The Week in Review

By HPCwire Staff

November 12, 2009

Here is a collection of highlights from this week’s news stream as reported by HPCwire.

PGI Release 2010 Includes Support for GPUs

Adaptive Computing Partners with ScaleMP

Cray Launches Integrated Workstation/Cluster

Appro to Support AMD’s ‘Maranello’ Server Platform

Allinea Demonstrates Scalable Debugging to 220,000 Cores

Ranger Surpasses 1.1M Jobs in Less Than 2 Years

Kazakhstan Shows Interest in Russian Supercomputer Technology

Prometheus Alliance Launched to Accelerate Adoption of Bioinformatics Appliances

U of Delaware to Acquire HPC Cluster for Computational Chemistry Research

Platform ISF Available for Managing Private Clouds

Spectra Logic Introduces T-Finity Library

FPGA Cluster Accelerates Bioinformatics Application by 5000X

Bright Computing Signs Agreement with Novell

Wipro Supports Migration to Windows HPC Server

OSC, Nimbis Services Intro E-Commerce Portal

Nimbis Services and the folks from Ohio Supercomputer Center have introduced an e-commerce service that allows underserved companies to purchase time on OSC’s Blue Collar system by way of Nimbis’ Web portal.

A recent study performed by the Council on Competiveness (CoC) found that many US companies don’t have the means to access necessary modeling and simulation resources, leaving them at a competitive disadvantage. This so called “HPC Gap” is remedied by making HPC services easier-to-access, without the need to make an outlay expenditure for expensive computing equipment and without having to form direct partnerships with an HPC provider. Nimbis’ Web portal streamlines the process, making it easier for companies to access the resources they need.

From the release:

Computational technologies provide companies with innovative tools that allow for the virtual development of new and improved products, such as cars, pharmaceuticals and financial products. Virtual modeling and simulation also provide companies with a competitive edge through improved manufacturing process design to bring products to market quicker, reducing development time, cost and labor. Simulation makes choosing between alternative processing methods far easier.

Accessing the proper computational resources can increase efficiency and productivity — providing a competitive edge and profitable bottom line. Such a service is not only beneficial for the companies involved, but has the potential to be an economic stimulator for the entire region.

Says Ashok Krishnamurthy, Ph.D., director of research at the Ohio Supercomputer Center, “We intend for this e-commerce interface to offer many manufacturing companies with a digital ‘one-stop’ shop for their computational and software needs. OSC becomes an economic driver by bringing in companies with domain expertise, a practice we instituted with Blue Collar Computing web portals.”

Interested companies can purchase packages of HPC resources at Nimbis’ website, where they can also get in touch with expert computational consultants.

Fin-Shaped Transistors Pave Way for Faster Chips

Purdue University this week announced some progress in finFET transistor technology. FinFET refers to a multigate transistor architecture that uses a fin-shaped conducting channel made of indium-gallium-arsenide. The technology has the potential to shrink transistor sizes below what would be possible with conventional silicon-based semiconductors, thus continuing to meet our demand for faster, more compact computer chips.

But at smaller transistor geometries, there’s still a problem with electrical leakage.  Take it away Purdue:

One potential solution to this leaking problem is to replace silicon dioxide with materials that have a higher insulating value, or “dielectric constant,” such as hafnium dioxide or aluminum oxide.

The Purdue research team has done so, creating finFETs that incorporate the indium-gallium-arsenide fin with a so-called “high-k” insulator. Previous attempts to use indium-gallium-arsenide finFETs to make devices have failed because too much current leaks from the circuit.

The researchers are the first to “grow” hafnium dioxide onto finFETs made of a III-V material using atomic layer deposition. The approach could make it possible to create transistors using the thinnest insulating layers possible – only a single atomic layer thick.

If successful, the technology could make sub-22nm transistors possible, thus keeping Moore’s Law alive beyond 2015.

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industy updates delivered to you every week!

