Applied Materials Embedding New Memory Technologies in Chips

By Doug Black

July 9, 2019

Applied Materials, the $17 billion Santa Clara-based materials engineering company for the semiconductor industry, today announced manufacturing systems enabling new memory technologies to be deposited “with atomic-level precision” within chips.

“Today’s high-volume memory technologies including DRAM, SRAM and flash were invented decades ago and have become ubiquitous in digital devices and systems,” said the company. “New memories – notably MRAM, ReRAM and PCRAM – promise unique benefits, but they are based on new materials that have been too challenging for high-volume manufacturing… The company is delivering the most advanced systems it has ever developed to enable these promising new memories to be reliably produced at an industrial scale.”

Applied Materials’ Endura platforms allow integration of multiple materials engineering technologies along with on-board metrology to create new films and structures that the company said were not previously possible. “These integrated platforms illustrate the critical role that new materials and 3D architectures can play in giving the computing industry entirely new ways to improve performance, power and cost,” said Dr. Prabu Raja, SVP/GM of Applied’s Semiconductor Products Group.

Applied’s Endura Clover MRAM (magnetic random access memory, which incorporates magnetic materials found in hard disk drives and is a memory of choice for IoT devices) PVD platform is comprised of nine wafer processing chambers integrated in high-vacuum conditions, the company said, a 300-millimeter MRAM system for high-volume manufacturing for individually depositing up to five materials per chamber.

“MRAM memories require precise deposition of at least 30 different layers of material, some of which are 500,000 times thinner than a human hair,” the company said. “Process variations of just a fraction of the diameter of an atom can greatly affect device performance and reliability. The Clover MRAM PVD platform includes on-board metrology that measures and monitors thickness of the MRAM layers with sub-angstrom sensitivity as they are created, to ensure atomic-level uniformity without risking exposure to the outside environment.”

“As an extremely fast, high-endurance nonvolatile memory, MRAM is poised to displace embedded flash and level 3 cache SRAM in both IoT and AI applications,” said Tom Sparkman, CEO of Spin Memory. “The availability of a high-volume manufacturing system from Applied Materials is a huge boost to the ecosystem, and we are thrilled to be working with Applied to deliver MRAM solutions and accelerate its adoption.”

Applied Endura Clover MRAM PVD System

Applied said its Endura Impulse PVD platform for PCRAM and ReRAM includes up to nine process chambers integrated under vacuum along with on-board metrology for deposition and control of the multicomponent materials used emerging memories.

“As data generation grows exponentially, cloud data centers require order-of-magnitude improvements in the speed and power consumption of the data pathways linking servers and storage systems,” the company said. “ReRAM (resistive RAM) and PCRAM (phase change RAM) are fast, nonvolatile, low-power, high-density memories that can be used as ‘storage class memory’ to fill the widening price-performance gap between server DRAM and storage.”

Applied said ReRAM and PCRAM has the potential to deliver lower cost than DRAM and faster read performance than NAND and hard disk drives. “ReRAM is also a leading candidate for future in-memory computing architectures whereby computing elements are integrated into the memory arrays to help overcome the data movement bottleneck associated with AI computing,” the company said.

“Uniform deposition of the new materials used in ReRAM memories is critical to achieving the highest possible device performance, reliability and endurance,” said George Minassian, CEO and co-founder of Crossbar, Inc. “We specify the Applied Materials Endura Impulse PVD system with onboard metrology in our ReRAM technology engagements with memory and logic customers because it enables a breakthrough in these critical metrics.”

Commenting on today’s announcement, Mukesh Khare, VP, semiconductors, AI hardware and systems, IBM Research, said, “…we see the need for these technologies increasing as the AI era demands improvements in chip performance and efficiency. New materials and device types can play an important role in enabling high-performance, low-power embedded memory for IoT, Cloud and AI products. Applied Materials’ high-volume manufacturing solutions can help accelerate the availability of these new memories across the industry.”

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industy updates delivered to you every week!

