Berkeley Lab Researchers Synthesize New Ultrathin Capacitor

June 23, 2022

June 23, 2022 — The silicon-based computer chips that power our modern devices require vast amounts of energy to operate. Despite ever-improving computing efficiency, information technology is projected to consume around 25% of all primary energy produced by 2030. Researchers in the microelectronics and materials sciences communities are seeking ways to sustainably manage the global need for computing power.

The holy grail for reducing this digital demand is to develop microelectronics that operate at much lower voltages, which would require less energy and is a primary goal of efforts to move beyond today’s state-of-the-art CMOS (complementary metal-oxide semiconductor) devices.

Electron microscope images show the precise atom-by-atom structure of a barium titanate (BaTiO3) thin film sandwiched between layers of strontium ruthenate (SrRuO3) metal to make a tiny capacitor. Credit: Lane Martin/Berkeley Lab.

Non-silicon materials with enticing properties for memory and logic devices exist; but their common bulk form still requires large voltages to manipulate, making them incompatible with modern electronics. Designing thin-film alternatives that not only perform well at low operating voltages but can also be packed into microelectronic devices remains a challenge.

Now, a team of researchers at Lawrence Berkeley National Laboratory (Berkeley Lab) and UC Berkeley have identified one energy-efficient route – by synthesizing a thin-layer version of a well-known material whose properties are exactly what’s needed for next-generation devices.

First discovered more than 80 years ago, barium titanate (BaTiO3) found use in various capacitors for electronic circuits, ultrasonic generators, transducers, and even sonar.

Crystals of the material respond quickly to a small electric field, flip-flopping the orientation of the charged atoms that make up the material in a reversible but permanent manner even if the applied field is removed. This provides a way to switch between the proverbial “0” and “1” states in logic and memory storage devices – but still requires voltages larger than 1,000 millivolts (mV) for doing so.

Seeking to harness these properties for use in microchips, the Berkeley Lab-led team developed a pathway for creating films of BaTiO3 just 25 nanometers thin – less than a thousandth of a human hair’s width – whose orientation of charged atoms, or polarization, switches as quickly and efficiently as in the bulk version.

Lane Martin

“We’ve known about BaTiO3 for the better part of a century and we’ve known how to make thin films of this material for over 40 years. But until now, nobody could make a film that could get close to the structure or performance that could be achieved in bulk,” said Lane Martin, a faculty scientist in the Materials Sciences Division (MSD) at Berkeley Lab and professor of materials science and engineering at UC Berkeley who led the work.

Historically, synthesis attempts have resulted in films that contain higher concentrations of “defects” – points where the structure differs from an idealized version of the material – as compared to bulk versions. Such a high concentration of defects negatively impacts the performance of thin films. Martin and colleagues developed an approach to growing the films that limits those defects. The findings were published in the journal Nature Materials.

To understand what it takes to produce the best, low-defect BaTiO3 thin films, the researchers turned to a process called pulsed-laser deposition. Firing a powerful beam of an ultraviolet laser light onto a ceramic target of BaTiO3 causes the material to transform into a plasma, which then transmits atoms from the target onto a surface to grow the film. “It’s a versatile tool where we can tweak a lot of knobs in the film’s growth and see which are most important for controlling the properties,” said Martin.

Martin and his colleagues showed that their method could achieve precise control over the deposited film’s structure, chemistry, thickness, and interfaces with metal electrodes. By chopping each deposited sample in half and looking at its structure atom by atom using tools at the National Center for Electron Microscopy at Berkeley Lab’s Molecular Foundry, the researchers revealed a version that precisely mimicked an extremely thin slice of the bulk.

“It’s fun to think that we can take these classic materials that we thought we knew everything about, and flip them on their head with new approaches to making and characterizing them,” said Martin.

Finally, by placing a film of BaTiO3 in between two metal layers, Martin and his team created tiny capacitors – the electronic components that rapidly store and release energy in a circuit. Applying voltages of 100 mV or less and measuring the current that emerges showed that the film’s polarization switched within two billionths of a second and could potentially be faster – competitive with what it takes for today’s computers to access memory or perform calculations.

The work follows the bigger goal of creating materials with small switching voltages, and examining how interfaces with the metal components necessary for devices impact such materials. “This is a good early victory in our pursuit of low-power electronics that go beyond what is possible with silicon-based electronics today,” said Martin.

