CEA Combines 3D Integration Technologies & Manycore Architectures to Enable High-Performance Processors for Exascale

December 15, 2020

SAN FRANCISCO, Dec. 15, 2020 – In an invited paper at IEDM 2020, CEA-List and CEA-Leti, research institutes at CEA, presented their technologies for achieving exascale-level, high- performance computing (HPC).

ExaNoDe Heterogeneous Multi-Chip Module. Courtesy of CEA.

Highlighting CEA-Leti’s state-of-the-art, 3D-technology toolbox and CEA-List’s advanced demonstrators that together enable higher bandwidth and heterogeneity for processors, the paper explains architectural and performance advances and describes how 3D-integration technologies allow heterogeneity and increased bandwidth that are critical for hardware innovations that help enable exascale computing.

“Profound evolutions brought by high performance computing (HPC) applications are based on continuous and exponential increases in computing performances over the past decades,” explained the paper, How 3D integration technologies enable advanced compute node for Exascale-level High Performance Computing?. “Supercomputers will soon achieve exascale-level computing performances mainly thanks to the introduction of innovative hardware technologies around the processors.”

Exascale computing refers to computing systems capable of calculating at least 10¹⁸, or one-billion-billion, floating-point operations per second, which would be twice as fast as the fastest computer available today.

Efforts to develop exascale computing are driven by highly data-intensive scientific and industrial applications, such as climate research, drug discovery and material design. This level of performance in HPC and Big Data will be achieved with heterogeneous computing nodes composed of generic processor chiplets hosting accelerator chiplets for improved operational intensity.

INTACT Active Interposer with 6 Chiplets. Courtesy of CEA.

The CEA technologies presented in the paper are powering demonstrators in the ExaNoDe and INTACT projects, which have developed integrated prototypes with technology building blocks to support the EU’s drive towards exascale computing. The two institutes combined CEA-Leti’s expertise in silicon and 3D sequential integration with CEA-List’s many-core architectures, which are differentiated by their high level of scalability and power efficiency. They have  demonstrated the benefit of new integration methods and processes following two main paths: finer 3D interconnect pitches, leading to improved bandwidth between compute chiplets, and assembly technologies that allow increasing heterogeneity in packaging, which improves peak performance.

In addition, the importance of a 3D-integration solution to developing HPC processors is confirmed by the European Processor Initiative (EPI), with which CEA is deeply involved. Its aim is to design and implement a roadmap for a new family of low-power European processors for extreme scale computing, high-performance Big Data and a range of emerging applications.

“These R&D successes open a path towards heterogeneous processors that will enable exascale-level supercomputers,” said Denis Dutoit, a CEA-List scientist and lead author of the IEDM paper. “We demonstrated that co-optimization of advanced architectures with 3D integration technologies achieves the level of computing performance and bandwidth required for HPC.”

Because chiplets stacked on active interposer allow modularity and reusability at low development costs, CEA-List also is investigating using this new methodology for HPC architectures in the embedded world, for compute-intensive accelerators. For edge applications requiring a high level of computation and memory, such as artificial intelligence (AI), chiplet-based partitioning will enable the creation of a broad range of solutions to meet the needs for embedded AI. Potential uses include autonomous driving, transport applications and industry 4.0.

Current CEA-Leti research work addresses die-to-wafer direct hybrid-bonding technology, which offers denser 3D interconnects with better electrical, mechanical and thermal parameters, and allows ultrahigh-bandwidth capabilities in heterogeneous systems. CEA-Leti also is working on high-density through silicon vias (TSV) (pitch 1 to 4 µms) to create together with die-to-wafer hybrid bonding a complete dense 3D stack. For the longer term, CEA-Leti is also investigating innovative photonic-interposer technology as a 3D-based photonic chiplet approach to enable interconnection of tens of computing chiplets with the resulting chip-to-chip communication bandwidth, latency and energy.

Over the next decade, co-optimization of advanced integration technologies with disruptive architectures is expected to establish the key foundations for HPC components.

This work was funded by the French National Programme d’Investissements d’Avenir (Investments in the Future), IRT Nanoelec, under Grant ANR-10-AIRT-05.

This work also was supported by the ExaNoDe project, funded by the European Union’s H2020 program under grant agreement No. 671578.