GTC21: Dell Building Cloud Native Supercomputers at U Cambridge and Durham

April 14, 2021

In conjunction with GTC21, Dell Technologies today announced new supercomputers at universities across DiRAC (Distributed Research utilizing Advanced Computing) in the UK with plans to explore use of Nvidia BlueField DPU Read more…

The Role and Potential of CPUs in Deep Learning

April 14, 2021

Deep learning (DL) applications have unique architectural characteristics and efficiency requirements. Hence, the choice of computing system has a profound impact on how large a piece of the DL pie a user can finally enj Read more…

GTC21: Nvidia Launches cuQuantum; Dips a Toe in Quantum Computing

April 13, 2021

Yesterday Nvidia officially dipped a toe into quantum computing with the launch of cuQuantum SDK, a development platform for simulating quantum circuits on GPU-accelerated systems. As Nvidia CEO Jensen Huang emphasized i Read more…

Nvidia Aims Clara Healthcare at Drug Discovery, Imaging via DGX

April 12, 2021

Nvidia Corp. continues to expand its Clara healthcare platform with the addition of computational drug discovery and medical imaging tools based on its DGX A100 platform, related InfiniBand networking and its AGX develop Read more…

Nvidia Serves Up Its First Arm Datacenter CPU ‘Grace’ During Kitchen Keynote

April 12, 2021

Today at Nvidia’s annual spring GPU technology conference, held virtually once more due to the ongoing pandemic, the company announced its first ever Arm-based CPU, called Grace in honor of the famous American programmer Grace Hopper. Read more…

AWS Solution Channel

Volkswagen Passenger Cars Uses NICE DCV for High-Performance 3D Remote Visualization

 

Volkswagen Passenger Cars has been one of the world’s largest car manufacturers for over 70 years. The company delivers more than 6 million automobiles to global customers every year, from 50 production locations on five continents. Read more…

Nvidia Debuts BlueField-3 – Its Next DPU with Big Plans for an Expanded Role

April 12, 2021

Nvidia today announced its next generation data processing unit (DPU) – BlueField-3 – adding more substance to its evolving concept of the DPU as a full-fledged partner to CPUs and GPUs in delivering advanced computi Read more…

GTC21: Dell Building Cloud Native Supercomputers at U Cambridge and Durham

April 14, 2021

In conjunction with GTC21, Dell Technologies today announced new supercomputers at universities across DiRAC (Distributed Research utilizing Advanced Computing) Read more…

The Role and Potential of CPUs in Deep Learning

April 14, 2021

Deep learning (DL) applications have unique architectural characteristics and efficiency requirements. Hence, the choice of computing system has a profound impa Read more…

Nvidia Serves Up Its First Arm Datacenter CPU ‘Grace’ During Kitchen Keynote

April 12, 2021

Today at Nvidia’s annual spring GPU technology conference, held virtually once more due to the ongoing pandemic, the company announced its first ever Arm-based CPU, called Grace in honor of the famous American programmer Grace Hopper. Read more…

Nvidia Debuts BlueField-3 – Its Next DPU with Big Plans for an Expanded Role

April 12, 2021

Nvidia today announced its next generation data processing unit (DPU) – BlueField-3 – adding more substance to its evolving concept of the DPU as a full-fle Read more…

Nvidia’s Newly DPU-Enabled SuperPod Is a Multi-Tenant, Cloud-Native Supercomputer

April 12, 2021

At GTC 2021, Nvidia has announced an upgraded iteration of its DGX SuperPods, calling the new offering “the first cloud-native, multi-tenant supercomputer.” Read more…

Tune in to Watch Nvidia’s GTC21 Keynote with Jensen Huang – Recording Now Available

April 12, 2021

Join HPCwire right here on Monday, April 12, at 8:30 am PT to see the Nvidia GTC21 keynote from Nvidia’s CEO, Jensen Huang, livestreamed in its entirety. Hosted by HPCwire, you can click to join the Huang keynote on our livestream to hear Nvidia’s expected news and... Read more…

The US Places Seven Additional Chinese Supercomputing Entities on Blacklist

April 8, 2021

As tensions between the U.S. and China continue to simmer, the U.S. government today added seven Chinese supercomputing entities to an economic blacklist. The U Read more…

Habana’s AI Silicon Comes to San Diego Supercomputer Center

April 8, 2021

Habana Labs, an Intel-owned AI company, has partnered with server maker Supermicro to provide high-performance, high-efficiency AI computing in the form of new Read more…

Julia Update: Adoption Keeps Climbing; Is It a Python Challenger?

