Volta Adds Charge to GPU Roadmap

By Nicole Hemsoth

March 21, 2013

When it comes to the future of GPU computing, NVIDIA CEO Jen-Hsun Huang said during this week’s GTC keynote that the emphasis will be on blending general computing, physics and simulation into one high performance yet energy-efficient package.

According to Huang, the next generation of both data- and compute-intensive apps will require higher performance to meet real-time demands. On the other end, this all has to happen within an energy consumption framework that doesn’t obliterate the ROI of spicing up a datacenter with GPU acceleration.

Outside of these higher-level focal points, other issues, including snappy access to high memory bandwidth, were cited as critical to growing the GPU user ranks. Memory and power will become even more relevant as data volume and velocity requirements expand into new application areas that are reliant on memory maximization without breaking the power consumption bank. These are among some of the identified “big data” problems NVIDIA is seeking to address for both its research and enterprise users.

While “Maxwell” is still sitting on the sidelines until later this year, Huang said the unified virtual memory approach extends Kepler’s forked focus on power, performance and programmability for the present. The newest addition to the GPU ranks is called “Volta,” which when released in the expected 2016 range, will take the three “P” aspects one step further by stepping up to a stacked memory approach.

In essence, with Volta, they’re removing the power hop of getting off the chip and onto DRAM – instead, as the name implies, they’re going to literally stack the DRAM onto the substrate, pierce through them from top to bottom to connect the stacked memories. While the notion of stacked memory isn’t necessarily new, it is still maturing – and NVIDIA sees serious potential.

The promise of Volta is two-fold – on the one hand, it will represent a big step toward practical stacked memory, something that former Cray wizard and current NVIDIA CTO on the Tesla side, Steve Scott, thinks is not yet ready for primetime. During our chat following the keynote, he said that while there are some noteworthy attempts at bringing stacked memory to market from companies like Micron, there are some serious engineering hurdles left to leap (packaging, capacities, degree of routing needed, etc.).

On the secondary side, anything that can be done to minimize one of the real costs of both performance and energy is data movement. Scott noted that Volta, and also Maxwell to a great degree, derive their energy efficiency by tightening up how far data travels. It’s not hard to see how stacking the package could enhance this efficiency focus – not to mention produce some rather stunning bandwidth.

While current generation GPUs’ bandwidth is higher than with a CPU, it’s still never quite at the level users will want. But NVIDIA claims that once Volta rolls out they’ll be able to boast 1 terabyte per second – the equivalent, as Huang described, of loading an entire Blueray into memory and running it through the chip in 1/50 of a second.

As Scott described, NVIDIA sees the need to “find ways to make more of our memory accesses – to work toward memory structures that take less energy to access.” As he noted, that’s where stacked memory comes in: “you can take 3D stacked memory technology and get much better bandwidth at much lower energy per bit to access memory from these 3D stacks than to go to main memory.” This idea is doubtlessly simple, he says, however the technology hasn’t even begun to round the bend to readiness.

There are still considerations to make in terms of tradeoffs. While latency isn’t much different in this projected new sibling to the NVIDIA GPU family, the on-package memory will be smaller, more expensive, but really high bandwidth and lower energy. It’s good that it’s high bandwidth and low energy but the smaller and more expensive part is tough. Scott says they’re looking to address that, but these are considerations for the coming decade.

Almost all HPC applications will be able to take advantage of a stacked memory offering, just as they can with cache today. As Scott described, “you still have your main memory where most of your data sits but you have some kernel that’s operating on some working set and you can usually block it so that you can put a chunk of data in the near memory and access it multiple times.” There are a few problems that won’t fit nicely in this paradigm, but these are already ones that have a hard time making top use of memory to begin with – a prime example is a graph problem since it lacks a great degree of locality.

The section where Huang talks about the roadmap and provides some visual details is below.

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industy updates delivered to you every week!

Battle Brews over Trump Intentions for Funding Science

February 27, 2017

The battle over science funding – how much and for what kinds of science – Read more…

By John Russell

Google Gets First Dibs on New Skylake Chips

February 27, 2017

As part of an ongoing effort to differentiate its public cloud services, Google made good this week on its intention to bring custom Xeon Skylake chips from Intel Corp. Read more…

By George Leopold

Thomas Sterling on CREST and Academia’s Role in HPC Research

February 27, 2017

The US advances in high performance computing over many decades have been a product of the combined engagement of research centers in industry, government labs, and academia. Read more…

By Thomas Sterling, Indiana University

Advancing Modular Supercomputing with DEEP and DEEP-ER Architectures

February 24, 2017

Knowing that the jump to exascale will require novel architectural approaches capable of delivering dramatic efficiency and performance gains, researchers around the world are hard at work on next-generation HPC systems. Read more…

By Sean Thielen

HPE Extreme Performance Solutions

Manufacturers Reaping the Benefits of Remote Visualization

Today’s manufacturers are operating in an ever-changing atmosphere, and finding new ways to boost productivity has never been more vital.

