Cray Launches Tiered Storage for Lustre

June 23, 2014

SEATTLE, Wash. and LEIPZIG, Germany, June 23 — At the 2014 International Supercomputing Conference in Leipzig, Germany, global supercomputer leader Cray Inc. today announced the launch of a new data management and protection solution for Lustre file systems. This new capability is designed to simplify the management and preservation of data stored on Lustre, using Cray Tiered Adaptive Storage (TAS).

Designed for big data and supercomputing environments, the Cray TAS connector for Lustre provides customers with a simplified way to both protect and move data across storage tiers and locations, from high-performance storage to deep-tape archives. This new capability extends Cray TAS to the Lustre user community.

“Our customers can now deploy high performance Lustre storage systems knowing their data can be easily managed,” said Barry Bolding, Cray’s vice president of storage and data management. “Until now, it has been impractical to backup or protect large Lustre file systems with enterprise-class technologies. A key strategy for Cray is building on open systems. While other tiered storage systems are proprietary, we continue to invest in Linux and open format data movement technologies. The Cray TAS connector for Lustre will work on any Linux or Lustre environment, regardless of vendor.”

Cray TAS is an open archive and tiered storage system that simplifies the preservation of data indefinitely, and sustains large-scale archives for big data and supercomputing. Building on Lustre APIs for hierarchical storage management, Cray has developed an essential bridge from high performance storage to archives, using a flexible tiered storage model. Data access is transparent to users, and storage tiers can be composed of any media (SSD, disk or tape). The management tools are easy to use and familiar to system administrators and SAM-QFS users. Yet, Cray TAS capabilities are built on Linux and designed for big data and supercomputing.

Some of these unique capabilities include:

  • Large file system support for nearline disk tiers measured in petabytes;
  • Massive archive capacity for tape tiers measured in exabytes;
  • Migration policies based on quotas;
  • Single-point support for all hardware and software;
  • Growing ecosystem of Linux tools;
  • Comprehensive best-practices and architectures based on years of SAM-QFS knowledge and expertise.

“Lustre is expanding into commercial and big data customers, and is the leading open parallel file system,” added Bolding. “As a co-founder of OpenSFS, Cray leads and collaborates with the open source community to drive Lustre suitability for analytics, as well as supercomputing. Cray TAS now provides a path for customers to protect and archive the data that is important to them, while driving down total-cost-of-ownership by putting it on the most inexpensive media possible. Combined with other Cray storage solutions, such as Cray Sonexion and Cray Cluster Connect, we are working toward complete data storage and management offerings for the datacenter.”

In addition to Cray TAS, the Company also offers Cray Sonexion, a scale-out Lustre system for high-performance storage, and Cray Cluster Connect, a complete, integrated Lustre storage solution for all x86 Linux clusters. Cray storage solutions address the full range of customer use cases from requiring high performance scalability to reducing the total cost of storing and managing data over its lifespan. Additional information on Cray’s scalable storage solutions can be found on the Cray website at www.cray.com.

About Cray Inc.

Global supercomputing leader Cray Inc. provides innovative systems and solutions enabling scientists and engineers in industry, academia and government to meet existing and future simulation and analytics challenges. Leveraging 40 years of experience in developing and servicing the world’s most advanced supercomputers, Cray offers a comprehensive portfolio of supercomputers and Big Data storage and analytics solutions delivering unrivaled performance, efficiency and scalability. Cray’s Adaptive Supercomputing vision is focused on delivering innovative next-generation products that integrate diverse processing technologies into a unified architecture, allowing customers to meet the market’s continued demand for realized performance. Go to www.cray.com for more information.

Source: Cray Inc.

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industy updates delivered to you every week!

GPUs, Power9, Figure Prominently in IBM’s Bet on Weather Forecasting

June 22, 2017

IBM jumped into the weather forecasting business roughly a year and a half ago by purchasing The Weather Company. This week at ISC 2017, Big Blue rolled out plans to push deeper into climate science and develop more gran Read more…

By John Russell

Intersect 360 at ISC: HPC Industry at $44B by 2021

June 22, 2017

The care, feeding and sustained growth of the HPC industry increasingly is in the hands of the commercial market sector – in particular, it’s the hyperscale companies and their embrace of AI and deep learning – tha Read more…

