EPI Announces Successful Conclusion of European Processor Initiative Phase One

December 22, 2021

News highlights:

  • The European Processor Initiative (EPI) has successfully completed its first three-year phase, delivering cutting-edge technologies for European sovereignty on time and within a limited budget, despite the constraints of the COVID-19 pandemic
  • Highlights include the Rhea general-purpose processor, EPI accelerator proof of concept and embedded high-performance microcontroller for automotive applications
  • The successful completion of this phase, SGA1, paves the way for the second instalment of the project, which kicks off in January 2022

Dec. 22, 2021 — The European Processor Initiative (EPI), a project with 28 partners from 10 European countries aiming to make the EU achieve independence in high-performance computing (HPC) chip technologies and infrastructure, is proud to present key results achieved in phase one (2018-2021).

These results stem from three major research and innovation domains, the General-Purpose Processor (GPP), Accelerator (EPAC) and Automotive streams, complemented by a number of common activities.

General-Purpose Processor (GPP)

Atos, a global leader in digital transformation, cybersecurity, cloud and HPC, is the lead partner of the General-Purpose Processor (GPP) stream. Together with SiPearl, the company bringing to market the high-performance and low-power European processor, and other EPI partners, they defined the architectural specifications of Rhea, the first generation of the EPI General-Purpose Processor (GPP) implementation and its future derivates.

With 29 RISC-V cores, the Arm Neoverse V1 architecture used by SiPearl to design Rhea will offer an effective, scalable and customizable solution for HPC applications. Architectural decisions were taken following a co-design methodology and by analyzing the performance of advanced intellectual property (IP) blocks. A scalable network-on-chip (NoC) to enable high-frequency, high-bandwidth data transfers between cores, accelerators, input/output (IO) and shared memory resources was also optimized by SiPearl.

To allow early software development and performance estimation of the EPI processor while the GPP was still at the implementation stage, a GPP virtual prototype was designed and used.

“We are proud of our success in designing a powerful GPP leveraging cutting edge technologies and IPs built and deployed exclusively by European universities and industrial leaders. We are confident that we will soon demonstrate the instrumental role of this GPP in enabling a European exascale computing machine, the next breakthrough in the HPC domain the world is expecting,” said Stream Leader Emmanuel Ego (Atos).

“At SiPearl, we are very proud to bring to life the joint project of the European Processor Initiative. We worked hard through close collaboration with the initiative’s 28 partners – the scientific community, supercomputing centers, leading names from industry and innovative start-ups – who are our stakeholders, future users, and clients. With the release of the Rhea processor, we will all contribute to ensure European sovereignty in HPC applications such as personalized medicine, climate modeling, and energy management,” said Philippe Notton, founder and CEO of SiPearl.

Rhea will integrate technologies by EPI partners and offers unique features in terms of memory architecture, memory bandwidth optimization, security, and power management.

Memory

Memory controllers are one of the most critical IPs when it comes to GPP performance. To help evaluate architectural choices, CEA developed a complete simulation platform with specific instrumentations to analyze controller efficiency in driving the high-bandwidth HBM2E memories. The platform allows efficient analysis of the memory device interface thanks to the decoding and tracking of all memory commands and data. The HBM2E subsystem was simulated with multiple random and directive patterns targeting different traffic shapes and involving all the controller features in maintaining the HBM2E efficiency.

Security

A number of state-of-the-art embedded security features and key technologies were also designed in this stream. These include the standalone Security Management System (SMS) security IP developed by ProvenRun, providing advanced, common-criteria certified, sovereign security IP for HPC and edge processors.

To further bolster security, the University of Pisa contributed a set of crypto IPs, called “Crypto Tile”, integrated in the Rhea GPP by SiPearl. This provides a hardware security module with full security services for high-end symmetric (AES with 9 cipher modes), asymmetric (ECC, ECDSA, ECIES, ECDH) and hashing (SHA2/SHA3) cryptography, delivering several orders of magnitude of increased throughput and decreased energy cost as compared to a software solution.

