Intel Launches ‘Knights Landing’ Phi Family for HPC, Machine Learning

By Tiffany Trader

June 21, 2016

From ISC 2016 in Frankfurt, Germany, this week, Intel Corp. launched the second-generation Xeon Phi product family, formerly code-named Knights Landing, aimed at HPC and machine learning workloads. The company had been shipping “Knights Landing” silicon to early customers for the last six months and was waiting to ramp up production before making the product generally available.

The window also gave OEMs time to complete their readiness, said Intel’s Charlie Wuischpard, vice president of the Data Center Group and general manager of High Performance Computing Platform Group, in a media pre-briefing. Those OEMs include the usual names: Cray, HPE, Lenovo, Dell and others.

The most distinguishing feature of the chip is that it’s a bootable host CPU — unlike its predecessor “Knights Corner,” which is a coprocessor that connects over PCIe. “We’re not just a specialized programming model,” said Intel’s General Manager, HPC Compute and Networking, Barry Davis in a hand-on technical demo held at ISC. “We’re the full IA programming model. There’s no PCIe bottleneck; there’s a limitation in the data that you can send back and forth from the host CPU to the accelerator or coprocessor and we removed that bottleneck.”

The “Knights Landing” Phi will be the first chip to offer an integrated fabric, Intel’s Omni-Path Architecture (OPA), in the package. “Knights Landing” also puts integrated on-package memory in a processor, which benefits memory bandwidth and overall application performance. A six-channel memory controller supports up to 384 GB of DDR4-2400 memory (~90GB/s sustained bandwidth). There are 36 PCI Express 3.0 lanes for connecting to PCIe coprocessors, PCIe SSDs or discrete graphics cards.

The second-generation Phi is based on an Intel Atom core (based on the Silvermont microarchitecture) with many HPC enhancements. The MIC (Many Integrated Cores) design fits 8 billion transistors on a die, using 14 nm process technology. The new Phi family introduces the AVX-512 instruction set, which will be available on future Xeon processors. Both the Phi and the Xeon are binary compatible and a benefit of this is that the optimizations that apply to one platform typically carry to the other, notes Intel.

Intel emphasizes that the Phi is designed to run any workload, any IA code. “There are workloads out there that are single thread that maybe benefit from higher frequency and fewer cores and of course you would run those on a Xeon but it doesn’t mean those applications won’t still run on a Xeon Phi,” said Wuischpard. “Some of our early customers are implementing an entire supercomputing cluster with Xeon Phi. Others are doing a mix of Xeon and Xeon Phi and there are a lot of configurations that are possible within a given system deployment.”

As previously announced, the Phi product family comes in three variants: a PCIe coprocessor form factor; a stand-alone CPU; and a stand-alone CPU with integrated Omni-Path fabric technology. The SKU stack that Intel is launching includes four parts with different core counts, frequencies, TDPs and price points.

There are three parts shipping now: the 68-core 7250 (1.4 Ghz), the 64-core 7230 (1.3 Ghz) and the 64-core 7210 (1.3 Ghz). The TDP on all of these is 215 watts. The top-bin part – the Xeon Phi 7290 – is the promised 72-core version. The $6,250 SKU runs at 1.5 Ghz and consumes 245 watts of power; it will not be available until September. Integrated fabric versions of all four parts will not be available until October. Powering the fabric will add another 15 watts to the TDP envelope. The coprocessor card will be available in the second half the year, according to Intel.

Intel KNL Phi SKU list

“You can think of it as the 7200-series Xeon processor,” said Wuischpard, “You’ll see that all of the memory is 16 GBs across the board. We had originally talked about having a richer matrix of SKUs that ranged from no in-package memory to 16 GB of memory and then across these ranges of performance and it just looked too busy and too complex, and in the end everyone wants that in-package memory so we decided to shrink the SKU stack and make it easier to understand. And it does make it easier from a manufacturing perspective.”

The Xeon 7290 is a premium product with a premium price. This is by design since it’s relatively low-yielding, according to Intel. “Most of our early customers and this includes the large research labs and institutions have really focused on the 7230 and the 7250 to get the best price/performance. And we expect the 7210 will be the more general purpose high-running part,” said Wuishpard, adding that it offers 85-90 percent of the performance at less than half the price of the top-end part.

