Avicena Presents Compact 1Tbps Optical Transceiver at SC23, Enhancing AI and Memory Capabilities

November 15, 2023

SUNNYVALE, Calif., Nov. 15, 2023 — Avicena is demonstrating the world’s smallest 1Tbps optical transceiver as part its LightBundle multi-Tbps chip-to-chip interconnect technology at SC23 in Denver, Colorado. Avicena’s microLED-based LightBundle architecture supports unprecedented throughput, shoreline density and low power, unlocking the performance of processors, memory, and sensors.

Artificial intelligence (AI) is driving an unprecedented surge in demand for compute and memory performance, driven by applications like ChatGPT based on large language models (LLMs). These sophisticated models have an insatiable appetite for computing power and fast access to large amounts of memory, resulting in an urgent and growing demand for much higher density low-power interconnects between Graphics Processing Units (GPUs) and high-bandwidth memory (HBM) modules.

Today, HBM modules must be co-packaged with GPUs because the GPU-memory electrical interconnect is limited to just a few millimeters in length. Subsequent HBM generations will require IC shoreline densities in the range of 10Tbps/mm or more. Conventional optical interconnects based on VCSELs or Silicon Photonics (SiPh) promise to extend the interconnect reach but struggle to meet size, bandwidth density, power, latency, operating temperature, and cost requirements. By contrast, Avicena’s microLED-based LightBundle interconnects provide higher bandwidth density, much smaller size, much lower power and latency, and very low costs.

“At Avicena we are excited to showcase the world’s most compact 1Tbps transceiver in the shape of a 3mm x 4mm CMOS ASIC using our patented microLED optical interface,” said Bardia Pezeshki, Founder and CEO of Avicena. “Everyone is talking about SiPh solutions for applications in AI clusters. However, for short reach interconnects with less than 10m reach, we believe that our LED based solution is inherently better suited because the compact size, higher bandwidth density, lower power and latency, and temperature tolerance up to 150°C.”

Avicena’s innovations are supported by key investors including Samsung Catalyst Fund, Cerberus Capital Management, Clear Ventures, and Micron Ventures (see press release from August 2nd, 2022, for more details).

“Optical interconnect technology has the potential to improve chip-to-chip and inter-rack performance,” said Marco Chisari, head of the Samsung Semiconductor Innovation Center. “With a roadmap to multi-Tbps capacity and sub-pJ/bit power efficiency, Avicena’s innovative LightBundle interconnects can enable the next era of AI innovation, paving the way for even more capable models and a wide range of AI applications that will shape the future.”

Today’s high-performance ICs use SerDes-based electrical interfaces to achieve adequate off-chip density. However, the power consumption and bandwidth density of these electrical links degrade quickly with length. Conventional optical communications technologies developed for networking applications have been impractical for inter-processor and processor-memory interconnects due to their size, low bandwidth density, high power consumption, and high cost. The typical need for external laser sources (ELS) with SiPh increases complexity and cost.

By contrast the LightBundle interconnect architecture is based on arrays of innovative GaN microLEDs that leverage the microLED display ecosystem and can be integrated directly onto compact high-performance CMOS ICs. This enables dense low-power IO over the entire area of the IC, enabling unprecedented shoreline densities. Each microLED array is connected via a multi-core fiber cable to a matching array of CMOS-compatible PDs.

“We have previously demonstrated microLEDs transmitting at > 10Gbps per lane and a test ASIC in a 130nm CMOS process running 32 lanes at less than 1pJ/bit,” said Rob Kalman, co-founder and CTO of Avicena. “Now we are bringing up our first ASIC with over 300 lanes and an aggregate bandwidth of over 1Tbps bi-directional at 4Gbps per lane. The ASIC measures less than 12mm and contains a full transceiver including the circuitry for the optical Tx and Rx arrays, as well as a high-speed parallel electrical interface and various DFT/DFM functions like BERT, loopbacks, and Open Eye Monitoring (OEM). All key ASIC functionality has been verified and we are currently working on yield improvements for manufacturing scalability.”

The modular LightBundle platform scales to interconnects with tens of Tbps with a shoreline density > 10Tbps/mm. LightBundle is not tied to any foundry process, allowing it to be integrated onto a wide variety of IC process nodes. The compact size, high density, low power, and low latency of LightBundle is ideal for high-density chiplet interfaces like UCIe, OpenHBI, and BoW, and can also greatly extend the reach of existing compute interconnects like PCIe/CXL, and HBM/DDR/GDDR memory links.