“Unlike our new devices, the capacitors used in chips today don’t hold their data unless you keep applying a voltage,” said Martin. And current technologies generally work at 500 to 600 mV, while a thin film version could work at 50 to 100 mV or less. Together, these measurements demonstrate a successful optimization of voltage and polarization robustness – which tend to be a trade-off, especially in thin materials.

Next, the team plans to shrink the material down even thinner to make it compatible with real devices in computers and study how it behaves at those tiny dimensions. At the same time, they will work with collaborators at companies such as Intel Corp. to test the feasibility in first-generation electronic devices. “If you could make each logic operation in a computer a million times more efficient, think how much energy you save. That’s why we’re doing this,” said Martin.

This research was supported by the U.S. Department of Energy (DOE) Office of Science. The Molecular Foundry is a DOE Office of Science user facility at Berkeley Lab.


Source: Rachel Berkowitz, Lawrence Berkeley National Laboratory

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industry updates delivered to you every week!

Intel’s Silicon Brain System a Blueprint for Future AI Computing Architectures

April 24, 2024

Intel is releasing a whole arsenal of AI chips and systems hoping something will stick in the market. Its latest entry is a neuromorphic system called Hala Point. The system includes Intel's research chip called Loihi 2, Read more…

Anders Dam Jensen on HPC Sovereignty, Sustainability, and JU Progress

April 23, 2024

The recent 2024 EuroHPC Summit meeting took place in Antwerp, with attendance substantially up since 2023 to 750 participants. HPCwire asked Intersect360 Research senior analyst Steve Conway, who closely tracks HPC, AI, Read more…

AI Saves the Planet this Earth Day

April 22, 2024

Earth Day was originally conceived as a day of reflection. Our planet’s life-sustaining properties are unlike any other celestial body that we’ve observed, and this day of contemplation is meant to provide all of us Read more…

Intel Announces Hala Point – World’s Largest Neuromorphic System for Sustainable AI

April 22, 2024

As we find ourselves on the brink of a technological revolution, the need for efficient and sustainable computing solutions has never been more critical.  A computer system that can mimic the way humans process and s Read more…

Empowering High-Performance Computing for Artificial Intelligence

April 19, 2024

Artificial intelligence (AI) presents some of the most challenging demands in information technology, especially concerning computing power and data movement. As a result of these challenges, high-performance computing Read more…

Kathy Yelick on Post-Exascale Challenges

April 18, 2024

With the exascale era underway, the HPC community is already turning its attention to zettascale computing, the next of the 1,000-fold performance leaps that have occurred about once a decade. With this in mind, the ISC Read more…

Intel’s Silicon Brain System a Blueprint for Future AI Computing Architectures

April 24, 2024

Intel is releasing a whole arsenal of AI chips and systems hoping something will stick in the market. Its latest entry is a neuromorphic system called Hala Poin Read more…

Anders Dam Jensen on HPC Sovereignty, Sustainability, and JU Progress

April 23, 2024

The recent 2024 EuroHPC Summit meeting took place in Antwerp, with attendance substantially up since 2023 to 750 participants. HPCwire asked Intersect360 Resear Read more…

AI Saves the Planet this Earth Day

April 22, 2024

Earth Day was originally conceived as a day of reflection. Our planet’s life-sustaining properties are unlike any other celestial body that we’ve observed, Read more…

Kathy Yelick on Post-Exascale Challenges

April 18, 2024

With the exascale era underway, the HPC community is already turning its attention to zettascale computing, the next of the 1,000-fold performance leaps that ha Read more…

Software Specialist Horizon Quantum to Build First-of-a-Kind Hardware Testbed

April 18, 2024

Horizon Quantum Computing, a Singapore-based quantum software start-up, announced today it would build its own testbed of quantum computers, starting with use o Read more…

MLCommons Launches New AI Safety Benchmark Initiative

April 16, 2024

MLCommons, organizer of the popular MLPerf benchmarking exercises (training and inference), is starting a new effort to benchmark AI Safety, one of the most pre Read more…

Exciting Updates From Stanford HAI’s Seventh Annual AI Index Report

April 15, 2024

As the AI revolution marches on, it is vital to continually reassess how this technology is reshaping our world. To that end, researchers at Stanford’s Instit Read more…

Intel’s Vision Advantage: Chips Are Available Off-the-Shelf

April 11, 2024

The chip market is facing a crisis: chip development is now concentrated in the hands of the few. A confluence of events this week reminded us how few chips Read more…

Nvidia H100: Are 550,000 GPUs Enough for This Year?

