Siemens Taps AMD Instinct™ GPUs To Expand High-performance Hardware Options For Simcenter STAR-CCM+

June 10, 2024

Siemens recently announced that its Simcenter STAR-CCM+ multi-physics computational fluid dynamics (CFD) software now supports AMD Instinct™ GPUs for GPU-native computation. This move addresses its users’ needs for computational efficiency, reduced simulation costs and energy usage, and greater hardware choice.

Liam McManus, Technical Product Manager for Simcenter STAR-CCM+, said, “Our customers want to design faster, evaluate more designs further upstream, and accelerate their overall design cycle. To do that, they need to increase the throughput of their simulations.”

The Simcenter STAR-CCM+ team was naturally interested in the AMD Instinct MI200 series, including the MI210, MI250, and MI250X. McManus said, “We had a lot of familiarity, experience, and success with AMD CPUs. This made us comfortable exploring what we could achieve with AMD GPUs.”

GPUs accelerate bottom lines

The computational intensity of CFD historically burdens traditional CPU-based systems. Whether predicting the airflow around a new car model or optimizing the cooling systems for cutting-edge electronics, there is always a desire for faster design cycles—a challenge for industries where time-to-market and product performance are crucial. McManus added, “Today, it’s not just about simulating a component once. A simulation might be run a hundred times to optimize it and get the most efficient product possible.”

Siemens found that with AMD Instinct GPUs, CFD simulations that once took days can be completed in hours or even minutes without compromising the depth or accuracy of the analysis. McManus pointed out, “GPU hardware allows us to run more designs at the same hardware cost or start to look at higher fidelity simulations within the same timeframe as before.” This newfound speed enables a more exploratory approach to design, allowing engineers to test and refine multiple hypotheses in the time it once took to evaluate a single concept.

AMD Instinct MI200 GPUs stand apart

The AMD MI200 series innovative CDNA2 architecture offers high processing speeds and optimizes energy consumption, allowing for efficient handling of large datasets and complex calculations. Advanced features such as high-bandwidth memory (HBM), scalable multi-GPU connectivity, and enhanced computational precision collectively enhance the GPUs’ performance and efficiency across diverse computational tasks. The MI250 is further optimized for the highest performance levels in demanding tasks, including large-scale simulations (HPC), Deep Learning, and complex scientific calculations. Engineered for scalability and massive parallel processing (MPP) abilities, the MI250 excels in High Performance Computing and artificial intelligence (AI) workloads due to its exceptional computational throughput, memory bandwidth, core count, fast memory, and memory capacity.

“Just one AMD Instinct GPU card can provide the computational equivalent of 100 to 200 CPU cores,” said McManus. Of course, we can use multiple GPUs, meaning that we can offer customers significantly reduced per-simulation costs.”

Michael Kuron, a Siemens senior software engineer who led the port, emphasized, “One thing that makes AMD GPUs great is their high memory bandwidth. For CFD, we’re not really limited by pure numerical performance but by how fast the GPU can shuffle the data. AMD GPUs offer some of the highest memory bandwidth out there, making them an excellent platform for CFD applications.” He added, “Some of the world’s fastest supercomputers these days use AMD GPUs, so being able to run on them certainly doesn’t hurt.”

AMD ROCm and HIP smooth the transition

Of course, hardware was only part of the consideration. McManus said, “The AMD ROCm platform has been critical in ensuring that our software could fully leverage the computational power of AMD GPUs. Its open-source nature and comprehensive toolset have significantly eased the development and optimization of our applications.”

Kuron added, “Because the entire ROCm stack is open-source, I can look under the hood and fix things without waiting for any technical support.” Kuron continued, “In the ROCm ecosystem, all the runtime and math libraries, plus all the stuff built on top of those, are open source. We have excellent insight when new features and capabilities come in.”

ROCm™ software’s HIP programing language enabled a smooth transition of Simcenter STAR-CCM+’s existing codebase. Kuron explained, “Our existing CUDA software translates almost one-to-one to HIP, so the porting effort was much lower than rewriting it in another programming model like SYCL or OpenMP offloading. The actual change between CUDA and HIP was just a couple of hundred lines of code. Probably 95% of the change from CUDA to HIP was achieved using little more than find and replace, and the rest wasn’t difficult either.”