This is why manufacturers are ramping up their investments in high performance computing (HPC), a trend which has helped give rise to the “connected factory” and Industrial Internet of Things (IIoT) concepts that are proliferating throughout the industry today. Read more…

Weekly Twitter Roundup (Feb. 23, 2017)

February 23, 2017

Here at HPCwire, we aim to keep the HPC community apprised of the most relevant and interesting news items that get tweeted throughout the week. Read more…

By Thomas Ayres

HPE Server Shows Low Latency on STAC-N1 Test

February 22, 2017

The performance of trade and match servers can be a critical differentiator for financial trading houses. Read more…

By John Russell

HPC Financial Update (Feb. 2017)

February 22, 2017

In this recurring feature, we’ll provide you with financial highlights from companies in the HPC industry. Check back in regularly for an updated list with the most pertinent fiscal information. Read more…

By Thomas Ayres

Rethinking HPC Platforms for ‘Second Gen’ Applications

February 22, 2017

Just what constitutes HPC and how best to support it is a keen topic currently. Read more…

By John Russell

Thomas Sterling on CREST and Academia’s Role in HPC Research

February 27, 2017

The US advances in high performance computing over many decades have been a product of the combined engagement of research centers in industry, government labs, and academia. Read more…

By Thomas Sterling, Indiana University

Advancing Modular Supercomputing with DEEP and DEEP-ER Architectures

February 24, 2017

Knowing that the jump to exascale will require novel architectural approaches capable of delivering dramatic efficiency and performance gains, researchers around the world are hard at work on next-generation HPC systems. Read more…

By Sean Thielen

HPC Technique Propels Deep Learning at Scale

February 21, 2017

Researchers from Baidu’s Silicon Valley AI Lab (SVAIL) have adapted a well-known HPC communication technique to boost the speed and scale of their neural network training and now they are sharing their implementation with the larger deep learning community. Read more…

By Tiffany Trader

IDC: Will the Real Exascale Race Please Stand Up?

February 21, 2017

So the exascale race is on. And lots of organizations are in the pack. Government announcements from the US, China, India, Japan, and the EU indicate that they are working hard to make it happen – some sooner, some later. Read more…

By Bob Sorensen, IDC

TSUBAME3.0 Points to Future HPE Pascal-NVLink-OPA Server

February 17, 2017

Since our initial coverage of the TSUBAME3.0 supercomputer yesterday, more details have come to light on this innovative project. Of particular interest is a new board design for NVLink-equipped Pascal P100 GPUs that will create another entrant to the space currently occupied by Nvidia's DGX-1 system, IBM's "Minsky" platform and the Supermicro SuperServer (1028GQ-TXR). Read more…

By Tiffany Trader

Tokyo Tech’s TSUBAME3.0 Will Be First HPE-SGI Super

February 16, 2017

In a press event Friday afternoon local time in Japan, Tokyo Institute of Technology (Tokyo Tech) announced its plans for the TSUBAME3.0 supercomputer, which will be Japan’s “fastest AI supercomputer,” Read more…

By Tiffany Trader

Drug Developers Use Google Cloud HPC in the Fight Against ALS

February 16, 2017

Within the haystack of a lethal disease such as ALS (amyotrophic lateral sclerosis / Lou Gehrig’s Disease) there exists, somewhere, the needle that will pierce this therapy-resistant affliction. Read more…

By Doug Black

Azure Edges AWS in Linpack Benchmark Study

February 15, 2017

The “when will clouds be ready for HPC” question has ebbed and flowed for years. Read more…

By John Russell

For IBM/OpenPOWER: Success in 2017 = (Volume) Sales

January 11, 2017

To a large degree IBM and the OpenPOWER Foundation have done what they said they would – assembling a substantial and growing ecosystem and bringing Power-based products to market, all in about three years. Read more…

By John Russell

US, China Vie for Supercomputing Supremacy

November 14, 2016

The 48th edition of the TOP500 list is fresh off the presses and while there is no new number one system, as previously teased by China, there are a number of notable entrants from the US and around the world and significant trends to report on. Read more…

By Tiffany Trader

Lighting up Aurora: Behind the Scenes at the Creation of the DOE’s Upcoming 200 Petaflops Supercomputer

December 1, 2016

In April 2015, U.S. Department of Energy Undersecretary Franklin Orr announced that Intel would be the prime contractor for Aurora: Read more…

By Jan Rowell

IBM Wants to be “Red Hat” of Deep Learning

January 26, 2017

IBM today announced the addition of TensorFlow and Chainer deep learning frameworks to its PowerAI suite of deep learning tools, which already includes popular offerings such as Caffe, Theano, and Torch. Read more…