Dell Strikes Reseller Deal with Atos; Supplants SGI

August 22, 2017

Dell EMC and Atos announced a reseller deal today in which Dell will offer Atos’ high-end 8- and 16-socket Bullion servers. Some move from Dell had been expected following Hewlett Packard Enterprise’s purchase of SGI Read more…

By John Russell

Glimpses of Today’s Total Solar Eclipse

August 21, 2017

Here are a few arresting images posted by NASA of today’s total solar eclipse. Such astronomical events have always captured our imagination and it’s not hard to understand why such occurrences were often greeted wit Read more…

By John Russell

Tech Giants Outline Battle Plans for Future HPC Market

August 21, 2017

Four companies engaged in a cage fight for leadership in the emerging HPC market of the 2020s are, despite deep differences in some areas, in violent agreement on at least one thing: the power consumption and latency pen Read more…

By Doug Black

HPE Extreme Performance Solutions

Leveraging Deep Learning for Fraud Detection

Advancements in computing technologies and the expanding use of e-commerce platforms have dramatically increased the risk of fraud for financial services companies and their customers. Read more…

Geospatial Data Research Leverages GPUs

August 17, 2017

MapD Technologies, the GPU-accelerated database specialist, said it is working with university researchers on leveraging graphics processors to advance geospatial analytics. The San Francisco-based company is collabor Read more…

By George Leopold

Tech Giants Outline Battle Plans for Future HPC Market

August 21, 2017

Four companies engaged in a cage fight for leadership in the emerging HPC market of the 2020s are, despite deep differences in some areas, in violent agreement Read more…

By Doug Black

Microsoft Bolsters Azure With Cloud HPC Deal

August 15, 2017

Microsoft has acquired cloud computing software vendor Cycle Computing in a move designed to bring orchestration tools along with high-end computing access capabilities to the cloud. Terms of the acquisition were not disclosed. Read more…

By George Leopold

HPE Ships Supercomputer to Space Station, Final Destination Mars

August 14, 2017

With a manned mission to Mars on the horizon, the demand for space-based supercomputing is at hand. Today HPE and NASA sent the first off-the-shelf HPC system i Read more…

By Tiffany Trader

AMD EPYC Video Takes Aim at Intel’s Broadwell

August 14, 2017

Let the benchmarking begin. Last week, AMD posted a YouTube video in which one of its EPYC-based systems outperformed a ‘comparable’ Intel Broadwell-based s Read more…

By John Russell

Deep Learning Thrives in Cancer Moonshot

August 8, 2017

The U.S. War on Cancer, certainly a worthy cause, is a collection of programs stretching back more than 40 years and abiding under many banners. The latest is t Read more…

By John Russell

IBM Raises the Bar for Distributed Deep Learning

August 8, 2017

IBM is announcing today an enhancement to its PowerAI software platform aimed at facilitating the practical scaling of AI models on today’s fastest GPUs. Scal Read more…

By Tiffany Trader

IBM Storage Breakthrough Paves Way for 330TB Tape Cartridges

August 3, 2017

IBM announced yesterday a new record for magnetic tape storage that it says will keep tape storage density on a Moore's law-like path far into the next decade. Read more…

By Tiffany Trader

AMD Stuffs a Petaflops of Machine Intelligence into 20-Node Rack

August 1, 2017

With its Radeon “Vega” Instinct datacenter GPUs and EPYC “Naples” server chips entering the market this summer, AMD has positioned itself for a two-head Read more…

By Tiffany Trader

How ‘Knights Mill’ Gets Its Deep Learning Flops

June 22, 2017

Intel, the subject of much speculation regarding the delayed, rewritten or potentially canceled “Aurora” contract (the Argonne Lab part of the CORAL “ Read more…

By Tiffany Trader

Nvidia’s Mammoth Volta GPU Aims High for AI, HPC

May 10, 2017

At Nvidia's GPU Technology Conference (GTC17) in San Jose, Calif., this morning, CEO Jensen Huang announced the company's much-anticipated Volta architecture a Read more…