Kuron said, “Achieving one-to-one parity was a significant milestone that ensures our software delivers precise and reliable results consistently, whether running on AMD or any other hardware.”

Collaborating to serve the customer

Collaboration was pivotal to the project’s success. “AMD was very responsive to our feedback, working closely with us to refine the integration,” noted Kuron. “The opportunity to communicate directly with the AMD team members who implement these solutions and understand the technical details has been incredibly valuable.”

McManus said, “It’s great to collaborate with AMD. They’re developing the GPU solutions and we can work closely with them to ensure our software runs on it. Siemens and AMD have the same objective: to get the customer to the answer as fast as possible.”

Looking ahead to MI300 and beyond

Looking to the new AMD Instinct MI300 series, Kuron said, “We’re looking forward to the increase in memory bandwidth on the MI300 platform. The tighter coupling between CPU and GPU of the MI300A platform could help eliminate bottlenecks and speed up simulations that require some parts to run on the CPU.”

McManus adds, “The increase in memory capacity, up to 192 gigabytes for the MI300X, will reduce constraints on simulation complexity and allow larger problem sizes to be addressed more effectively.

We’re also exploring hybrid computational strategies for some CPU-bound simulation challenges and we’re particularly intrigued by the possibilities offered by the unified memory of the MI300A.”

Together, Siemens and AMD are addressing the evolving needs for quicker, more cost-effective design processes. Integrating Simcenter STAR-CCM+ with AMD Instinct GPUs broadens the range of tools available for computational fluid dynamics challenges, offering high simulation speed and cost efficiency and offering engineers a wider array of hardware options. The AMD MI300 series promises to expand these capabilities further, catering to an increasingly diverse and complex array of simulations, and very dynamic markets.


Disclaimers

The information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions, and typographical errors. The information contained herein is subject to change and may be rendered inaccurate for many reasons, including but not limited to product and roadmap changes, component and motherboard version changes, new model and/or product releases, product differences between differing manufacturers, software changes, BIOS flashes, firmware upgrades, or the like. Any computer system has risks of security vulnerabilities that cannot be completely prevented or mitigated. AMD assumes no obligation to update or otherwise correct or revise this information. However, AMD reserves the right to revise this information and to make changes from time to time to the content hereof without obligation of AMD to notify any person of such revisions or changes. THIS INFORMATION IS PROVIDED ‘AS IS.” AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS, OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION. AMD SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY, OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL AMD BE LIABLE TO ANY PERSON FOR ANY RELIANCE, DIRECT, INDIRECT, SPECIAL, OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY INFORMATION CONTAINED HEREIN, EVEN IF AMD IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. AMD, the AMD Arrow logo, [insert all other AMD trademarks used in the material here per AMD Trademarks] and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies. [Insert any third party trademark attribution here per AMD’s Third Party Trademark List.]

Third-party content is licensed to you directly by the third party that owns the content and is not licensed to you by AMD. ALL LINKED THIRD-PARTY CONTENT IS PROVIDED “AS IS” WITHOUT A WARRANTY OF ANY KIND. USE OF SUCH THIRD-PARTY CONTENT IS DONE AT YOUR SOLE DISCRETION AND UNDER NO CIRCUMSTANCES WILL AMD BE LIABLE TO YOU FOR ANY THIRD-PARTY CONTENT. YOU ASSUME ALL RISK AND ARE SOLELY RESPONSIBLE FOR ANY DAMAGES THAT MAY ARISE FROM YOUR USE OF THIRD-PARTY CONTENT.

© 2024 Advanced Micro Devices, Inc. All rights reserved.

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industry updates delivered to you every week!