About CEA

CEA is a public research organisation working in four sectors: defence and security, nuclear and renewable energy, technological research for industries and fundamental research. Supported by a well-known expertise, CEA participated in the implementation of collaboration project with numerous academic and industrial partners. With 16,000 researchers and collaborators, it is a major European player in research and is increasingly present at international level.

A CEA technology research institute,CEA-List dedicates its activity to smart digital systems. Its R&D programs focus on artificial intelligence, advanced manufacturing, cyber-physical systems and digital health. Based in Paris-Saclay and Grenoble, the CEA List’s 900 engineer-researchers and technicians put their skills and expertise at the service of major socio-economic issues by offering companies high-added-value technological innovations, centered on people and carrying values of social and environmental responsibility. CEA-List has launched 25 startups and is a member of the Carnot Institutes network. Follow us on www-list.cea.fr/en  | @CEA_List | LinkedIn | YouTube.

A CEA technology research institute,CEA-Leti is a global leader in miniaturization technologies enabling smart, energy-efficient and secure solutions for industry. Founded in 1967, CEA-Leti pioneers micro-& nanotechnologies, tailoring differentiating applicative solutions for global companies, SMEs and startups. CEA-Leti tackles critical challenges in healthcare, energy and digital migration. From sensors to data processing and computing solutions, CEA-Leti’s multidisciplinary teams deliver solid expertise, leveraging world-class pre-industrialization facilities. With a staff of more than 1,900, a portfolio of 3,100 patents, 10,000 sq. meters of cleanroom space and a clear IP policy, the institute is based in Grenoble, France, and has offices in Silicon Valley and Tokyo. CEA-Leti has launched 65 startups and is a member of the Carnot Institutes network. Follow us on www.leti-cea.com and @CEA_Leti.


Source: CEA

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industy updates delivered to you every week!

What’s After Exascale? The Internet of Workflows Says HPE’s Nicolas Dubé

July 29, 2021

With the race to exascale computing in its final leg, it’s natural to wonder what the Post Exascale Era will look like. Nicolas Dubé, VP and chief technologist for HPE’s HPC business unit, agrees and shared his vision at Supercomputing Frontiers Europe 2021 held last week. The next big thing, he told the virtual audience at SFE21, is something that will connect HPC and (broadly) all of IT – into what Dubé calls The Internet of Workflows. Read more…

How UK Scientists Developed Transformative, HPC-Powered Coronavirus Sequencing System

July 29, 2021

In November 2020, the COVID-19 Genomics UK Consortium (COG-UK) won the HPCwire Readers’ Choice Award for Best HPC Collaboration for its CLIMB-COVID sequencing project. Launched in March 2020, CLIMB-COVID has now resulted in the sequencing of over 675,000 coronavirus genomes – an increasingly critical task as variants like Delta threaten the tenuous prospect of a return to normalcy in much of the world. Read more…

KAUST Leverages Mixed Precision for Geospatial Data

July 28, 2021

For many computationally intensive tasks, exacting precision is not necessary for every step of the entire task to obtain a suitably precise result. The alternative is mixed-precision computing: using high precision wher Read more…

Oak Ridge Supercomputer Enables Next-Gen Jet Turbine Research

July 27, 2021

Air travel is notoriously carbon-inefficient, with many airlines going as far as to offer purchasable carbon offsets to ease the guilt over large-footprint travel. But even over just the last decade, major aircraft model Read more…

IBM and University of Tokyo Roll Out Quantum System One in Japan

July 27, 2021

IBM and the University of Tokyo today unveiled an IBM Quantum System One as part of the IBM-Japan quantum program announced in 2019. The system is the second IBM Quantum System One assembled outside the U.S. and follows Read more…

AWS Solution Channel

Data compression with increased performance and lower costs

Many customers associate a performance cost with data compression, but that’s not the case with Amazon FSx for Lustre. With FSx for Lustre, data compression reduces storage costs and increases aggregate file system throughput. Read more…

