3M, SGI, and Intel Showcase Advanced Cooling Technology

April 8, 2014

ST. PAUL, Minn., April 8 — As the growth of the Internet of Things spikes so does the growth of data traffic in the cloud, which requires data centers to deliver more performance and storage with less energy consumption. Today, 3M is announcing the implementation of a fully functional supercomputer developed in collaboration with Intel and SGI that uses a revolutionary two-phase immersion cooling technology pioneered by 3M.

In this proof-of-concept, SGI ICE X, the fifth generation of the world’s fastest distributed memory supercomputer and the Intel Xeon processor E5-2600 hardware are placed directly into 3M Novec Engineered Fluid. The 3M Novec fluid is an efficient dielectric that keeps the hardware cooled with minimum additional energy, maximum performance and better reliability. 3M’s two-phase immersion cooling technology can reduce cooling energy costs by 95 percent and reduces water consumption by eliminating municipal water usage for evaporative cooling. Heat can also be harvested from the system and reused for heating and other process technologies such as desalination of sea water.

This technique has been shown to require 10 times less space than conventional air cooling and eliminates costly air cooling infrastructure and equipment associated with conventional liquid cooling, making it cost effective for large-scale data center hubs. It enables much tighter component packaging – allowing for greater computing power in less space – and easy access to hardware with no residue. In fact, the system can enable up to 100 kilowatts of computing power per square meter.

This innovative technology leads to a smaller environmental footprint with optimal computing power – important factors as the world approaches Earth Day 2014.

SGI’s industry standard high performance computing technology, coupled with Intel’s energy efficient processors, complement 3M’s ground-breaking immersion cooling technology that significantly reduces energy and water use and sets the stage for the future of data centers.

“We are thrilled with the work that our collaboration with SGI and Intel has produced,” said Joe Koch, business director for 3M Electronics Markets Materials Division. “We applaud them for their leadership in helping us find better ways to address energy efficiency, space constraints and increased computing power in data centers. These advancements are a significant stepping stone in accelerating industry wide collaboration to optimize computer hardware design.”

In the “data center of the future” the SGI ICE X system can scale seamlessly from tens of teraflops to tens of petaflops, and across technology generations, while maintaining uninterrupted production workflow. The system enables tighter component packaging and scalability, helping reduce the system footprint. It minimizes system overhead and communication bottlenecks that can inhibit efficiency and scalability for a wide range of applications and customer needs.

“Through this collaboration with Intel and 3M, we are able to demonstrate a proof-of-concept showcasing an extremely innovative capability to reduce energy use in data centers, while optimizing performance,” said Jorge Titinger, president and CEO of SGI. “Built entirely on industry-standard hardware and software components, the SGI ICE X solution enables significant decreases in energy requirements for customers, lowering total cost of ownership and impact on the environment. We are delighted to work with Intel and 3M on this demonstration to illustrate the potential to further reduce energy in data centers, something imperative as we move to a more data intensive world.”

“As the backbone of the data economy, modern data centers must increase the raw performance they deliver, but also do so efficiently by containing power consumption and operating costs,” said Charles Wuishpard, vice president, data center group and general manager, Workstation and High Performance Computing at Intel. “Intel is continually innovating and improving microprocessor technologies to meet today’s datacenter demands and is working with companies like 3M and SGI to explore advanced cooling technologies that improve energy efficiency in datacenters while also containing operating costs.”

By investing in advanced cooling technologies, companies such as Intel and SGI can explore hardware designs without the heat transfer constraints of traditional cooling, while being more affordable and less complex to build and operate. This installation is designed to prove the viability of the two-phase immersion technology using Novec fluids, and to validate open and future proof platform designs.

In-depth data acquisition and evaluation of the installation will kick off in April. Additionally, the companies are working with the Naval Research Laboratory, Lawrence Berkeley National Labs and APC by Schneider Electric to deploy and evaluate an identical system with the intention to demonstrate the viability of the technology at any scale.

About 3M

3M captures the spark of new ideas and transforms them into thousands of ingenious products. Our culture of creative collaboration inspires a never-ending stream of powerful technologies that make life better. 3M is the innovation company that never stops inventing. With $31 billion in sales, 3M employs 89,000 people worldwide and has operations in more than 70 countries. For more information, visit www.3M.com or follow @3MNews on Twitter.

About SGI

SGI, the trusted leader in high performance computing, is focused on helping customers solve their most demanding business and technology challenges by delivering technical computing, Big Data analytics, cloud computing, and petascale storage solutions that accelerate time to discovery, innovation, and profitability. Visit sgi.com ( sgi.com/ ) for more information.