HPE and NVIDIA Join Forces and Plan Conquest of Enterprise AI Frontier

June 20, 2024

The HPE Discover 2024 conference is currently in full swing, and the keynote address from Hewlett-Packard Enterprise (HPE) CEO Antonio Neri on Tuesday, June 18, was an unforgettable event. Other than being the first busi Read more…

Slide Shows Samsung May be Developing a RISC-V CPU for In-memory AI Chip

June 19, 2024

Samsung may have unintentionally revealed its intent to develop a RISC-V CPU, which a presentation slide showed may be used in an AI chip. The company plans to release an AI accelerator with heavy in-memory processing, b Read more…

ASC24 Student Cluster Competition: Who Won and Why?

June 18, 2024

As is our tradition, we’re going to take a detailed look back at the recently concluded the ASC24 Student Cluster Competition (Asia Supercomputer Community) to see not only who won the various awards, but to figure out Read more…

Qubits 2024: D-Wave’s Steady March to Quantum Success

June 18, 2024

In his opening keynote at D-Wave’s annual Qubits 2024 user meeting, being held in Boston, yesterday and today, CEO Alan Baratz again made the compelling pitch that D-Wave’s brand of analog quantum computing (quantum Read more…

Apple Using Google Cloud Infrastructure to Train and Serve AI

June 18, 2024

Apple has built a new AI infrastructure to deliver AI features introduced in its devices and is utilizing resources available in Google's cloud infrastructure.  Apple's new AI backend includes: A homegrown foun Read more…

Argonne’s Rick Stevens on Energy, AI, and a New Kind of Science

June 17, 2024

The world is currently experiencing two of the largest societal upheavals since the beginning of the Industrial Revolution. One is the rapid improvement and implementation of artificial intelligence (AI) tools, while the Read more…

HPE and NVIDIA Join Forces and Plan Conquest of Enterprise AI Frontier

June 20, 2024

The HPE Discover 2024 conference is currently in full swing, and the keynote address from Hewlett-Packard Enterprise (HPE) CEO Antonio Neri on Tuesday, June 18, Read more…

Slide Shows Samsung May be Developing a RISC-V CPU for In-memory AI Chip

June 19, 2024

Samsung may have unintentionally revealed its intent to develop a RISC-V CPU, which a presentation slide showed may be used in an AI chip. The company plans to Read more…

Qubits 2024: D-Wave’s Steady March to Quantum Success

June 18, 2024

In his opening keynote at D-Wave’s annual Qubits 2024 user meeting, being held in Boston, yesterday and today, CEO Alan Baratz again made the compelling pitch Read more…

Shutterstock_666139696

Argonne’s Rick Stevens on Energy, AI, and a New Kind of Science

June 17, 2024

The world is currently experiencing two of the largest societal upheavals since the beginning of the Industrial Revolution. One is the rapid improvement and imp Read more…

Under The Wire: Nearly HPC News (June 13, 2024)

June 13, 2024

As managing editor of the major global HPC news source, the term "news fire hose" is often mentioned. The analogy is quite correct. In any given week, there are Read more…

Labs Keep Supercomputers Alive for Ten Years as Vendors Pull Support Early

June 12, 2024

Laboratories are running supercomputers for much longer, beyond the typical lifespan, as vendors prematurely deprecate the hardware and stop providing support. Read more…

MLPerf Training 4.0 – Nvidia Still King; Power and LLM Fine Tuning Added

June 12, 2024

There are really two stories packaged in the most recent MLPerf  Training 4.0 results, released today. The first, of course, is the results. Nvidia (currently Read more…

Highlights from GlobusWorld 2024: The Conference for Reimagining Research IT

June 11, 2024

The Globus user conference, now in its 22nd year, brought together over 180 researchers, system administrators, developers, and IT leaders from 55 top research Read more…

Atos Outlines Plans to Get Acquired, and a Path Forward

May 21, 2024

Atos – via its subsidiary Eviden – is the second major supercomputer maker outside of HPE, while others have largely dropped out. The lack of integrators and Atos' financial turmoil have the HPC market worried. If Atos goes under, HPE will be the only major option for building large-scale systems. Read more…

Comparing NVIDIA A100 and NVIDIA L40S: Which GPU is Ideal for AI and Graphics-Intensive Workloads?

