Nov. 14 — Asetek will showcase its range of RackCDU hot water liquid cooling systems for HPC data centers at SC13 including a running 92 node cluster cooled by RackCDU D2C (Direct to Chip) with monitoring software providing real-time reporting and alerting in Denver, Colorado – November 18-21. Asetek’s RackCDU range includes RackCDU D2C and RackCDU ISAC (In-Server Air Conditioning). RackCDU D2C provides cooling cost reductions up to 80% and density increases of 2.5x-5x. RackCDU ISAC provides cooling cost reductions exceeding 80% and enables operation without concern for air quality. Operating demonstrations of both technologies will be on display in Asetek’s booth #4329.
“Our successful deployment on NREL’s Skynet cluster in June, recent announcements of other HPC customer installations, and validation of the real-world advantages of Asetek RackDCU D2C by Lawrence Berkeley National Laboratory, make SC13 an ideal venue for attendees to gain an understanding of the benefits of Asetek technology,” said André Sloth Eriksen, Founder and CEO of Asetek.
On display will be D2C liquid cooled servers from Cray including the CS300-LC as well as servers retrofitted with liquid cooling from Cisco, HP, Intel, Super Micro and others. Asetek will also show a prototype of its next generation ISAC RackCDU system. ISAC is a warm water liquid cooling system that makes it possible to operate servers in hostile environments and in data centers without Computer Room Air Conditioners (CRAC).
For a quarter of a century, the Supercomputing Conference has served as the crossroads for the entire HPC community. SC has provided unparalleled cooperation, unequaled collaboration, and unmatched exposure for users, program managers, colleagues and vendors, as well as for government, private industry and academia.
Appointments for in-depth discussions about Asetek’s data center liquid cooling solutions at SC13 may be scheduled by sending an email to email@example.com.
Asetek is the world leading provider of energy efficient liquid cooling systems for data centers, servers, workstations, gaming and high performance PCs. Its products are used for reducing power and greenhouse emissions, lowering acoustic noise, and achieving maximum performance by leading OEMs and channel partners around the globe.