About Intel

Intel is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

—–

Source: 3M

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industy updates delivered to you every week!

HPC Iron, Soft, Data, People – It Takes an Ecosystem!

December 11, 2017

Cutting edge advanced computing hardware (aka big iron) does not stand by itself. These computers are the pinnacle of a myriad of technologies that must be carefully woven together by people to create the computational c Read more…

By Alex R. Larzelere

IBM Begins Power9 Rollout with Backing from DOE, Google

December 6, 2017

After over a year of buildup, IBM is unveiling its first Power9 system based on the same architecture as the Department of Energy CORAL supercomputers, Summit and Sierra. The new AC922 server pairs two Power9 CPUs with f Read more…

By Tiffany Trader

PEZY President Arrested, Charged with Fraud

December 6, 2017

The head of Japanese supercomputing firm PEZY Computing was arrested Tuesday on suspicion of defrauding a government institution of 431 million yen (~$3.8 million). According to reports in the Japanese press, PEZY founde Read more…

By Tiffany Trader

HPE Extreme Performance Solutions

Unleash the Next Generation of HPC with Memory-Driven Compute

Today’s enterprises are faced with an ever-growing volume of data that contains immense value and intelligence for those who can properly collect, process, and store it. Read more…

Azure Debuts AMD EPYC Instances for Storage Optimized Workloads

December 5, 2017

AMD’s return to the data center received a boost today when Microsoft Azure announced introduction of instances based on AMD’s EPYC microprocessors. The new instances – Lv2-Series of Virtual Machine – use the EPY Read more…

By John Russell

HPC Iron, Soft, Data, People – It Takes an Ecosystem!

December 11, 2017

Cutting edge advanced computing hardware (aka big iron) does not stand by itself. These computers are the pinnacle of a myriad of technologies that must be care Read more…

By Alex R. Larzelere

IBM Begins Power9 Rollout with Backing from DOE, Google

December 6, 2017

After over a year of buildup, IBM is unveiling its first Power9 system based on the same architecture as the Department of Energy CORAL supercomputers, Summit a Read more…

By Tiffany Trader

Microsoft Spins Cycle Computing into Core Azure Product

December 5, 2017

Last August, cloud giant Microsoft acquired HPC cloud orchestration pioneer Cycle Computing. Since then the focus has been on integrating Cycle’s organization Read more…

By John Russell

GlobalFoundries, Ayar Labs Team Up to Commercialize Optical I/O

December 4, 2017

GlobalFoundries (GF) and Ayar Labs, a startup focused on using light, instead of electricity, to transfer data between chips, today announced they've entered in Read more…

By Tiffany Trader

HPE In-Memory Platform Comes to COSMOS

November 30, 2017

Hewlett Packard Enterprise is on a mission to accelerate space research. In August, it sent the first commercial-off-the-shelf HPC system into space for testing Read more…

By Tiffany Trader

SC17 Cluster Competition: Who Won and Why? Results Analyzed and Over-Analyzed

November 28, 2017

Everyone by now knows that Nanyang Technological University of Singapore (NTU) took home the highest LINPACK Award and the Overall Championship from the recently concluded SC17 Student Cluster Competition. We also already know how the teams did in the Highest LINPACK and Highest HPCG competitions, with Nanyang grabbing bragging rights for both benchmarks. Read more…

By Dan Olds

Perspective: What Really Happened at SC17?

November 22, 2017

SC is over. Now comes the myriad of follow-ups. Inboxes are filled with templated emails from vendors and other exhibitors hoping to win a place in the post-SC thinking of booth visitors. Attendees of tutorials, workshops and other technical sessions will be inundated with requests for feedback. Read more…

By Andrew Jones

SC Bids Farewell to Denver, Heads to Dallas for 30th Anniversary

November 17, 2017

After a jam-packed four-day expo and intensive six-day technical program, SC17 has wrapped up another successful event that brought together nearly 13,000 visit Read more…

By Tiffany Trader

US Coalesces Plans for First Exascale Supercomputer: Aurora in 2021

September 27, 2017

At the Advanced Scientific Computing Advisory Committee (ASCAC) meeting, in Arlington, Va., yesterday (Sept. 26), it was revealed that the "Aurora" supercompute Read more…

By Tiffany Trader

NERSC Scales Scientific Deep Learning to 15 Petaflops

August 28, 2017

A collaborative effort between Intel, NERSC and Stanford has delivered the first 15-petaflops deep learning software running on HPC platforms and is, according Read more…

