion 64 mobile technology-based platform and enhancements to the AMD LIVE! digital media PC platform. AMD believes that these integrated platform innovations will bring customers improved system stability, better time-to-market, increased performance and energy-efficiency and overall, an enhanced user experience.
"By driving innovation and integration in processing, especially in graphics, the new AMD has the potential to empower breakthrough computing experiences for users of Windows Vista," said Jim Allchin, co-president of Microsoft's Platforms & Services Division. "We are excited by the potential benefits that this union can bring to enhance the Windows Vista experience."
AMD also sees an opportunity to deliver processing solutions to the growing consumer electronics market. The company intends to leverage ATI's strength in the consumer market by pursuing new opportunities to invest in the consumer electronics and high-end discrete graphics markets. With leading technology and customer relationships, AMD is positioned to address digital convergence by leveraging critical IP to create new innovations and devices that facilitate end-to-end content delivery and connectivity to improve end-user experiences.
In addition, AMD plans to create a new class of x86 processor that integrates the central processing unit (CPU) and graphics processing unit (GPU) at the silicon level with a broad set of design initiatives collectively codenamed "Fusion." AMD intends to design Fusion processors to provide step-function increases in performance-per-watt relative to today's CPU-only architectures, and to provide the best customer experience in a world increasingly reliant upon 3D graphics, digital media and high performance computing. With Fusion processors, AMD will continue to promote an open platform and encourage companies throughout the ecosystem to create new co-processing solutions aimed at further optimizing specific workloads. AMD-powered Fusion platforms will continue to support high-end discrete graphics, physics accelerators, and other PCI Express-based solutions to meet the increasing needs of the most demanding enthusiast end-users.
"With the anticipated launch of Windows Vista, robust 3D graphics, digital media and device convergence are driving the need for greater performance, graphics capabilities, and battery life," said Phil Hester, AMD senior vice president and chief technology officer. "In this increasingly diverse x86 computing environment, simply adding more CPU cores to a baseline architecture will not be enough. As x86 scales from palmtops to petaflops, modular processor designs leveraging both CPU and GPU compute capabilities will be essential in meeting the requirements of computing in 2008 and beyond."
Fusion processors are expected in late 2008/early 2009, and the company expects to use them within all of the company's priority computing categories, including laptops, desktops, workstations and servers, as well as in consumer electronics and solutions tailored for the unique needs of emerging markets.
(Digg, Technorati, more)
PGI Accelerator™ Fortran 95/03 and C99 compilers for x64+NVIDIA
Accelerate applications on x64+GPU platforms by adding OpenMP-like compiler directives to existing Fortran and C programs. Available now for Linux, MacOS and Windows. Download a free 15 day trial.
Platform HPC Workgroup Manager
Platform HPC Workgroup Manager integrates all the cluster productivity tools you need to deploy, run and manage your HPC environment.
C-DAC announces plans for a petaflop system; IBM researchers are working on vertical integration techniques to extend Moore's Law another 15 years. We recap those stories and more in our weekly wrapup.
Read More...
The Moscow State University supercomputer, Lomonosov, has been selected for a high-performance makeover, with the goal of tripling its processing power to achieve petaflop-level performance in 2010. T-Platforms, who developed and manufactured the supercomputer, is the odds-on favorite to lead the project.
Read More...
Right on schedule, Intel has launched its Xeon 5600 processors, codenamed "Westmere EP." The 5600 represents the 32nm sequel to the Xeon 5500 (Nehalem EP) for dual-socket servers. Intel is touting better performance and energy efficiency, along with new security features, as the big selling points of the new Xeons.
Read More...
Mar 19 | OfficialWire | New super to support intelligence work Down Under. Read more...
Mar 18 | ChannelWeb | Westmere parts already showing up in HPC machines. Read more...
Mar 17 | The Register | But what about the tier ones? Read more...
Mar 17 | Cadalyst Magazine | A new generation of workstations is changing the nature of technical computing. Read more...
Mar 17 | Linux Magazine | Latest iteration of Sun Grid Engine able to tap into Cloud. Read more...
Jan 12 | | In-depth look at vSMP Foundation server virtualization technology, technical implementation, use cases and capabilities. The technical whitepaper provides an architectural overview and details on the three vSMP Foundation products: vSMP Foundation for SMP, vSMP Foundation for Cluster and vSMP Foundation for Cloud.
Jan 18 | | This white paper discusses Gore’s copper cable assemblies, and how they continue to exceed the standards for providing reliable, cost-effective solutions for high-performance computer applications.
Join this online panel discussion for live Q&A with leading industry experts, analysts, and end-users to discuss the latest innovations, best practices, barriers to implementation, and measurable benefits of server virtualization with a particular focus on today's real world solutions.
Learn about scalable fault-tolerant architectures and examples of energy efficient and scalable supercomputing clusters using dual QDR InfiniBand to combine capacity computing with network failover capabilities with the help of programming languages such as MPI and a robust Linux cluster management package.
LIVE@SCO9: The IBM team discusses new innovations in hardware, software and services that help clients better understand their workloads and get insight from their R&D efforts. Technology demonstrations include the soon-to-be-released Power7 HPC processor, the DCS990 system with 2.4 petabytes of storage, the xCAT management tool, secure HPC cloud computing and more. Winners of two HPCwire Readers' and Editors’ Choice Awards! Take the IBM virtual tour at SC09 or more information go online to: http://www-03.ibm.com/systems/deepcomputing/sc09.html