<img style=”float: left;” src=”http://media2.hpcwire.com/hpcwire/PLX_logo.bmp” alt=”” width=”97″ height=”54″ />PLX Technology, a maker of PCIe switches and bridges, has been spreading the word about using PCIe as a general-purpose HPC interconnect. At SC12 this week, the company went a little further down that path, unveiling their upcoming Express Fabric technology. We asked Vijay Meduri, executive vice president of engineering at PLX to talk about the rationale of using PCIe as an interconnect fabric.
Enterprise SSD maker Texas Memory Systems (TMS) has been kicking up some dust lately, announcing record-breaking performance results with its RamSan-630 product and launching its latest PCIe flash offering. Specifically, TMS recently put up some rather impressive numbers in two key benchmarks established by the Storage Performance Council. And then this week, the company introduced its next-generation PCIe flash memory product, the RamSan-70.
In high-speed computing (HPC), there are a number of significant benefits to simplifying the processor interconnect in rack- and chassis-based servers by designing in PCI Express (PCIe). The PCI-SIG, the group responsible for the conventional PCI and the much-higher-performance PCIe standards, has released three generations of PCIe specifications over the last eight years and is fully expected to continue this progression in the future with even newer generations, from which HPC systems will continue to see newer features, faster data throughput and improved reliability.
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