Salt Lake City – November 15, 2016. Inspur, a leading global data center total solution provider presented a series of Data Center Liquid Cooling Solutions at SC16. The solution doubles server deployment density while also controlling the data center’s PUE. It is ideal for the hyperscale data center and HPC users.
Inspur has two types of liquid cooling solutions that were introduced. The first type was the bipolar loop heat pipe (LHP) liquid cooling solution. This solution uses the server’s bipolar loop heat pipe system and backboard air cooling in combination; it can greatly decrease changes to the inside structure of the server. The second type is the direct internal circulation liquid cooling. This solution is already widely used in the industry. Within it, the internal liquid cooling parts can be paired with flexibility based on pairing needs, and each node system is independent, thus making individual node operation and maintenance easier. Inspur also provides a wall-fan that lowers the temperature of the hot water exported by the nodes with its liquid cooling solutions.
Liu Jun, Inspur’s HPC GM, expressed that after deploying the Inspur total liquid cooling solutions, the data center equipment density can double and decrease energy costs by 70% – an obvious advantage in reducing TCO. Inspur’s liquid cooling solutions has overcome many limitations placed on equipment deployment density with its cooling capabilities.
The Inspur i4008 Server uses the direct internal circulation liquid cooling solution. This product is an ultra-density computing server with 4U8 nodes, each node equipped with 2 Intel Xeon E5 processors, and fully equipped with internal storage and hard drives. Inspur’s liquid cooling solution also fully supports the advanced series and frequency optimized processors. The solution greatly increases the deployment density and performance of the servers, and fulfills the HPC’s constant demands for computing performance.