Jan. 27, 2023 — Hot Chips 35 (2023) is being planned as a hybrid conference in the San Francisco Bay Area, August 27-29, 2023. The conference has announced a Call For Contributions with a submission deadline of March 22, 2023. More info below.

Important Dates

• General-Purpose Processor Chips

  • High-Performance, Low-Power

  • Multi-Core and Highly-Reliable Systems

• Domain-Specific Chips

  • Graphics Chips

  • Machine Learning Chips

  • Data Analytics and Big Data Processing

  • IoT and Always-On Functions

  • Custom Chips for Emerging Applications

• Reconfigurable Chips

  • FPGAs and FPGA-Based Systems

  • Coarse-Grained Reconfigurable Arrays

• Security

  • Secure Hardware

  • Hardware Support for Software Security

• Mobile and Embedded Devices

  • Graphics/Multimedia/Gaming

  • SoC, Security, and DSP Chips

• Communications and Networking

  • Wireless LAN/WAN/PAN

  • Network and I/O Processors

• Emerging Computing Architectures

  • Neuromorphic

  • Quantum Computing

  • Analog Computing, Photonic Chips

• Memory Technologies

  • MRAM, PCM, ReRam or FRAM

  • Packaging, Stacking, 2D/3D

• Other Enabling Technologies

  • Power and Thermal Management

  • Packaging and Testing

  • Display Technologies

  • On-Chip Optics & Sensors

  • Novel Computing Technologies

• Software and Systems for Emerging Hardware

  • Programming Models, Runtime Systems

  • Performance, Power, Debug and Evaluation

Submission Guidelines

Submissions must consist of the following:

• Submission type: “Presentation” or “Poster”

• Title

• Extended abstract (two pages maximum)

• Presenter’s contact information (name, affiliation, job title, address, phone(s), and email)

• Indicate whether you have submitted, intend to submit, or have already presented or published a similar or overlapping submission to another conference or journal.

• Indicate if you would like the submission to be held confidential.

Evaluation Criteria

Regular presentation and poster submissions are evaluated by the Program Committee on the basis of: performance of the device(s), degree of innovation, use of advanced technology, potential market significance and anticipated interest to the audience. Both regular presentation slides and posters are published in the Hot Chips proceedings.

Presentation Guidelines

Hot Chips 2023 is being planned as a hybrid conference, presenters are expected to present in person.

Poster Guidelines

Contact:

Please email our Program Committee Co-Chairs at [email protected] (For general inquiries, email [email protected])

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Source: Hot Chips