TAIPEI, Taiwan, July 12, 2017 — As Artificial Intelligence (AI) becomes more pervasive in the market, ASRock Rack is introducing 5 new motherboard designs based on the new Intel Xeon Scalable Processor platform and can deliver up to 2.2x more machine learning inference and training performance for AI.
The new Intel Xeon Scalable Processor marks a significant milestone in processor architecture for Intel, with upgrades from AVX2 to AVX-512 instructions, and a 1.5 times increase in memory bandwidth from 4 to 6 channels. This new processor supports an integrated host fabric interface (HFI), and up to 100Gbp bandwidth with the Omni-Path architecture. It significantly improves scalability and resilience with new IO capabilities by expanding to 48 PCI-E lanes which allows more possibilities for hardware acceleration and high-end storage. Meanwhile, the server platform supports Intel Ethernet Connection X722 which has 4x10GbE with RDMA.
In collaboration with Intel, ASRock Rack has launched 7 different, new server motherboards and 2 barebone systems based on the Intel Xeon Scalable Processor. Each different motherboard has targeted market segments served by a variety of form factors from rack, to blade and pedestal. ASRock Rack’s goal is to always provide leading server technology and to provide the ability to upgrade a wide suite of existing applications.
EPC622D24LM — Key Segments and Specification
- Enterprise Mission Critical Application / Datacenter / E-commerce / Virtualization
- L shape 16.7”x17”
- Dual Socket P support Intel Xeon Scalable Processor
- 24 xDDR4 2600/2400 R or LR DIMM slots
- 14 x SATA3 6.0Gb/s by Intel C622 ( Incl. 2xM.2 slots)
- 2 x PCI-E3.0x16 (Slot1:x16 CPU0, Slot2:x16 from CPU1), 1xPCI-E3.0x8 from CPU1
- 0 ports(2 ports in rear side, 2 ports from internal header, 1 port internal type A)
EP2C622D16NM — Key Segments and Specification
- High Performance and High-density HPC / Mission Critical / Hyper Converge / Database or Haddop Server with SSD Acceleration / I/O virtualization / Co-location
- EEB 12”x13”
- Dual Socket P support Intel Xeon Scalable Processor
- 16 xDDR4 2600/2400 R or LR DIMM slots
- 14 x SATA3 6.0Gb/s by Intel C622 ( Incl. 1xSATA DOM ports and 1xM.2 slots)
- 2 x PCI-E3.0x16
- Support OCP Mezzanine type A/B/C
EP2C621D8A — Key Segments and Specification
- UP Solution for Application Server / High-end Workstation / GPGPU Server / Multi-display Server
- ATX 12” x 9.6”
- Single Socket P supports Intel Xeon Scalable Processor
- 8 x DDR4 2666/2400 R and LRDIMM slots
- 14 SATA3 6.0 Gb/s by Intel C621(Incl.1 x SATA DOM and 1 x M.2)
- 2 x PCI-E3.0x16, 3 x PCI-E3.0x8. 1 x PCI-E3.0 x4
EP2C622D24HM — Key Segments and Specification
- HPC Application / Scientific Computing / Real-time Finance / Research & Labs
- Half Width (OCP Blade) 6.5” x 20”
- Supports Intel Xeon Scalable Processor ( with FPGA package TDP 205W)
- 24 x DDR4 2666/2400 RDIMM/ LR DIMM
- Intel C622: 13 x SATA3 (by 3x mini SAS HD, 1xM.2)
- 1 x PCI-E3.0x24, 1 x PCI-E3.0x8
- 1 x USB3.0 port
- Support OCP Mezzanine type A/B/C
EP2C622D16HM — Key Segments and Specification
- High Performance Computing Node / Virtualization Server / DPI Server / Internet Security
- Half 20” x 6.5”
- Dual Socket P support Intel Xeon Scalable Processor
- 16 x DDR4 2666/2400 R and LRDIMM
- 14 SATA3 6.0 Gb/s by Intel C622 (Incl.1 x SATA DOM and 1 x M.2)
- 2 x PCI-E3.0x16
EP2C622D16FM — Key Segments and Specification
- High Performance Server / High-density CPU Rendering Machine / Scale-out HPC Platform / GPGPU Server
- SSI CEB 12” x 10.5”
- Intel Xeon Scalable Processor
- 14 SATA3 (12 from 3 x miniSAS connector + 2 x M.2 ports from PCH)
- 2 x USB3.0 ports
- Integrated IPMI2.0 with KVM and dedicated LAN(RTL8211E)
- Support OCP Mezzanine type A/B/C
EP2C622D12HM — Key Segments and Specification
- High Performance Computing Node / Virtualization Server / DPI Server / Internet Security
- Half Width(OCP Blade)6.5”x20”
- Intel Xeon Scalable Processor
- 13 SATA3 (12 from 3 x miniSAS connector + 1 x sSATA shared with M.2)
- 1xPCI-E3.0x24, 1xPCI-E3.0x8
- 1 x USB3.0 ports
- Support OCP Mezzanine type A/B/C
1U12LX-C622RPSU — Key Segments and Specification
- High-density Web 2.0 Cloud Datacenter Storage
- 1U Chassis support 12×3.5’’ SATA3/SAS2 HDD Hot-Swap Bay +2 x 2.5’’ HDD Bay with 700W Redundant PSU
- Intel Xeon Scalable Processor
- Supports Dual Channel DDR4 2133/2400/2666 RDIMM,LR DIMM,NV DIMM ECC , 16 slots
- Support 14 x SATA3 by C622
- ASPEED 2500. Integrated IPMI 2.0 with KVM, vMedia and Dedicated LAN (RTL8211E)
- Supports 2 x x8 Mezzanine slot & typeC slot support OCP mezzanine card
1U12LX-C622SPSU — Key Segments and Specification
- High-density Web 2.0 Cloud Datacenter Storage
- 1U Chassis support 12×3.5’’ SATA3/SAS2 HDD Hot-Swap Bay +2 x 2.5’’ HDD Bay with 700W Single PSU
- Intel Xeon Scalable Processor
- Supports Dual Channel DDR4 2133/2400/2666 RDIMM,LR DIMM,NV DIMM ECC , 16 slots
- Support 14 x SATA3 by C622
- ASPEED 2500. Integrated IPMI 2.0 with KVM, vMedia and Dedicated LAN (RTL8211E)
- Supports 2 x x8 Mezzanine slot & typeC slot support OCP mezzanine card
“ASRock Rack” is the official trademark for ASRock Rack, Inc., all the covers need to remain the original brand name without any modification. All other brands, names and trademarks are the property of their respective owners.
About ASRock Rack
ASRock Rack Inc., established in 2013, specializes in providing high-performance and high-efficiency server technology in the fields of Cloud Computing, Enterprise IT, HPC and Datacenter. We adopted the design concept of “Creativity, Consideration, Cost-effectiveness” from ASRock, and the company devotes passion to think out-of-the-box in the Server Industry. Leveraged by ASRock’s growing momentum and distribution channels, this young and vibrant company targets the booming market of Cloud Computing, and is committed to serve the market with user-friendly, eco-friendly and do-it-yourself Server technology, featuring flexible and reliable products.
Source: ASRock Rack