The Crypto Tile also includes secure key storage and secure IP configuration, side-channel attack protection, on-chip true random number generation (TRNG), support of Linux kernel drivers, extreme key lengths for maximum security levels and high speed en(de)cryption throughput thanks to AXI4-based interface towards DMA and Arm or RISC-V programmable cores. Post-quantum cryptographic support is also provided thanks to real-time implementation of Lattice algorithms such as Crystals Kyber and Dilithium.

Power

Given the importance both of reducing the carbon footprint of future generation computing systems and enabling higher computation capabilities in post-Dennard scaling electronics, energy-efficient computing has been a key consideration in EPI from the outset. For this purpose, an open-source, RISC-V based power controller was designed by University of Bologna and ETH Zurich and integrated into the Rhea processor, harnessing advanced control and artificial intelligence (AI) algorithms for the power management of large-scale systems-on-chip (SoCs).

In addition, based on STMicroelectronics technology on power solutions, Atos and E4 Computer Engineering designed and manufactured the Voltage Regulator and Management reference platform to test the Board Management Controller (mapped inside a field-programmable gate array, or FPGA).

EPI GPP has achieved register transfer level (RTL) completion status as a result of the first phase of the EPI project. The Rhea full design implementation is currently at the validation stage using emulations.

The main result of general-purpose processor activities in EPI phase one, the Rhea processor, will be instrumental for the launch of European exascale supercomputers in 2023.

Accelerators

The EPI accelerator stream set out to deliver energy-efficient acceleration for HPC and AI workloads. With the European Processor Accelerator (EPAC) test chip proof of concept, EPI has demonstrated that it is possible to create an exclusively European design, while the use of open-source instruction-set architectures (ISAs) ensures freedom from proprietary licenses and export restrictions.

This stream has fully embraced the open-source philosophy of give and take, contributing to the expansion of the RISC-V ecosystem and adding to the LLVM compiler database. The EPAC systems and FPGA software development vehicles make full use of the Linux operating system and contribute to the community with patches, device drivers, and additional functionality to popular open-source HPC software packages such as OpenMP and MPI. Furthermore, parts of the hardware such as the STX (stencil/tensor accelerator) were developed using a permissively licensed open-source approach around the PULP platform.

“The accelerator stream in EPI has emphatically proven that the RISC-V vector approach has the potential to transform the HPC sector, with designed-in-Europe architectures capable of delivering high performance on a low energy budget,” commented Stream Leader Jesús Labarta (Barcelona Supercomputing Center). “The work also epitomizes European traditions of open science and collaboration. Partners across Europe have joined forces to create something that no single organization could have achieved by itself. By working with open-source technologies and projects, the EPAC stream has helped expand the RISC-V ecosystem, making this technology viable for an increasing number of applications in the future.”

Figure 1: EPAC Test Chip on a test PCB

EPAC set out to provide a proof of concept for European-designed, RISC-V vector architectures for HPC acceleration. A suite of technologies has been developed to this end:

  • The EPAC vector processing unit (VPU), design by BSC and UNIZG, shows the use of RISC-V long-vector architectures for high-performance computing is a viable approach, delivering high performance on a low energy budget, and that it can be scaled up in future.
  • The vector unit is driven by Semidynamics’ vector-specialized Avispado RISC-V core and Gazzillion Misses technology for energy-efficient processing.
  • The dedicated and flexible RISC-V based many-core stencil and tensor accelerator (STX), designed by ETH Zurich and Fraunhofer, leverages stencil processing units to offer exceptional energy efficiency and programmability for machine-learning and stencil workloads.
  • Meanwhile, the variable precision accelerator (VRP), designed by CEA, enhances efficiency and reliability for scientific high-performance computing applications such as multiphysics simulations.
  • The EPAC test chip also includes multiple distributed banks of shared L2 cache and coherence home nodes (L2HN) designed by FORTH and CHALMERS and optimized for the high-bandwidth requirements of the vector processing units while offering a coherent view of the memory system that facilitates multi-core programmability.
  • All the processing units and the shared L2HN banks are connected via a high-speed NoC in a modular manner that permits the system to scale up. The test chip also includes advanced SERDES technology for very high-bandwidth off-chip and cross-chip communication. Both the NoC and SERDES were designed by Extoll.
  • The PCB (daughter board) to enable the testing of the EPAC Test Chip was designed and developed by E4 Computer Engineering.