Intel Unveils New Node Names; Sapphire Rapids Is Now an ‘Intel 7’ CPU

July 27, 2021

What's a preeminent chip company to do when its process node technology lags the competition by (roughly) one generation, but outmoded naming conventions make it seem like it's two nodes behind? For Intel, the response was to change how it refers to its nodes with the aim of better reflecting its positioning within the leadership semiconductor manufacturing space. Intel revealed its new node nomenclature, and... Read more…

What’s After Exascale? The Internet of Workflows Says HPE’s Nicolas Dubé

July 29, 2021

With the race to exascale computing in its final leg, it’s natural to wonder what the Post Exascale Era will look like. Nicolas Dubé, VP and chief technologist for HPE’s HPC business unit, agrees and shared his vision at Supercomputing Frontiers Europe 2021 held last week. The next big thing, he told the virtual audience at SFE21, is something that will connect HPC and (broadly) all of IT – into what Dubé calls The Internet of Workflows. Read more…

How UK Scientists Developed Transformative, HPC-Powered Coronavirus Sequencing System

July 29, 2021

In November 2020, the COVID-19 Genomics UK Consortium (COG-UK) won the HPCwire Readers’ Choice Award for Best HPC Collaboration for its CLIMB-COVID sequencing project. Launched in March 2020, CLIMB-COVID has now resulted in the sequencing of over 675,000 coronavirus genomes – an increasingly critical task as variants like Delta threaten the tenuous prospect of a return to normalcy in much of the world. Read more…

IBM and University of Tokyo Roll Out Quantum System One in Japan

July 27, 2021

IBM and the University of Tokyo today unveiled an IBM Quantum System One as part of the IBM-Japan quantum program announced in 2019. The system is the second IB Read more…

Intel Unveils New Node Names; Sapphire Rapids Is Now an ‘Intel 7’ CPU

July 27, 2021

What's a preeminent chip company to do when its process node technology lags the competition by (roughly) one generation, but outmoded naming conventions make it seem like it's two nodes behind? For Intel, the response was to change how it refers to its nodes with the aim of better reflecting its positioning within the leadership semiconductor manufacturing space. Intel revealed its new node nomenclature, and... Read more…

Will Approximation Drive Post-Moore’s Law HPC Gains?

July 26, 2021

“Hardware-based improvements are going to get more and more difficult,” said Neil Thompson, an innovation scholar at MIT’s Computer Science and Artificial Intelligence Lab (CSAIL). “I think that’s something that this crowd will probably, actually, be already familiar with.” Thompson, speaking... Read more…

With New Owner and New Roadmap, an Independent Omni-Path Is Staging a Comeback

July 23, 2021

Put on a shelf by Intel in 2019, Omni-Path faced a uncertain future, but under new custodian Cornelis Networks, OmniPath is looking to make a comeback as an independent high-performance interconnect solution. A "significant refresh" – called Omni-Path Express – is coming later this year according to the company. Cornelis Networks formed last September as a spinout of Intel's Omni-Path division. Read more…

Chameleon’s HPC Testbed Sharpens Its Edge, Presses ‘Replay’

July 22, 2021

“One way of saying what I do for a living is to say that I develop scientific instruments,” said Kate Keahey, a senior fellow at the University of Chicago a Read more…

Summer Reading: “High-Performance Computing Is at an Inflection Point”

July 21, 2021

At last month’s 11th International Symposium on Highly Efficient Accelerators and Reconfigurable Technologies (HEART), a group of researchers led by Martin Schulz of the Leibniz Supercomputing Center (Munich) presented a “position paper” in which they argue HPC architectural landscape... Read more…

AMD Chipmaker TSMC to Use AMD Chips for Chipmaking

May 8, 2021

TSMC has tapped AMD to support its major manufacturing and R&D workloads. AMD will provide its Epyc Rome 7702P CPUs – with 64 cores operating at a base cl Read more…

Intel Launches 10nm ‘Ice Lake’ Datacenter CPU with Up to 40 Cores

April 6, 2021

The wait is over. Today Intel officially launched its 10nm datacenter CPU, the third-generation Intel Xeon Scalable processor, codenamed Ice Lake. With up to 40 Read more…

Berkeley Lab Debuts Perlmutter, World’s Fastest AI Supercomputer

May 27, 2021

A ribbon-cutting ceremony held virtually at Berkeley Lab's National Energy Research Scientific Computing Center (NERSC) today marked the official launch of Perlmutter – aka NERSC-9 – the GPU-accelerated supercomputer built by HPE in partnership with Nvidia and AMD. Read more…