January 13, 2021

The rapid adoption of Julia, the open source, high level programing language with roots at MIT, shows no sign of slowing according to data from Julialang.org. I Read more…

Intel Launches 10nm ‘Ice Lake’ Datacenter CPU with Up to 40 Cores

April 6, 2021

The wait is over. Today Intel officially launched its 10nm datacenter CPU, the third-generation Intel Xeon Scalable processor, codenamed Ice Lake. With up to 40 Read more…

CERN Is Betting Big on Exascale

April 1, 2021

The European Organization for Nuclear Research (CERN) involves 23 countries, 15,000 researchers, billions of dollars a year, and the biggest machine in the worl Read more…

Programming the Soon-to-Be World’s Fastest Supercomputer, Frontier

January 5, 2021

What’s it like designing an app for the world’s fastest supercomputer, set to come online in the United States in 2021? The University of Delaware’s Sunita Chandrasekaran is leading an elite international team in just that task. Chandrasekaran, assistant professor of computer and information sciences, recently was named... Read more…

HPE Launches Storage Line Loaded with IBM’s Spectrum Scale File System

April 6, 2021

HPE today launched a new family of storage solutions bundled with IBM’s Spectrum Scale Erasure Code Edition parallel file system (description below) and featu Read more…

10nm, 7nm, 5nm…. Should the Chip Nanometer Metric Be Replaced?

June 1, 2020

The biggest cool factor in server chips is the nanometer. AMD beating Intel to a CPU built on a 7nm process node* – with 5nm and 3nm on the way – has been i Read more…

Saudi Aramco Unveils Dammam 7, Its New Top Ten Supercomputer

January 21, 2021

By revenue, oil and gas giant Saudi Aramco is one of the largest companies in the world, and it has historically employed commensurate amounts of supercomputing Read more…

Quantum Computer Start-up IonQ Plans IPO via SPAC

March 8, 2021

IonQ, a Maryland-based quantum computing start-up working with ion trap technology, plans to go public via a Special Purpose Acquisition Company (SPAC) merger a Read more…

Leading Solution Providers

Contributors

Can Deep Learning Replace Numerical Weather Prediction?

March 3, 2021

Numerical weather prediction (NWP) is a mainstay of supercomputing. Some of the first applications of the first supercomputers dealt with climate modeling, and Read more…

Livermore’s El Capitan Supercomputer to Debut HPE ‘Rabbit’ Near Node Local Storage

February 18, 2021

A near node local storage innovation called Rabbit factored heavily into Lawrence Livermore National Laboratory’s decision to select Cray’s proposal for its CORAL-2 machine, the lab’s first exascale-class supercomputer, El Capitan. Details of this new storage technology were revealed... Read more…

New Deep Learning Algorithm Solves Rubik’s Cube

July 25, 2018

Solving (and attempting to solve) Rubik’s Cube has delighted millions of puzzle lovers since 1974 when the cube was invented by Hungarian sculptor and archite Read more…

African Supercomputing Center Inaugurates ‘Toubkal,’ Most Powerful Supercomputer on the Continent

February 25, 2021

Historically, Africa hasn’t exactly been synonymous with supercomputing. There are only a handful of supercomputers on the continent, with few ranking on the Read more…

The History of Supercomputing vs. COVID-19

March 9, 2021

The COVID-19 pandemic poses a greater challenge to the high-performance computing community than any before. HPCwire's coverage of the supercomputing response t Read more…

AMD Launches Epyc ‘Milan’ with 19 SKUs for HPC, Enterprise and Hyperscale

March 15, 2021

At a virtual launch event held today (Monday), AMD revealed its third-generation Epyc “Milan” CPU lineup: a set of 19 SKUs -- including the flagship 64-core, 280-watt 7763 part --  aimed at HPC, enterprise and cloud workloads. Notably, the third-gen Epyc Milan chips achieve 19 percent... Read more…

HPE Names Justin Hotard New HPC Chief as Pete Ungaro Departs

March 2, 2021

HPE CEO Antonio Neri announced today (March 2, 2021) the appointment of Justin Hotard as general manager of HPC, mission critical solutions and labs, effective Read more…

Microsoft, HPE Bringing AI, Edge, Cloud to Earth Orbit in Preparation for Mars Missions

February 12, 2021

The International Space Station will soon get a delivery of powerful AI, edge and cloud computing tools from HPE and Microsoft Azure to expand technology experi Read more…

  • arrow
  • Click Here for More Headlines
  • arrow
HPCwire