By Doug Black

AMD Charges Back into the Datacenter and HPC Workflows with EPYC Processor

June 20, 2017

AMD is charging back into the enterprise datacenter and select HPC workflows with its new EPYC 7000 processor line, code-named Naples, announced today at a “global” launch event in Austin TX. In many ways it was a fu Read more…

By John Russell

Hyperion: Deep Learning, AI Helping Drive Healthy HPC Industry Growth

June 20, 2017

To be at the ISC conference in Frankfurt this week is to experience deep immersion in deep learning. Users want to learn about it, vendors want to talk about it, analysts and journalists want to report on it. Deep learni Read more…

By Doug Black

HPE Extreme Performance Solutions

Creating a Roadmap for HPC Innovation at ISC 2017

In an era where technological advancements are driving innovation to every sector, and powering major economic and scientific breakthroughs, high performance computing (HPC) is crucial to tackle the challenges of today and tomorrow. Read more…

OpenACC Shows Growing Strength at ISC

June 19, 2017

OpenACC is strutting its stuff at ISC this year touting expanding membership, a jump in downloads, favorable benchmarks across several architectures, new staff members, and new support by key HPC applications providers, Read more…

By John Russell

Top500 Results: Latest List Trends and What’s in Store

June 19, 2017

Greetings from Frankfurt and the 2017 International Supercomputing Conference where the latest Top500 list has just been revealed. Although there were no major shakeups -- China still has the top two spots locked with th Read more…

By Tiffany Trader

ISC: Extreme-Scale Requirements to Push the Frontiers of Deep Learning

June 17, 2017

Deep learning is the latest and most compelling technology strategy to take aim at the decades-old “drowning in data/starving for insight” problem. But contrary to the commonly held notion, deep learning is more than Read more…

By Doug Black

Six Exascale PathForward Vendors Selected; DoE Providing $258M

June 15, 2017

The much-anticipated PathForward awards for hardware R&D in support of the Exascale Computing Project were announced today with six vendors selected – AMD, Cray, Hewlett Packard Enterprise (HPE), IBM, Intel, and NV Read more…

By John Russell

GPUs, Power9, Figure Prominently in IBM’s Bet on Weather Forecasting

June 22, 2017

IBM jumped into the weather forecasting business roughly a year and a half ago by purchasing The Weather Company. This week at ISC 2017, Big Blue rolled out pla Read more…

By John Russell

Intersect 360 at ISC: HPC Industry at $44B by 2021

June 22, 2017

The care, feeding and sustained growth of the HPC industry increasingly is in the hands of the commercial market sector – in particular, it’s the hyperscale Read more…

By Doug Black

AMD Charges Back into the Datacenter and HPC Workflows with EPYC Processor

June 20, 2017

AMD is charging back into the enterprise datacenter and select HPC workflows with its new EPYC 7000 processor line, code-named Naples, announced today at a “g Read more…

By John Russell

Hyperion: Deep Learning, AI Helping Drive Healthy HPC Industry Growth

June 20, 2017

To be at the ISC conference in Frankfurt this week is to experience deep immersion in deep learning. Users want to learn about it, vendors want to talk about it Read more…

By Doug Black

OpenACC Shows Growing Strength at ISC

June 19, 2017

OpenACC is strutting its stuff at ISC this year touting expanding membership, a jump in downloads, favorable benchmarks across several architectures, new staff Read more…

By John Russell

Top500 Results: Latest List Trends and What’s in Store

June 19, 2017

Greetings from Frankfurt and the 2017 International Supercomputing Conference where the latest Top500 list has just been revealed. Although there were no major Read more…

By Tiffany Trader

ISC: Extreme-Scale Requirements to Push the Frontiers of Deep Learning

June 17, 2017

Deep learning is the latest and most compelling technology strategy to take aim at the decades-old “drowning in data/starving for insight” problem. But cont Read more…

By Doug Black

Six Exascale PathForward Vendors Selected; DoE Providing $258M

June 15, 2017

The much-anticipated PathForward awards for hardware R&D in support of the Exascale Computing Project were announced today with six vendors selected – AMD Read more…

By John Russell

Quantum Bits: D-Wave and VW; Google Quantum Lab; IBM Expands Access

March 21, 2017

For a technology that’s usually characterized as far off and in a distant galaxy, quantum computing has been steadily picking up steam. Just how close real-wo Read more…