October 30, 2023

With long lead times for the NVIDIA H100 and A100 GPUs, many organizations are looking at the new NVIDIA L40S GPU, which it’s a new GPU optimized for AI and g Read more…

Nvidia H100: Are 550,000 GPUs Enough for This Year?

August 17, 2023

The GPU Squeeze continues to place a premium on Nvidia H100 GPUs. In a recent Financial Times article, Nvidia reports that it expects to ship 550,000 of its lat Read more…

Everyone Except Nvidia Forms Ultra Accelerator Link (UALink) Consortium

May 30, 2024

Consider the GPU. An island of SIMD greatness that makes light work of matrix math. Originally designed to rapidly paint dots on a computer monitor, it was then Read more…

Nvidia’s New Blackwell GPU Can Train AI Models with Trillions of Parameters

March 18, 2024

Nvidia's latest and fastest GPU, codenamed Blackwell, is here and will underpin the company's AI plans this year. The chip offers performance improvements from Read more…

Choosing the Right GPU for LLM Inference and Training

December 11, 2023

Accelerating the training and inference processes of deep learning models is crucial for unleashing their true potential and NVIDIA GPUs have emerged as a game- Read more…

Synopsys Eats Ansys: Does HPC Get Indigestion?

February 8, 2024

Recently, it was announced that Synopsys is buying HPC tool developer Ansys. Started in Pittsburgh, Pa., in 1970 as Swanson Analysis Systems, Inc. (SASI) by John Swanson (and eventually renamed), Ansys serves the CAE (Computer Aided Engineering)/multiphysics engineering simulation market. Read more…

Some Reasons Why Aurora Didn’t Take First Place in the Top500 List

May 15, 2024

The makers of the Aurora supercomputer, which is housed at the Argonne National Laboratory, gave some reasons why the system didn't make the top spot on the Top Read more…

Leading Solution Providers

Contributors

AMD MI3000A

How AMD May Get Across the CUDA Moat

October 5, 2023

When discussing GenAI, the term "GPU" almost always enters the conversation and the topic often moves toward performance and access. Interestingly, the word "GPU" is assumed to mean "Nvidia" products. (As an aside, the popular Nvidia hardware used in GenAI are not technically... Read more…

Intel’s Next-gen Falcon Shores Coming Out in Late 2025 

April 30, 2024

It's a long wait for customers hanging on for Intel's next-generation GPU, Falcon Shores, which will be released in late 2025.  "Then we have a rich, a very Read more…

Google Announces Sixth-generation AI Chip, a TPU Called Trillium

May 17, 2024

On Tuesday May 14th, Google announced its sixth-generation TPU (tensor processing unit) called Trillium.  The chip, essentially a TPU v6, is the company's l Read more…

The NASA Black Hole Plunge

May 7, 2024

We have all thought about it. No one has done it, but now, thanks to HPC, we see what it looks like. Hold on to your feet because NASA has released videos of wh Read more…

Nvidia Shipped 3.76 Million Data-center GPUs in 2023, According to Study

June 10, 2024

Nvidia had an explosive 2023 in data-center GPU shipments, which totaled roughly 3.76 million units, according to a study conducted by semiconductor analyst fir Read more…

Q&A with Nvidia’s Chief of DGX Systems on the DGX-GB200 Rack-scale System

March 27, 2024

Pictures of Nvidia's new flagship mega-server, the DGX GB200, on the GTC show floor got favorable reactions on social media for the sheer amount of computing po Read more…

GenAI Having Major Impact on Data Culture, Survey Says

February 21, 2024

While 2023 was the year of GenAI, the adoption rates for GenAI did not match expectations. Most organizations are continuing to invest in GenAI but are yet to Read more…

AMD Clears Up Messy GPU Roadmap, Upgrades Chips Annually

June 3, 2024

In the world of AI, there's a desperate search for an alternative to Nvidia's GPUs, and AMD is stepping up to the plate. AMD detailed its updated GPU roadmap, w Read more…

  • arrow
  • Click Here for More Headlines
  • arrow
HPCwire