The self-hosted Phi processor competes directly with Tesla GPUs from Nvidia with both products targeting HPC and machine learning and visualization. At its GTC16 event, NVIDIA announced the NVLink-based Pascal GPU. The NVLink point-to-point interconnect’s advantage is enabling data sharing at rates five to 12 times faster than traditional PCI Express Gen 3.0. Currently, the NVLink-based P100 is only available to customers who shell out the $129,000 for NVIDIA’s “deep learning supercomputer,” the DGX-1, but the standalone NVLink-based P100 is expected to hit production availability early 2017.

Intel talks about scalability as being a big difference between a GPU card and Xeon Phi. “With GPU cards, you can only put so many cards in a box,” says Intel’s Barry Davis. “Even with NV-LINK to connect those together, you are still limited in that scale. As you look at the Xeon Phi product line with implementations at thousands of nodes, scalability is a key part of this architecture, and that’s what the market needs today, whether you are talking about machine learning, deep learning or traditional modeling and simulation.”

When it comes to artificial intelligence and deep learning, Intel has published several initial benchmarks claiming performance improvements over GPUs on a number of machine learning workloads.

Intel KNL Phi deep learning-1400x

NVIDIA’s VP, Solutions Architecture and Engineering, Marc Hamilton, said he questions the benchmarks that Intel has released so far, noting that the claims relating to deep learning were done against older versions of GPUs (Kepler) using unoptimized versions of frameworks. [The benchmark breakdown was unavailable on Intel’s site as of press time.] Hamilton also said that the “Knights Landing” does not have the strong node capability of the GPU. NVIDIA GPUs currently scale to 8-way configurations, but the OS will support 16 (recall the K80 has two physical GPUs inside it and the OS will support 8 of these).

There’s also a performance difference between the second-generation Phi and the newest Tesla GPUs. The top bin Knights Landing Phi CPU delivers 3.46 teraflops of double-precision floating point performance. The Pascal P100 GPU for NVLink-optimized servers offers 5.3 teraflops of double-precision floating point performance, and the PCIe version supports 4.7 teraflops of double-precision.

One early customer who has already deployed a Knights Landing Phi-based system is the Texas Advanced Computing Center (TACC) at the University of Austin at Texas. TACC got the 508 node system – an interim step between Stampede 1 and Stampede 2 – up and running and benchmarked on LINPACK three days after receiving its racks.

TACC Director Dan Stanzione wryly commented that that is not his preferred timeframe, but the result was a 117th place ranking on the latest TOP500 with a LINPACK of 817.8 teraflops. “Obviously the software came up pretty quickly in order to make that happen,” said Stanzione.

“We finished all of our benchmarking,” he continued, “and we’re putting users on it this week and are running our first tutorial on Sunday here at ISC.” The system employs the top-bin-minus-1 68-core Xeon Phi 7250 processor and the Omni-Path fabric.

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industy updates delivered to you every week!

On the Spack Track @SC19

December 5, 2019

At the annual supercomputing conference, SC19 in Denver, Colorado, there were Spack events each day of the conference. As a reflection of its grassroots heritage, nine sessions were planned by more than a dozen thought leaders from seven organizations, including three U.S. national Department of Energy (DOE) laboratories and Sylabs... Read more…

By Elizabeth Leake

Intel’s New Hyderabad Design Center Targets Exascale Era Technologies

December 3, 2019

Intel's Raja Koduri was in India this week to help launch a new 300,000 square foot design and engineering center in Hyderabad, which will focus on advanced computing technologies for the AI and exascale era. "Over th Read more…

By Tiffany Trader

AWS Debuts 7nm 2nd-Gen Graviton Arm Processor

December 3, 2019

The “x86 Big Bang,” in which market dominance of the venerable Intel CPU has exploded into fragments of processor options suited to varying workloads, has now encompassed CPUs offered by the leading public cloud serv Read more…

By Doug Black

Medical Imaging Gets an AI Boost

December 3, 2019

AI technologies incorporated into diagnostic imaging tools have proven useful in eliminating confirmation bias, often outperforming human clinicians who may bring their own prejudices. Another issue slowing progress is t Read more…

By George Leopold

Ride on the Wild Side – Squyres SC19 Mars Rovers Keynote

December 2, 2019

Reminding us of the deep and enabling connection between HPC and modern science is an important part of the SC Conference mission. And yes, HPC is a science itself. At SC19, Steve Squyres’ opening keynote recounting th Read more…

By John Russell

AWS Solution Channel

Making High Performance Computing Affordable and Accessible for Small and Medium Businesses with HPC on AWS

