DALLAS, Texas, Nov. 14, 2018 — CoolIT Systems, a world leader in modular, scalable data center liquid cooling technology, has partnered with Intel to develop high performance Direct Liquid Cooling solutions for Intel Xeon Scalable CPUs, including the recently announced Advanced Performance processors (codename Cascade Lake) coming in H1 2019.
CoolIT’s modular, rack-based Direct Liquid Cooling technology, Rack DCLC, enables dramatic increases in rack density, component performance and power efficiencies and can install into any server or rack, ensuring ease of adoption and maintenance. These solutions for Intel Xeon Scalable Processors are compatible with CoolIT’s Rack DCLC product portfolio including Coolant Distribution Units and Rack Manifolds.
“CoolIT is proud to support Intel Xeon Scalable CPUs with high density Direct Liquid Cooling,” said CoolIT Systems Vice President of Business Development and Product Marketing, Patrick McGinn. “HPC users can now unlock the benefits of CoolIT technology through any number of industry leading OEM partners including Intel, Cray, HPE, and Dell.”
About CoolIT Systems
CoolIT Systems specializes in scalable liquid cooling solutions for individual servers through to the world’s most demanding data centers and HPC systems. Through its modular, rack-based Direct Liquid Cooling technology, Rack DCLC, CoolIT enables dramatic increases in rack densities, component performance and power efficiencies. From Passive Coldplate Loops specifically designed for the latest high TDP processors from Intel, NVIDIA and AMD, to Rack Manifolds and Coolant Distribution Units (CDUs), CoolIT’s reliable technology installs into any server or rack, ensuring ease of adoption and maintenance. For more information about CoolIT Systems and its technology, email or visit http://www.coolitsystems.com/.
Source: CoolIT Systems