By John Russell

D-Wave SC16 Update: What’s Bo Ewald Saying These Days

November 18, 2016

Tucked in a back section of the SC16 exhibit hall, quantum computing pioneer D-Wave has been talking up its new 2000-qubit processor announced in September. Forget for a moment the criticism sometimes aimed at D-Wave. This small Canadian company has sold several machines including, for example, ones to Lockheed and NASA, and has worked with Google on mapping machine learning problems to quantum computing. In July Los Alamos National Laboratory took possession of a 1000-quibit D-Wave 2X system that LANL ordered a year ago around the time of SC15. Read more…

By John Russell

Enlisting Deep Learning in the War on Cancer

December 7, 2016

Sometime in Q2 2017 the first ‘results’ of the Joint Design of Advanced Computing Solutions for Cancer (JDACS4C) will become publicly available according to Rick Stevens. He leads one of three JDACS4C pilot projects pressing deep learning (DL) into service in the War on Cancer. Read more…

By John Russell

Tokyo Tech’s TSUBAME3.0 Will Be First HPE-SGI Super

February 16, 2017

In a press event Friday afternoon local time in Japan, Tokyo Institute of Technology (Tokyo Tech) announced its plans for the TSUBAME3.0 supercomputer, which will be Japan’s “fastest AI supercomputer,” Read more…

By Tiffany Trader

HPC Startup Advances Auto-Parallelization’s Promise

January 23, 2017

The shift from single core to multicore hardware has made finding parallelism in codes more important than ever, but that hasn’t made the task of parallel programming any easier. Read more…

By Tiffany Trader

Leading Solution Providers

CPU Benchmarking: Haswell Versus POWER8

June 2, 2015

With OpenPOWER activity ramping up and IBM’s prominent role in the upcoming DOE machines Summit and Sierra, it’s a good time to look at how the IBM POWER CPU stacks up against the x86 Xeon Haswell CPU from Intel. Read more…

By Tiffany Trader

BioTeam’s Berman Charts 2017 HPC Trends in Life Sciences

January 4, 2017

Twenty years ago high performance computing was nearly absent from life sciences. Today it’s used throughout life sciences and biomedical research. Genomics and the data deluge from modern lab instruments are the main drivers, but so is the longer-term desire to perform predictive simulation in support of Precision Medicine (PM). There’s even a specialized life sciences supercomputer, ‘Anton’ from D.E. Shaw Research, and the Pittsburgh Supercomputing Center is standing up its second Anton 2 and actively soliciting project proposals. There’s a lot going on. Read more…

By John Russell

Nvidia Sees Bright Future for AI Supercomputing

November 23, 2016

Graphics chipmaker Nvidia made a strong showing at SC16 in Salt Lake City last week. Read more…

By Tiffany Trader

TSUBAME3.0 Points to Future HPE Pascal-NVLink-OPA Server

February 17, 2017

Since our initial coverage of the TSUBAME3.0 supercomputer yesterday, more details have come to light on this innovative project. Of particular interest is a new board design for NVLink-equipped Pascal P100 GPUs that will create another entrant to the space currently occupied by Nvidia's DGX-1 system, IBM's "Minsky" platform and the Supermicro SuperServer (1028GQ-TXR). Read more…

By Tiffany Trader

IDG to Be Bought by Chinese Investors; IDC to Spin Out HPC Group

January 19, 2017

US-based publishing and investment firm International Data Group, Inc. (IDG) will be acquired by a pair of Chinese investors, China Oceanwide Holdings Group Co., Ltd. Read more…

By Tiffany Trader

Is Liquid Cooling Ready to Go Mainstream?

February 13, 2017

Lost in the frenzy of SC16 was a substantial rise in the number of vendors showing server oriented liquid cooling technologies. Three decades ago liquid cooling was pretty much the exclusive realm of the Cray-2 and IBM mainframe class products. That’s changing. We are now seeing an emergence of x86 class server products with exotic plumbing technology ranging from Direct-to-Chip to servers and storage completely immersed in a dielectric fluid. Read more…

By Steve Campbell

Dell Knights Landing Machine Sets New STAC Records

November 2, 2016

The Securities Technology Analysis Center, commonly known as STAC, has released a new report characterizing the performance of the Knight Landing-based Dell PowerEdge C6320p server on the STAC-A2 benchmarking suite, widely used by the financial services industry to test and evaluate computing platforms. The Dell machine has set new records for both the baseline Greeks benchmark and the large Greeks benchmark. Read more…

By Tiffany Trader

Intel and Trump Announce $7B for Fab 42 Targeting 7nm

February 8, 2017

In what may be an attempt by President Trump to reset his turbulent relationship with the high tech industry, he and Intel CEO Brian Krzanich today announced plans to invest more than $7 billion to complete Fab 42. Read more…

By John Russell

  • arrow
  • Click Here for More Headlines
  • arrow
Share This