August 17, 2023

The GPU Squeeze continues to place a premium on Nvidia H100 GPUs. In a recent Financial Times article, Nvidia reports that it expects to ship 550,000 of its lat Read more…

Synopsys Eats Ansys: Does HPC Get Indigestion?

February 8, 2024

Recently, it was announced that Synopsys is buying HPC tool developer Ansys. Started in Pittsburgh, Pa., in 1970 as Swanson Analysis Systems, Inc. (SASI) by John Swanson (and eventually renamed), Ansys serves the CAE (Computer Aided Engineering)/multiphysics engineering simulation market. Read more…

Intel’s Server and PC Chip Development Will Blur After 2025

January 15, 2024

Intel's dealing with much more than chip rivals breathing down its neck; it is simultaneously integrating a bevy of new technologies such as chiplets, artificia Read more…

Choosing the Right GPU for LLM Inference and Training

December 11, 2023

Accelerating the training and inference processes of deep learning models is crucial for unleashing their true potential and NVIDIA GPUs have emerged as a game- Read more…

Comparing NVIDIA A100 and NVIDIA L40S: Which GPU is Ideal for AI and Graphics-Intensive Workloads?

October 30, 2023

With long lead times for the NVIDIA H100 and A100 GPUs, many organizations are looking at the new NVIDIA L40S GPU, which it’s a new GPU optimized for AI and g Read more…

Baidu Exits Quantum, Closely Following Alibaba’s Earlier Move

January 5, 2024

Reuters reported this week that Baidu, China’s giant e-commerce and services provider, is exiting the quantum computing development arena. Reuters reported � Read more…

Shutterstock 1179408610

Google Addresses the Mysteries of Its Hypercomputer 

December 28, 2023

When Google launched its Hypercomputer earlier this month (December 2023), the first reaction was, "Say what?" It turns out that the Hypercomputer is Google's t Read more…

AMD MI3000A

How AMD May Get Across the CUDA Moat

October 5, 2023

When discussing GenAI, the term "GPU" almost always enters the conversation and the topic often moves toward performance and access. Interestingly, the word "GPU" is assumed to mean "Nvidia" products. (As an aside, the popular Nvidia hardware used in GenAI are not technically... Read more…

Leading Solution Providers

Contributors

Shutterstock 1606064203

Meta’s Zuckerberg Puts Its AI Future in the Hands of 600,000 GPUs

January 25, 2024

In under two minutes, Meta's CEO, Mark Zuckerberg, laid out the company's AI plans, which included a plan to build an artificial intelligence system with the eq Read more…

China Is All In on a RISC-V Future

January 8, 2024

The state of RISC-V in China was discussed in a recent report released by the Jamestown Foundation, a Washington, D.C.-based think tank. The report, entitled "E Read more…

Shutterstock 1285747942

AMD’s Horsepower-packed MI300X GPU Beats Nvidia’s Upcoming H200

December 7, 2023

AMD and Nvidia are locked in an AI performance battle – much like the gaming GPU performance clash the companies have waged for decades. AMD has claimed it Read more…

Nvidia’s New Blackwell GPU Can Train AI Models with Trillions of Parameters

March 18, 2024

Nvidia's latest and fastest GPU, codenamed Blackwell, is here and will underpin the company's AI plans this year. The chip offers performance improvements from Read more…

Eyes on the Quantum Prize – D-Wave Says its Time is Now

January 30, 2024

Early quantum computing pioneer D-Wave again asserted – that at least for D-Wave – the commercial quantum era has begun. Speaking at its first in-person Ana Read more…

GenAI Having Major Impact on Data Culture, Survey Says

February 21, 2024

While 2023 was the year of GenAI, the adoption rates for GenAI did not match expectations. Most organizations are continuing to invest in GenAI but are yet to Read more…

The GenAI Datacenter Squeeze Is Here

February 1, 2024

The immediate effect of the GenAI GPU Squeeze was to reduce availability, either direct purchase or cloud access, increase cost, and push demand through the roof. A secondary issue has been developing over the last several years. Even though your organization secured several racks... Read more…

Intel’s Xeon General Manager Talks about Server Chips 

January 2, 2024

Intel is talking data-center growth and is done digging graves for its dead enterprise products, including GPUs, storage, and networking products, which fell to Read more…

  • arrow
  • Click Here for More Headlines
  • arrow
HPCwire