By Tiffany Trader

Reinders: “AVX-512 May Be a Hidden Gem” in Intel Xeon Scalable Processors

June 29, 2017

Imagine if we could use vector processing on something other than just floating point problems.  Today, GPUs and CPUs work tirelessly to accelerate algorithms Read more…

By James Reinders

Russian Researchers Claim First Quantum-Safe Blockchain

May 25, 2017

The Russian Quantum Center today announced it has overcome the threat of quantum cryptography by creating the first quantum-safe blockchain, securing cryptocurrencies like Bitcoin, along with classified government communications and other sensitive digital transfers. Read more…

By Doug Black

Quantum Bits: D-Wave and VW; Google Quantum Lab; IBM Expands Access

March 21, 2017

For a technology that’s usually characterized as far off and in a distant galaxy, quantum computing has been steadily picking up steam. Just how close real-wo Read more…

By John Russell

Nvidia Responds to Google TPU Benchmarking

April 10, 2017

Nvidia highlights strengths of its newest GPU silicon in response to Google's report on the performance and energy advantages of its custom tensor processor. Read more…

By Tiffany Trader

Groq This: New AI Chips to Give GPUs a Run for Deep Learning Money

April 24, 2017

CPUs and GPUs, move over. Thanks to recent revelations surrounding Google’s new Tensor Processing Unit (TPU), the computing world appears to be on the cusp of Read more…

By Alex Woodie

HPC Compiler Company PathScale Seeks Life Raft

March 23, 2017

HPCwire has learned that HPC compiler company PathScale has fallen on difficult times and is asking the community for help or actively seeking a buyer for its a Read more…

By Tiffany Trader

Leading Solution Providers

Trump Budget Targets NIH, DOE, and EPA; No Mention of NSF

March 16, 2017

President Trump’s proposed U.S. fiscal 2018 budget issued today sharply cuts science spending while bolstering military spending as he promised during the cam Read more…

By John Russell

Google Debuts TPU v2 and will Add to Google Cloud

May 25, 2017

Not long after stirring attention in the deep learning/AI community by revealing the details of its Tensor Processing Unit (TPU), Google last week announced the Read more…

By John Russell

CPU-based Visualization Positions for Exascale Supercomputing

March 16, 2017

In this contributed perspective piece, Intel’s Jim Jeffers makes the case that CPU-based visualization is now widely adopted and as such is no longer a contrarian view, but is rather an exascale requirement. Read more…

By Jim Jeffers, Principal Engineer and Engineering Leader, Intel

Six Exascale PathForward Vendors Selected; DoE Providing $258M

June 15, 2017

The much-anticipated PathForward awards for hardware R&D in support of the Exascale Computing Project were announced today with six vendors selected – AMD Read more…

By John Russell

Top500 Results: Latest List Trends and What’s in Store

June 19, 2017

Greetings from Frankfurt and the 2017 International Supercomputing Conference where the latest Top500 list has just been revealed. Although there were no major Read more…

By Tiffany Trader

IBM Clears Path to 5nm with Silicon Nanosheets

June 5, 2017

Two years since announcing the industry’s first 7nm node test chip, IBM and its research alliance partners GlobalFoundries and Samsung have developed a proces Read more…

By Tiffany Trader

Messina Update: The US Path to Exascale in 16 Slides

April 26, 2017

Paul Messina, director of the U.S. Exascale Computing Project, provided a wide-ranging review of ECP’s evolving plans last week at the HPC User Forum. Read more…

By John Russell

Graphcore Readies Launch of 16nm Colossus-IPU Chip

July 20, 2017

A second $30 million funding round for U.K. AI chip developer Graphcore sets up the company to go to market with its “intelligent processing unit” (IPU) in Read more…

By Tiffany Trader

  • arrow
  • Click Here for More Headlines
  • arrow
Share This