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Intel Weaves Strategy To Put Interconnect Fabrics On Chip

Sep 10, 2012 |

<img style=”float: left;” src=”http://media2.hpcwire.com/hpcwire/computer_chips_on_die_small.jpg” alt=”” width=”94″ height=”85″ />Intel has begun to formulate a strategy that will integrate fabric controllers with its server processors. According to Raj Hazra, general manager of the Technical Computing unit at Intel, the company is planning to use the recently acquired IP from Cray, QLogic and Fulcrum to deliver chips that put what is essentially a NIC onto the processor die. In a recent conversation with Hazra, he outlined their new fabric interconnect strategy.