June 10 — CoolIT Systems Inc., a global leader in Direct Contact Liquid Cooling (DCLC) technologies for HPC, Cloud and Enterprise markets, today announced the issuance of Patent No. 8,746,330, which covers the company’s Split Flow Heat Exchanger technology.
The invention of the split flow technology dates back to 2007 and was created as a result of CoolIT R&D efforts to improve liquid cooling performance while reducing pumping power requirements. The result of the invention has been the steady delivery of market leading performance by CoolIT in the Direct Contact Liquid Cooling market. This innovative approach has demonstrated market superiority through a series of award winning products such as the market leading Corsair H100i.
“This is a key patent for the company that adds significantly to our IP portfolio,” said Geoff Lyon, CEO & CTO of CoolIT Systems. “The invention relates to a compact method of delivering coolant through an opening over a central section of micro-channels resulting in a superior level of performance. This patent strengthens CoolIT’s position with our proprietary technology giving us a tremendous advantage in the market.”
About CoolIT Systems
CoolIT Systems Inc. is a world leader in Direct Contact Liquid Cooling for the Data Center and Desktop markets. As an experienced innovator with 44 patents and more than 1.5 million liquid cooling units deployed, CoolIT brings a wealth of design, engineering, and manufacturing knowledge to the table.
CoolIT’s Rack DCLC platform is a modular, rack-based, advanced cooling solution that allows for dramatic increases in rack densities, component performance, and power efficiencies. The technology can be deployed with any server and in any rack making it a truly flexible solution that allows for an edge in today’s highly competitive marketplace.
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Source: CoolIT Systems