By Rob Farber

Oracle Layoffs Reportedly Hit SPARC and Solaris Hard

September 7, 2017

Oracle’s latest layoffs have many wondering if this is the end of the line for the SPARC processor and Solaris OS development. As reported by multiple sources Read more…

By John Russell

AMD Showcases Growing Portfolio of EPYC and Radeon-based Systems at SC17

November 13, 2017

AMD’s charge back into HPC and the datacenter is on full display at SC17. Having launched the EPYC processor line in June along with its MI25 GPU the focus he Read more…

By John Russell

Nvidia Responds to Google TPU Benchmarking

April 10, 2017

Nvidia highlights strengths of its newest GPU silicon in response to Google's report on the performance and energy advantages of its custom tensor processor. Read more…

By Tiffany Trader

Japan Unveils Quantum Neural Network

November 22, 2017

The U.S. and China are leading the race toward productive quantum computing, but it's early enough that ultimate leadership is still something of an open questi Read more…

By Tiffany Trader

GlobalFoundries Puts Wind in AMD’s Sails with 12nm FinFET

September 24, 2017

From its annual tech conference last week (Sept. 20), where GlobalFoundries welcomed more than 600 semiconductor professionals (reaching the Santa Clara venue Read more…

By Tiffany Trader

Google Releases Deeplearn.js to Further Democratize Machine Learning

August 17, 2017

Spreading the use of machine learning tools is one of the goals of Google’s PAIR (People + AI Research) initiative, which was introduced in early July. Last w Read more…

By John Russell

Leading Solution Providers

SC17 Booth Video Tours Playlist

Amazon Debuts New AMD-based GPU Instances for Graphics Acceleration

September 12, 2017

Last week Amazon Web Services (AWS) streaming service, AppStream 2.0, introduced a new GPU instance called Graphics Design intended to accelerate graphics. The Read more…

By John Russell

Perspective: What Really Happened at SC17?

November 22, 2017

SC is over. Now comes the myriad of follow-ups. Inboxes are filled with templated emails from vendors and other exhibitors hoping to win a place in the post-SC thinking of booth visitors. Attendees of tutorials, workshops and other technical sessions will be inundated with requests for feedback. Read more…

By Andrew Jones

EU Funds 20 Million Euro ARM+FPGA Exascale Project

September 7, 2017

At the Barcelona Supercomputer Centre on Wednesday (Sept. 6), 16 partners gathered to launch the EuroEXA project, which invests €20 million over three-and-a-half years into exascale-focused research and development. Led by the Horizon 2020 program, EuroEXA picks up the banner of a triad of partner projects — ExaNeSt, EcoScale and ExaNoDe — building on their work... Read more…

By Tiffany Trader

Delays, Smoke, Records & Markets – A Candid Conversation with Cray CEO Peter Ungaro

October 5, 2017

Earlier this month, Tom Tabor, publisher of HPCwire and I had a very personal conversation with Cray CEO Peter Ungaro. Cray has been on something of a Cinderell Read more…

By Tiffany Trader & Tom Tabor

Tensors Come of Age: Why the AI Revolution Will Help HPC

November 13, 2017

Thirty years ago, parallel computing was coming of age. A bitter battle began between stalwart vector computing supporters and advocates of various approaches to parallel computing. IBM skeptic Alan Karp, reacting to announcements of nCUBE’s 1024-microprocessor system and Thinking Machines’ 65,536-element array, made a public $100 wager that no one could get a parallel speedup of over 200 on real HPC workloads. Read more…

By John Gustafson & Lenore Mullin

Flipping the Flops and Reading the Top500 Tea Leaves

November 13, 2017

The 50th edition of the Top500 list, the biannual publication of the world’s fastest supercomputers based on public Linpack benchmarking results, was released Read more…

By Tiffany Trader

Intel Launches Software Tools to Ease FPGA Programming

September 5, 2017

Field Programmable Gate Arrays (FPGAs) have a reputation for being difficult to program, requiring expertise in specialty languages, like Verilog or VHDL. Easin Read more…

By Tiffany Trader

HPC Chips – A Veritable Smorgasbord?

October 10, 2017

For the first time since AMD's ill-fated launch of Bulldozer the answer to the question, 'Which CPU will be in my next HPC system?' doesn't have to be 'Whichever variety of Intel Xeon E5 they are selling when we procure'. Read more…

By Dairsie Latimer

Share This