Avicena at SC23

Avicena will be showcasing its LightBundle interconnect technology at Booth #1791.

About Avicena

Avicena Tech Corp. is a privately held company located in Sunnyvale, CA, developing LightBundle, a next generation optical interconnect architecture for AI/ML, HPC, sensors, 5G wireless and aerospace applications. This unique, flexible ultra-low energy technology is based on microLEDs, offering both very high bandwidth and low latency. Now, system designers can disaggregate functions like compute and memory and radically grow system throughput. Avicena’s technology is a key building block in the evolution of networking and computing that will reduce the energy impact on our planet. For more information, visit https://avicena.tech.


Source: Avicena

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industry updates delivered to you every week!

Atos Outlines Plans to Get Acquired, and a Path Forward

May 21, 2024

Atos – via its subsidiary Eviden – is the second major supercomputer maker outside of HPE, while others have largely dropped out. The lack of integrators and Atos' financial turmoil have the HPC market worried. If Read more…

Core42 Is Building Its 172 Million-core AI Supercomputer in Texas

May 20, 2024

UAE-based Core42 is building an AI supercomputer with 172 million cores which will become operational later this year. The system, Condor Galaxy 3, was announced earlier this year and will have 192 nodes with Cerebras Read more…

Google Announces Sixth-generation AI Chip, a TPU Called Trillium

May 17, 2024

On Tuesday May 14th, Google announced its sixth-generation TPU (tensor processing unit) called Trillium.  The chip, essentially a TPU v6, is the company's latest weapon in the AI battle with GPU maker Nvidia and clou Read more…

ISC 2024 Student Cluster Competition

May 16, 2024

The 2024 ISC 2024 competition welcomed 19 virtual (remote) and eight in-person teams. The in-person teams participated in the conference venue and, while the virtual teams competed using the Bridges-2 supercomputers at t Read more…

Grace Hopper Gets Busy with Science 

May 16, 2024

Nvidia’s new Grace Hopper Superchip (GH200) processor has landed in nine new worldwide systems. The GH200 is a recently announced chip from Nvidia that eliminates the PCI bus from the CPU/GPU communications pathway.  Read more…

Europe’s Race towards Quantum-HPC Integration and Quantum Advantage

May 16, 2024

What an interesting panel, Quantum Advantage — Where are We and What is Needed? While the panelists looked slightly weary — their’s was, after all, one of the last panels at ISC 2024 — the discussion was fascinat Read more…

Atos Outlines Plans to Get Acquired, and a Path Forward

May 21, 2024

Atos – via its subsidiary Eviden – is the second major supercomputer maker outside of HPE, while others have largely dropped out. The lack of integrators Read more…

Google Announces Sixth-generation AI Chip, a TPU Called Trillium

May 17, 2024

On Tuesday May 14th, Google announced its sixth-generation TPU (tensor processing unit) called Trillium.  The chip, essentially a TPU v6, is the company's l Read more…

Europe’s Race towards Quantum-HPC Integration and Quantum Advantage

May 16, 2024

What an interesting panel, Quantum Advantage — Where are We and What is Needed? While the panelists looked slightly weary — their’s was, after all, one of Read more…

The Future of AI in Science

May 15, 2024

AI is one of the most transformative and valuable scientific tools ever developed. By harnessing vast amounts of data and computational power, AI systems can un Read more…

Some Reasons Why Aurora Didn’t Take First Place in the Top500 List

May 15, 2024

The makers of the Aurora supercomputer, which is housed at the Argonne National Laboratory, gave some reasons why the system didn't make the top spot on the Top Read more…

ISC 2024 Keynote: High-precision Computing Will Be a Foundation for AI Models

May 15, 2024

Some scientific computing applications cannot sacrifice accuracy and will always require high-precision computing. Therefore, conventional high-performance c Read more…

Shutterstock 493860193

Linux Foundation Announces the Launch of the High-Performance Software Foundation

May 14, 2024

The Linux Foundation, the nonprofit organization enabling mass innovation through open source, is excited to announce the launch of the High-Performance Softw Read more…

ISC 2024: Hyperion Research Predicts HPC Market Rebound after Flat 2023

May 13, 2024

First, the top line: the overall HPC market was flat in 2023 at roughly $37 billion, bogged down by supply chain issues and slowed acceptance of some larger sys Read more…

Synopsys Eats Ansys: Does HPC Get Indigestion?