High performance computing (HPC) brings a powerful set of tools to a broad range of industries, helping to drive innovation and boost revenue in finance, genomics, oil and gas extraction, and other fields. Read more…

IBM Accelerated Insights

AI Needs Intelligent HPC infrastructure

Artificial Intelligence (AI) has revolutionized entire industries and enables humanity to solve some of the most daunting challenges. To accomplish this, it requires massive amounts of data from heterogeneous sources that is processed it new ways that differs significantly from HPC applications. Read more…

NSCI Update – Adapting to a Changing Landscape

December 2, 2019

It was November of 2017 when we last visited the topic of the National Strategic Computing Initiative (NSCI). As you will recall, the NSCI was started with an Executive Order (E.O. No. 13702), that was issued by President Obama in July of 2015 and was followed by a Strategic Plan that was released in July of 2016. The question for November of 2017... Read more…

By Alex R. Larzelere

On the Spack Track @SC19

December 5, 2019

At the annual supercomputing conference, SC19 in Denver, Colorado, there were Spack events each day of the conference. As a reflection of its grassroots heritage, nine sessions were planned by more than a dozen thought leaders from seven organizations, including three U.S. national Department of Energy (DOE) laboratories and Sylabs... Read more…

By Elizabeth Leake

Intel’s New Hyderabad Design Center Targets Exascale Era Technologies

December 3, 2019

Intel's Raja Koduri was in India this week to help launch a new 300,000 square foot design and engineering center in Hyderabad, which will focus on advanced com Read more…

By Tiffany Trader

AWS Debuts 7nm 2nd-Gen Graviton Arm Processor

December 3, 2019

The “x86 Big Bang,” in which market dominance of the venerable Intel CPU has exploded into fragments of processor options suited to varying workloads, has n Read more…

By Doug Black

Ride on the Wild Side – Squyres SC19 Mars Rovers Keynote

December 2, 2019

Reminding us of the deep and enabling connection between HPC and modern science is an important part of the SC Conference mission. And yes, HPC is a science its Read more…

By John Russell

NSCI Update – Adapting to a Changing Landscape

December 2, 2019

It was November of 2017 when we last visited the topic of the National Strategic Computing Initiative (NSCI). As you will recall, the NSCI was started with an Executive Order (E.O. No. 13702), that was issued by President Obama in July of 2015 and was followed by a Strategic Plan that was released in July of 2016. The question for November of 2017... Read more…

By Alex R. Larzelere

Tsinghua University Racks Up Its Ninth Student Cluster Championship Win at SC19

November 27, 2019

Tsinghua University has done it again. At SC19 last week, the eight-time gold medal-winner team took home the top prize in the 2019 Student Cluster Competition Read more…

By Oliver Peckham

SC19: IBM Changes Its HPC-AI Game Plan

November 25, 2019

It’s probably fair to say IBM is known for big bets. Summit supercomputer – a big win. Red Hat acquisition – looking like a big win. OpenPOWER and Power processors – jury’s out? At SC19, long-time IBMer Dave Turek sketched out a different kind of bet for Big Blue – a small ball strategy, if you’ll forgive the baseball analogy... Read more…

By John Russell

How the Gordon Bell Prize Winners Used Summit to Illuminate Transistors

November 22, 2019

At SC19, the Association for Computing Machinery (ACM) awarded the prestigious Gordon Bell Prize to the Swiss Federal Institute of Technology (ETH) Zurich. The Read more…

By Oliver Peckham

Supercomputer-Powered AI Tackles a Key Fusion Energy Challenge

August 7, 2019

Fusion energy is the Holy Grail of the energy world: low-radioactivity, low-waste, zero-carbon, high-output nuclear power that can run on hydrogen or lithium. T Read more…

By Oliver Peckham

Using AI to Solve One of the Most Prevailing Problems in CFD

October 17, 2019

How can artificial intelligence (AI) and high-performance computing (HPC) solve mesh generation, one of the most commonly referenced problems in computational engineering? A new study has set out to answer this question and create an industry-first AI-mesh application... Read more…

By James Sharpe

Cray Wins NNSA-Livermore ‘El Capitan’ Exascale Contract

August 13, 2019

Cray has won the bid to build the first exascale supercomputer for the National Nuclear Security Administration (NNSA) and Lawrence Livermore National Laborator Read more…