EPAC offers exceptional programmability, with generic codes being run successfully on the test chip with minimal modifications and a software development vehicle to support programmers. It is a genuine example of co-design, with a continuous integration system and rapid application of improvements in response to feedback.

Automotive

Coordinated by Infineon, a leader in automotive microcontrollers, the Automotive Stream has paved the way towards road-capable autonomous cars, thanks to the proof of concept for an innovative embedded high-performance compute (eHPC) platform and associated software development kit (SDK). This platform, in combination with a downsized, vehicle-tailored, general-purpose processor, meets the increasing demand for computing power in future cars in a cost-efficient, economically viable and functionally safe way.

“Overall, the achievements are evidence of collaboration, synergies and the team spirit which characterized the research work in the automotive stream,” said Stream Leader Knut Hufeld (Infineon). “With its focus on cost-effective, safe and certified automotive solutions, it can be seen as a driving belt for the overall profitability of European processors in the field of HPC.”

Figure 2: BMW X5 EPI Test Car and the EPI computing system in the rack.

The main achievement was demonstrated in a road-approved BMW X5 car to show the proof of concept for a pioneering eHPC Microcontroller Unit (eHPC MCU) which is integrated in a specially designed flexible modular computing platform (MCP) together with several EPI technology IPs. Numerous test drives were performed to collect data and evaluate test scenarios involving parameters of autonomous driving.

Among other features, the platform includes AI-supported integrated cameras and Elektrobit radar imaging analysis software, with integrated preparation for use of EPI accelerators in the system. It is the result of a close cooperation among the 16 partners in Stream4 aiming to fulfil its objectives of specifying a suitable eHPC Platform, define its architecture and develop the necessary software development kit (SDK).

Infineon also expanded the automotive microcontroller in terms of its architecture and performance ability so that it can act as master and control one or several accelerators. Relevant aspects were safety, security, fall back or redundancy for reduced application, with regard to the top Automotive Safety Integrity Level D (ASIL D) at system level, which is required for autonomous driving applications.

The platform is scalable and open for further technologies. The MCP has various slots for other technologies developed as part of EPI, including:

  • future automotive versions of the EPI general purpose processor
  • the EPAC RISC-V based accelerator
  • the Kalray Massively Parallel Processor Array (MPPA) accelerator tile for eHPC, developed as an IP in the Stream 2 and demonstrated for object detection using Kalray’s MPPA-based Coolidge processor for final BMW automotive demonstration
  • the Menta eFPGA

Test runs reveal that EPI now has specific technologies suitable for autonomous driving up to at least level 4 – where the vehicle drives independently most of the time – thus paving the way for the future.

In addition to the hardware platform, this stream also included the development of a complete software ecosystem, based to a large extent on software products by automotive software specialist Elektrobit. This area also comprises the automotive eHPC platform software stack, including the classic automotive open operating system architecture (AUTOSAR) development for Auto eHPC MCUs, and the adaptive AUTOSAR development for HPC GPPs and the L4Re hypervisor (virtualization) that are crucial for automotive applications.

With regard to safety, a specific concept was jointly created for a software lockstep, thus contributing to an overall EPI safety concept.

After this three-year initial phase, the results and findings will be continued in further projects.

Common Activities

This stream acted as a provider for other technical streams. Excellent collaboration, both internally and with other streams, helped mitigate issues caused by pandemic-imposed travel restrictions and allowed the stream to meet its objectives, enumerated below.

This stream established a co-design process to shape the design of European processors. Simulations and models with different levels of detail and precision were created to identify the impact of design decisions on the performance of future applications. A benchmark suite of over 40 applications was used to support co-design and later evaluate the EPI processors. Applications have also been prepared to run on future EPI systems, by adapting and testing them on comparable hardware platforms and emulators.