By John Russell

Trump Budget Targets NIH, DOE, and EPA; No Mention of NSF

March 16, 2017

President Trump’s proposed U.S. fiscal 2018 budget issued today sharply cuts science spending while bolstering military spending as he promised during the cam Read more…

By John Russell

HPC Compiler Company PathScale Seeks Life Raft

March 23, 2017

HPCwire has learned that HPC compiler company PathScale has fallen on difficult times and is asking the community for help or actively seeking a buyer for its a Read more…

By Tiffany Trader

Google Pulls Back the Covers on Its First Machine Learning Chip

April 6, 2017

This week Google released a report detailing the design and performance characteristics of the Tensor Processing Unit (TPU), its custom ASIC for the inference Read more…

By Tiffany Trader

CPU-based Visualization Positions for Exascale Supercomputing

March 16, 2017

In this contributed perspective piece, Intel’s Jim Jeffers makes the case that CPU-based visualization is now widely adopted and as such is no longer a contrarian view, but is rather an exascale requirement. Read more…

By Jim Jeffers, Principal Engineer and Engineering Leader, Intel

Nvidia Responds to Google TPU Benchmarking

April 10, 2017

Nvidia highlights strengths of its newest GPU silicon in response to Google's report on the performance and energy advantages of its custom tensor processor. Read more…

By Tiffany Trader

Nvidia’s Mammoth Volta GPU Aims High for AI, HPC

May 10, 2017

At Nvidia's GPU Technology Conference (GTC17) in San Jose, Calif., this morning, CEO Jensen Huang announced the company's much-anticipated Volta architecture a Read more…

By Tiffany Trader

Facebook Open Sources Caffe2; Nvidia, Intel Rush to Optimize

April 18, 2017

From its F8 developer conference in San Jose, Calif., today, Facebook announced Caffe2, a new open-source, cross-platform framework for deep learning. Caffe2 is the successor to Caffe, the deep learning framework developed by Berkeley AI Research and community contributors. Read more…

By Tiffany Trader

Leading Solution Providers

MIT Mathematician Spins Up 220,000-Core Google Compute Cluster

April 21, 2017

On Thursday, Google announced that MIT math professor and computational number theorist Andrew V. Sutherland had set a record for the largest Google Compute Engine (GCE) job. Sutherland ran the massive mathematics workload on 220,000 GCE cores using preemptible virtual machine instances. Read more…

By Tiffany Trader

Google Debuts TPU v2 and will Add to Google Cloud

May 25, 2017

Not long after stirring attention in the deep learning/AI community by revealing the details of its Tensor Processing Unit (TPU), Google last week announced the Read more…

By John Russell

US Supercomputing Leaders Tackle the China Question

March 15, 2017

Joint DOE-NSA report responds to the increased global pressures impacting the competitiveness of U.S. supercomputing. Read more…

By Tiffany Trader

Groq This: New AI Chips to Give GPUs a Run for Deep Learning Money

April 24, 2017

CPUs and GPUs, move over. Thanks to recent revelations surrounding Google’s new Tensor Processing Unit (TPU), the computing world appears to be on the cusp of Read more…

By Alex Woodie

Russian Researchers Claim First Quantum-Safe Blockchain

May 25, 2017

The Russian Quantum Center today announced it has overcome the threat of quantum cryptography by creating the first quantum-safe blockchain, securing cryptocurrencies like Bitcoin, along with classified government communications and other sensitive digital transfers. Read more…

By Doug Black

DOE Supercomputer Achieves Record 45-Qubit Quantum Simulation

April 13, 2017

In order to simulate larger and larger quantum systems and usher in an age of “quantum supremacy,” researchers are stretching the limits of today’s most advanced supercomputers. Read more…

By Tiffany Trader

Messina Update: The US Path to Exascale in 16 Slides

April 26, 2017

Paul Messina, director of the U.S. Exascale Computing Project, provided a wide-ranging review of ECP’s evolving plans last week at the HPC User Forum. Read more…

By John Russell

Knights Landing Processor with Omni-Path Makes Cloud Debut

April 18, 2017

HPC cloud specialist Rescale is partnering with Intel and HPC resource provider R Systems to offer first-ever cloud access to Xeon Phi "Knights Landing" processors. The infrastructure is based on the 68-core Intel Knights Landing processor with integrated Omni-Path fabric (the 7250F Xeon Phi). Read more…

By Tiffany Trader

  • arrow
  • Click Here for More Headlines
  • arrow
Share This