February 8, 2024

Recently, it was announced that Synopsys is buying HPC tool developer Ansys. Started in Pittsburgh, Pa., in 1970 as Swanson Analysis Systems, Inc. (SASI) by John Swanson (and eventually renamed), Ansys serves the CAE (Computer Aided Engineering)/multiphysics engineering simulation market. Read more…

Nvidia H100: Are 550,000 GPUs Enough for This Year?

August 17, 2023

The GPU Squeeze continues to place a premium on Nvidia H100 GPUs. In a recent Financial Times article, Nvidia reports that it expects to ship 550,000 of its lat Read more…

Comparing NVIDIA A100 and NVIDIA L40S: Which GPU is Ideal for AI and Graphics-Intensive Workloads?

October 30, 2023

With long lead times for the NVIDIA H100 and A100 GPUs, many organizations are looking at the new NVIDIA L40S GPU, which it’s a new GPU optimized for AI and g Read more…

Choosing the Right GPU for LLM Inference and Training

December 11, 2023

Accelerating the training and inference processes of deep learning models is crucial for unleashing their true potential and NVIDIA GPUs have emerged as a game- Read more…

Shutterstock 1606064203

Meta’s Zuckerberg Puts Its AI Future in the Hands of 600,000 GPUs

January 25, 2024

In under two minutes, Meta's CEO, Mark Zuckerberg, laid out the company's AI plans, which included a plan to build an artificial intelligence system with the eq Read more…

AMD MI3000A

How AMD May Get Across the CUDA Moat

October 5, 2023

When discussing GenAI, the term "GPU" almost always enters the conversation and the topic often moves toward performance and access. Interestingly, the word "GPU" is assumed to mean "Nvidia" products. (As an aside, the popular Nvidia hardware used in GenAI are not technically... Read more…

Nvidia’s New Blackwell GPU Can Train AI Models with Trillions of Parameters

March 18, 2024

Nvidia's latest and fastest GPU, codenamed Blackwell, is here and will underpin the company's AI plans this year. The chip offers performance improvements from Read more…

Some Reasons Why Aurora Didn’t Take First Place in the Top500 List

May 15, 2024

The makers of the Aurora supercomputer, which is housed at the Argonne National Laboratory, gave some reasons why the system didn't make the top spot on the Top Read more…

Leading Solution Providers

Contributors

Eyes on the Quantum Prize – D-Wave Says its Time is Now

January 30, 2024

Early quantum computing pioneer D-Wave again asserted – that at least for D-Wave – the commercial quantum era has begun. Speaking at its first in-person Ana Read more…

Shutterstock 1285747942

AMD’s Horsepower-packed MI300X GPU Beats Nvidia’s Upcoming H200

December 7, 2023

AMD and Nvidia are locked in an AI performance battle – much like the gaming GPU performance clash the companies have waged for decades. AMD has claimed it Read more…

The GenAI Datacenter Squeeze Is Here

February 1, 2024

The immediate effect of the GenAI GPU Squeeze was to reduce availability, either direct purchase or cloud access, increase cost, and push demand through the roof. A secondary issue has been developing over the last several years. Even though your organization secured several racks... Read more…

Intel Plans Falcon Shores 2 GPU Supercomputing Chip for 2026  

August 8, 2023

Intel is planning to onboard a new version of the Falcon Shores chip in 2026, which is code-named Falcon Shores 2. The new product was announced by CEO Pat Gel Read more…

The NASA Black Hole Plunge

May 7, 2024

We have all thought about it. No one has done it, but now, thanks to HPC, we see what it looks like. Hold on to your feet because NASA has released videos of wh Read more…

GenAI Having Major Impact on Data Culture, Survey Says

February 21, 2024

While 2023 was the year of GenAI, the adoption rates for GenAI did not match expectations. Most organizations are continuing to invest in GenAI but are yet to Read more…

How the Chip Industry is Helping a Battery Company

May 8, 2024

Chip companies, once seen as engineering pure plays, are now at the center of geopolitical intrigue. Chip manufacturing firms, especially TSMC and Intel, have b Read more…

Q&A with Nvidia’s Chief of DGX Systems on the DGX-GB200 Rack-scale System

March 27, 2024

Pictures of Nvidia's new flagship mega-server, the DGX GB200, on the GTC show floor got favorable reactions on social media for the sheer amount of computing po Read more…

  • arrow
  • Click Here for More Headlines
  • arrow
HPCwire