The specification of a “common platform” architecture was defined and used as a backbone for architecture exploration, as the starting point for the GPP implementation, and to define guidelines for security and heterogeneous integration.

Another major result was the integration of the power management design in the GPP specifications: power management firmware, off-chip integration consolidating power distribution board design, PLDA integration, and consolidation of the power management hardware integration.

Work was also done on multiple aspects of the support of system software development: general and hybrid programming environments, OpenMP and MPI runtimes on both GPP and RISC-V sides, OpenMP extra threads support for dynamic load balancing (DLB) and the introspection-based scheduling mechanism in the LLVM OpenMP runtime, offloading for both GCC and LLVM toolchains, testing of power and energy monitoring libraries on available reference ARM Platform, and the resource manager.

Another notable achievement was the development of three tools – gem5, MUSA and SESAM/VPSim – for a complete multi-level simulation environment that provides relevant virtual prototypes for a wide range of needs encountered in the EPI streams. These tools demonstrated broad capabilities, including detailed chiplet- and NoC-level simulation, system simulation for software design, and performance evaluation for design space exploration and hardware co-design activities.

  • JUELICH and FORTH jointly developed a gem5 simulation package of Rhea. This cycle-accurate computer architecture simulator is capable of modeling a variety of hardware platforms. It provides models of varying complexity for CPU cores, memory devices, coherent caches and on-chip networks, which can be combined in a modular fashion.
  • MUSA, from BSC, relies on native execution traces with two levels of detail to allow simulation of different communication networks, numbers of cores per node, and relevant microarchitectural parameters. In addition, MUSA incorporates support for register renaming using a register file of any generic size as well as support for the most advanced cache prefetchers (e.g., BOP, SPP, etc.)
  • The CEA development SESAM/VPSim allows collaborations across multiple work packages by being flexible enough in its capabilities to operate alone, to interface with third-party physical system platforms or simulators, and to be integrated with most of the virtual prototyping methodologies used in the EPI project. Moreover, SESAM/VPSim includes fast on-chip network and cache performance models as well as decoupling the simulation of functional and extra-functional behaviors, resulting in a good compromise between accuracy and simulation time.

“I was delighted to take over the management of a successful stream, midway through the project, that was able to provide a very high level of co-design, a comprehensive set of benchmarks, and useful simulation platforms that allowed the project to envision processor architecture, effective power management, and to start delivering libraries fit for the new system. I would like to thank Romain Dolbeau, who started the stream, and all the work package leaders and teams for their passion and kind spirit of collaboration,” said Stream Leader Jean-François Blanc (Atos).

The outlook

“I’m proud of the outstanding results achieved by EPI teams after only three years of cooperation, paving the way towards Europe’s technological sovereignty. I’m particularly impressed we delivered our objectives on time with a limited budget, despite the unprecedented working conditions due to the terrible COVID-19 pandemic. This has created favorable conditions for the launch of the next phase and its successful delivery of the European processors and accelerators for the EUPEX (EUropean Pilot for Exascale) and TEP (The European Pilot) projects, the precursors to European exascale systems,” said Eric Monchalin (Atos), chairman of the EPI Board.

About EPI

The European Processor Initiative (EPI) is a project currently implemented under the first stage of the Framework Partnership Agreement signed by the Consortium with the European Commission (FPA: 800928), whose aim is to design and implement a roadmap for a new family of low-power European processors for extreme scale computing, high-performance Big-Data and a range of emerging applications.


Source: EPI

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industy updates delivered to you every week!