By Tiffany Trader

DARPA Looks to Propel Parallelism

September 4, 2019

As Moore’s law runs out of steam, new programming approaches are being pursued with the goal of greater hardware performance with less coding. The Defense Advanced Projects Research Agency is launching a new programming effort aimed at leveraging the benefits of massive distributed parallelism with less sweat. Read more…

By George Leopold

D-Wave’s Path to 5000 Qubits; Google’s Quantum Supremacy Claim

September 24, 2019

On the heels of IBM’s quantum news last week come two more quantum items. D-Wave Systems today announced the name of its forthcoming 5000-qubit system, Advantage (yes the name choice isn’t serendipity), at its user conference being held this week in Newport, RI. Read more…

By John Russell

Ayar Labs to Demo Photonics Chiplet in FPGA Package at Hot Chips

August 19, 2019

Silicon startup Ayar Labs continues to gain momentum with its DARPA-backed optical chiplet technology that puts advanced electronics and optics on the same chip Read more…

By Tiffany Trader

AMD Launches Epyc Rome, First 7nm CPU

August 8, 2019

From a gala event at the Palace of Fine Arts in San Francisco yesterday (Aug. 7), AMD launched its second-generation Epyc Rome x86 chips, based on its 7nm proce Read more…

By Tiffany Trader

SC19: IBM Changes Its HPC-AI Game Plan

November 25, 2019

It’s probably fair to say IBM is known for big bets. Summit supercomputer – a big win. Red Hat acquisition – looking like a big win. OpenPOWER and Power processors – jury’s out? At SC19, long-time IBMer Dave Turek sketched out a different kind of bet for Big Blue – a small ball strategy, if you’ll forgive the baseball analogy... Read more…

By John Russell

Leading Solution Providers

ISC 2019 Virtual Booth Video Tour

CRAY
CRAY
DDN
DDN
DELL EMC
DELL EMC
GOOGLE
GOOGLE
ONE STOP SYSTEMS
ONE STOP SYSTEMS
PANASAS
PANASAS
VERNE GLOBAL
VERNE GLOBAL

Cray, Fujitsu Both Bringing Fujitsu A64FX-based Supercomputers to Market in 2020

November 12, 2019

The number of top-tier HPC systems makers has shrunk due to a steady march of M&A activity, but there is increased diversity and choice of processing compon Read more…

By Tiffany Trader

Crystal Ball Gazing: IBM’s Vision for the Future of Computing

October 14, 2019

Dario Gil, IBM’s relatively new director of research, painted a intriguing portrait of the future of computing along with a rough idea of how IBM thinks we’ Read more…

By John Russell

Intel Debuts New GPU – Ponte Vecchio – and Outlines Aspirations for oneAPI

November 17, 2019

Intel today revealed a few more details about its forthcoming Xe line of GPUs – the top SKU is named Ponte Vecchio and will be used in Aurora, the first plann Read more…

By John Russell

Kubernetes, Containers and HPC

September 19, 2019

Software containers and Kubernetes are important tools for building, deploying, running and managing modern enterprise applications at scale and delivering enterprise software faster and more reliably to the end user — while using resources more efficiently and reducing costs. Read more…

By Daniel Gruber, Burak Yenier and Wolfgang Gentzsch, UberCloud

Dell Ramps Up HPC Testing of AMD Rome Processors

October 21, 2019

Dell Technologies is wading deeper into the AMD-based systems market with a growing evaluation program for the latest Epyc (Rome) microprocessors from AMD. In a Read more…

By John Russell

SC19: Welcome to Denver

November 17, 2019

A significant swath of the HPC community has come to Denver for SC19, which began today (Sunday) with a rich technical program. As is customary, the ribbon cutt Read more…

By Tiffany Trader

When Dense Matrix Representations Beat Sparse

September 9, 2019

In our world filled with unintended consequences, it turns out that saving memory space to help deal with GPU limitations, knowing it introduces performance pen Read more…

By James Reinders

With the Help of HPC, Astronomers Prepare to Deflect a Real Asteroid

September 26, 2019

For years, NASA has been running simulations of asteroid impacts to understand the risks (and likelihoods) of asteroids colliding with Earth. Now, NASA and the European Space Agency (ESA) are preparing for the next, crucial step in planetary defense against asteroid impacts: physically deflecting a real asteroid. Read more…

By Oliver Peckham

  • arrow
  • Click Here for More Headlines
  • arrow
Do NOT follow this link or you will be banned from the site!
Share This