Tag: 3D chips
As transistors approach the limits of miniaturization, the rapid pace of progress in the microprocessor industry is destined to start declining unless researchers are successful in innovating alternative designs. The best and brightest minds of our time are hard at work developing the next generation of microprocessors so essential to supercomputers, handheld devices and worldwide Read more…
<img style=”float: left;” src=”http://media2.hpcwire.com/hpcwire/HP_Corona_graphic.bmp” alt=”” width=”109″ height=”95″ />In high performance computing, Hewlett-Packard is best known for supplying bread-and-butter HPC systems, built with standard processors and interconnects. But the company’s research arm has been devising a manycore chipset, which would outrun the average-sized HPC cluster of today. The design represents a radical leap in performance, and if implemented, would fulfill the promise of exascale computing.
The Weekly Top Five features the five biggest HPC stories of the week, condensed for your reading pleasure. This week, we cover ISRO’s newest supercomputer; Tokyo Tech’s selection of EM Photonics’ CULA library; Intel’s 3-D transistor breakthrough; the latest LSF Tools from Platform Computing; and SciNet’s new NextIO GPU-based system.
Three-dimensional chip stacking beings path to commercialization.