HPE Announces New HPC Factory in Czech Republic

May 18, 2022

A week ahead of ISC High Performance 2022 (set to be held in Hamburg, Germany), supercomputing heavyweight HPE has announced a major investment in sovereign European computing: its first European factory, housed in the C Read more…

Hyperion Study Tracks Rise and Impact of Linux Supercomputers

May 17, 2022

That supercomputers produce impactful, lasting value is a basic tenet among the HPC community. To make the point more formally, Hyperion Research has issued a new report, The Economic and Societal Benefits of Linux Super Read more…

ECP Director Doug Kothe Named ORNL Associate Laboratory Director

May 16, 2022

The Department of Energy's Oak Ridge National Laboratory (ORNL) has selected Doug Kothe to be the next Associate Laboratory Director for its Computing and Computational Sciences Directorate (CCSD), HPCwire has learned. K Read more…

Google Cloud’s New TPU v4 ML Hub Packs 9 Exaflops of AI

May 16, 2022

Almost exactly a year ago, Google launched its Tensor Processing Unit (TPU) v4 chips at Google I/O 2021, promising twice the performance compared to the TPU v3. At the time, Google CEO Sundar Pichai said that Google’s datacenters would “soon have dozens of TPU v4 Pods, many of which will be... Read more…

Q&A with Candace Culhane, SC22 General Chair and an HPCwire Person to Watch in 2022

May 14, 2022

HPCwire is pleased to present our interview with SC22 General Chair Candace Culhane, program/project director at Los Alamos National Lab and an HPCwire 2022 Person to Watch. In this exclusive Q&A, Culhane covers her Read more…

AWS Solution Channel

shutterstock 1103121086

Encoding workflow dependencies in AWS Batch

Most users of HPC or Batch systems need to analyze data with multiple operations to get meaningful results. That’s really driven by the nature of scientific research or engineering processes – it’s rare that a single task generates the insight you need. Read more…

Argonne Supercomputer Advances Energy Storage Research

May 13, 2022

The lack of large-scale energy storage bottlenecks many sources of renewable energy, such as sunlight-reliant solar power and unpredictable wind power. Researchers from Lawrence Livermore National Laboratory (LLNL) are w Read more…

HPE Announces New HPC Factory in Czech Republic

May 18, 2022

A week ahead of ISC High Performance 2022 (set to be held in Hamburg, Germany), supercomputing heavyweight HPE has announced a major investment in sovereign Eur Read more…

Google Cloud’s New TPU v4 ML Hub Packs 9 Exaflops of AI

May 16, 2022

Almost exactly a year ago, Google launched its Tensor Processing Unit (TPU) v4 chips at Google I/O 2021, promising twice the performance compared to the TPU v3. At the time, Google CEO Sundar Pichai said that Google’s datacenters would “soon have dozens of TPU v4 Pods, many of which will be... Read more…

Q&A with Candace Culhane, SC22 General Chair and an HPCwire Person to Watch in 2022

May 14, 2022

HPCwire is pleased to present our interview with SC22 General Chair Candace Culhane, program/project director at Los Alamos National Lab and an HPCwire 2022 Per Read more…

Supercomputing an Image of Our Galaxy’s Supermassive Black Hole

May 13, 2022

A supermassive black hole called Sagittarius A* (yes, the asterisk is part of it!) sits at the center of the Milky Way. Now, for the first time, we can see it. Read more…

Royalty-free stock illustration ID: 1919750255

Intel Says UCIe to Outpace PCIe in Speed Race

May 11, 2022

Intel has shared more details on a new interconnect that is the foundation of the company’s long-term plan for x86, Arm and RISC-V architectures to co-exist in a single chip package. The semiconductor company is taking a modular approach to chip design with the option for customers to cram computing blocks such as CPUs, GPUs and AI accelerators inside a single chip package. Read more…

Intel Extends IPU Roadmap Through 2026

May 10, 2022

Intel is extending its roadmap for infrastructure processors through 2026, the company said at its Vision conference being held in Grapevine, Texas. The company's IPUs (infrastructure processing units) are megachips that are designed to improve datacenter efficiency by offloading functions such as networking control, storage management and security that were traditionally... Read more…

