Tag: Hot Interconnects
<img style=”float: left;” src=”http://media2.hpcwire.com/hpcwire/HOTI_logo.bmp” alt=”” width=”140″ height=”80″ />This August, the IEEE is hosting its annual symposium on high-performance interconnects, known as Hot Interconnects. Now in its 20th year, the event focuses on the latest developments in the field with a special emphasis on how the technology is advancing in the realm of supercomputing and large-scale datacenters. The event covers both chip-to-chip interconnects as well as networking fabrics that bind whole systems and datacenters together.
IEEE’s Hot Interconnects symposium that kicks off later this month should be a real treat for the HPC crowd. The event focuses exclusively on cutting-edge developments in the interconnect arena, everything from the latest commodity networking technologies to the K supercomputer’s “Tofu” custom network. We asked the technical chairs of the event to share their perspectives on the commodity-proprietary interconnect dichotomy in high performance computing and in the industry at large.