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Finding Opportunity in the High-Growth “AI Market”
“What’s the size of the AI market?” It’s a totally normal question for anyone to ask me. After all, I’m an analyst, and my company, Intersect360 Research, specializes in scalable, hig …
Imagine a Beowulf Cluster of SuperNODEs …
(They did)
Clustering resources for faster performance is not new. In the early days of clustering, the Beowulf project demonstrated that high performance was achievable from commodity hardware. These days, …
Announcing the 2023 Readers’ and Editors’ Choice Awards!
Check out our list of 108 illustrious winners across 22 different categories of HPC.
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Whitepaper
Penguin Computing Scyld Cloud Central™: A New Cloud-First Approach to HPC and AI Workloads
Making the Most of Today’s Cloud-First Approach to Running HPC and AI Workloads With Penguin Scyld Cloud Central™
Bursting to cloud has long been used to complement on-premises HPC capacity to meet variable compute demands. But in today’s age of cloud, many workloads start on the cloud with little IT or corporate oversight. What is needed is a way to operationalize the use of these cloud resources so that users get the compute power they need when they need it, but with constraints that take costs and the efficient use of existing compute power into account. Download this special report to learn more about this topic.
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Sponsored by Penguin Solutions
Whitepaper
QCT POD- An Adaptive Converged Platform for HPC and AI
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.
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Sponsored by QCT
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HPCwire Resource Library
HPCwire Product Showcase
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Meet Data Center Cooling Needs with QCT’s Liquid Cooling Solution
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Ultra-Dense Storage Server for Warm and Cold Data Needs
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Optimized Acceleration Server for HPC/AI/DL Workloads
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TYAN debuts new server line-up for 4th Gen AMD EPYC & AMD Ryzen Processors at SC23
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TYAN Unveils its Robust Immersion Cooling Solution at SC23
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SmartPlates Drive Performance and Efficiency in NVIDIA H100 GPUs
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Dynamic Workload Scheduler: Optimize GPU Access and Economics
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JetCool Launches Liquid Cooling Solutions for NVIDIA H100 GPUs
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Smarter Data Made Even Faster – See Kombyne™ 2.0 @ SC23 Booth 1715
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Accelerate Your HPC Projects at SC23 With Achronix
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QCT x Intel DevCloud Program Expedites HPC/AI Development
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See How QCT’s Direct-to-chip Liquid Cooling Solution Meets Data Center’s Cooling Needs
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Software Portability in AI & ML: The Importance of Containers
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Chartering AI-Powered HPC Horizons
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