Ahead of ‘Dojo,’ Tesla Reveals Its Massive Precursor Supercomputer

June 22, 2021

In spring 2019, Tesla made cryptic reference to a project called Dojo, a “super-powerful training computer” for video data processing. Then, in summer 2020, Tesla CEO Elon Musk tweeted: “Tesla is developing a [neural network] training computer called Dojo to process truly vast amounts of video data. It’s a beast! … A truly useful exaflop at de facto FP32.” Read more…

Google Launches TPU v4 AI Chips

May 20, 2021

Google CEO Sundar Pichai spoke for only one minute and 42 seconds about the company’s latest TPU v4 Tensor Processing Units during his keynote at the Google I Read more…

CentOS Replacement Rocky Linux Is Now in GA and Under Independent Control

June 21, 2021

The Rocky Enterprise Software Foundation (RESF) is announcing the general availability of Rocky Linux, release 8.4, designed as a drop-in replacement for the soon-to-be discontinued CentOS. The GA release is launching six-and-a-half months after Red Hat deprecated its support for the widely popular, free CentOS server operating system. The Rocky Linux development effort... Read more…

CERN Is Betting Big on Exascale

April 1, 2021

The European Organization for Nuclear Research (CERN) involves 23 countries, 15,000 researchers, billions of dollars a year, and the biggest machine in the worl Read more…

Iran Gains HPC Capabilities with Launch of ‘Simorgh’ Supercomputer

May 18, 2021

Iran is said to be developing domestic supercomputing technology to advance the processing of scientific, economic, political and military data, and to strengthen the nation’s position in the age of AI and big data. On Sunday, Iran unveiled the Simorgh supercomputer, which will deliver.... Read more…

Leading Solution Providers

Contributors

HPE Launches Storage Line Loaded with IBM’s Spectrum Scale File System

April 6, 2021

HPE today launched a new family of storage solutions bundled with IBM’s Spectrum Scale Erasure Code Edition parallel file system (description below) and featu Read more…

Julia Update: Adoption Keeps Climbing; Is It a Python Challenger?

January 13, 2021

The rapid adoption of Julia, the open source, high level programing language with roots at MIT, shows no sign of slowing according to data from Julialang.org. I Read more…

10nm, 7nm, 5nm…. Should the Chip Nanometer Metric Be Replaced?

June 1, 2020

The biggest cool factor in server chips is the nanometer. AMD beating Intel to a CPU built on a 7nm process node* – with 5nm and 3nm on the way – has been i Read more…

GTC21: Nvidia Launches cuQuantum; Dips a Toe in Quantum Computing

April 13, 2021

Yesterday Nvidia officially dipped a toe into quantum computing with the launch of cuQuantum SDK, a development platform for simulating quantum circuits on GPU-accelerated systems. As Nvidia CEO Jensen Huang emphasized in his keynote, Nvidia doesn’t plan to build... Read more…

Microsoft to Provide World’s Most Powerful Weather & Climate Supercomputer for UK’s Met Office

April 22, 2021

More than 14 months ago, the UK government announced plans to invest £1.2 billion ($1.56 billion) into weather and climate supercomputing, including procuremen Read more…

Quantum Roundup: IBM, Rigetti, Phasecraft, Oxford QC, China, and More

July 13, 2021

IBM yesterday announced a proof for a quantum ML algorithm. A week ago, it unveiled a new topology for its quantum processors. Last Friday, the Technical Univer Read more…

Q&A with Jim Keller, CTO of Tenstorrent, and an HPCwire Person to Watch in 2021

April 22, 2021

As part of our HPCwire Person to Watch series, we are happy to present our interview with Jim Keller, president and chief technology officer of Tenstorrent. One of the top chip architects of our time, Keller has had an impactful career. Read more…

Senate Debate on Bill to Remake NSF – the Endless Frontier Act – Begins

May 18, 2021

The U.S. Senate today opened floor debate on the Endless Frontier Act which seeks to remake and expand the National Science Foundation by creating a technology Read more…

  • arrow
  • Click Here for More Headlines
  • arrow
HPCwire