Exascale Watch: Aurora Installation Underway, Now Open for Reservations

May 10, 2022

Installation has begun on the Aurora supercomputer, Rick Stevens (associate director of Argonne National Laboratory) revealed today during the Intel Vision event keynote taking place in Dallas, Texas, and online. Joining Intel exec Raja Koduri on stage, Stevens confirmed that the Aurora build is underway – a major development for a system that is projected to deliver more... Read more…

Intel’s Habana Labs Unveils Gaudi2, Greco AI Processors

May 10, 2022

At the hybrid Intel Vision event today, Intel’s Habana Labs team launched two major new products: Gaudi2, the second generation of the Gaudi deep learning training processor; and Greco, the successor to the Goya deep learning inference processor. Intel says that the processors offer significant speedups relative to their predecessors and the... Read more…

Nvidia R&D Chief on How AI is Improving Chip Design

April 18, 2022

Getting a glimpse into Nvidia’s R&D has become a regular feature of the spring GTC conference with Bill Dally, chief scientist and senior vice president of research, providing an overview of Nvidia’s R&D organization and a few details on current priorities. This year, Dally focused mostly on AI tools that Nvidia is both developing and using in-house to improve... Read more…

Royalty-free stock illustration ID: 1919750255

Intel Says UCIe to Outpace PCIe in Speed Race

May 11, 2022

Intel has shared more details on a new interconnect that is the foundation of the company’s long-term plan for x86, Arm and RISC-V architectures to co-exist in a single chip package. The semiconductor company is taking a modular approach to chip design with the option for customers to cram computing blocks such as CPUs, GPUs and AI accelerators inside a single chip package. Read more…

Facebook Parent Meta’s New AI Supercomputer Will Be ‘World’s Fastest’

January 24, 2022

Fresh off its rebrand last October, Meta (née Facebook) is putting muscle behind its vision of a metaversal future with a massive new AI supercomputer called the AI Research SuperCluster (RSC). Meta says that RSC will be used to help build new AI models, develop augmented reality tools, seamlessly analyze multimedia data and more. The supercomputer’s... Read more…

AMD/Xilinx Takes Aim at Nvidia with Improved VCK5000 Inferencing Card

March 8, 2022

AMD/Xilinx has released an improved version of its VCK5000 AI inferencing card along with a series of competitive benchmarks aimed directly at Nvidia’s GPU line. AMD says the new VCK5000 has 3x better performance than earlier versions and delivers 2x TCO over Nvidia T4. AMD also showed favorable benchmarks against several Nvidia GPUs, claiming its VCK5000 achieved... Read more…

In Partnership with IBM, Canada to Get Its First Universal Quantum Computer

February 3, 2022

IBM today announced it will deploy its first quantum computer in Canada, putting Canada on a short list of countries that will have access to an IBM Quantum Sys Read more…

Supercomputer Simulations Show How Paxlovid, Pfizer’s Covid Antiviral, Works

February 3, 2022

Just about a month ago, Pfizer scored its second huge win of the pandemic when the U.S. Food and Drug Administration issued another emergency use authorization Read more…

Nvidia Launches Hopper H100 GPU, New DGXs and Grace Superchips

March 22, 2022

The battle for datacenter dominance keeps getting hotter. Today, Nvidia kicked off its spring GTC event with new silicon, new software and a new supercomputer. Speaking from a virtual environment in the Nvidia Omniverse 3D collaboration and simulation platform, CEO Jensen Huang introduced the new Hopper GPU architecture and the H100 GPU... Read more…

PsiQuantum’s Path to 1 Million Qubits

April 21, 2022

PsiQuantum, founded in 2016 by four researchers with roots at Bristol University, Stanford University, and York University, is one of a few quantum computing startups that’s kept a moderately low PR profile. (That’s if you disregard the roughly $700 million in funding it has attracted.) The main reason is PsiQuantum has eschewed the clamorous public chase for... Read more…

Leading Solution Providers

Contributors

Nvidia Dominates MLPerf Inference, Qualcomm also Shines, Where’s Everybody Else?

April 6, 2022

MLCommons today released its latest MLPerf inferencing results, with another strong showing by Nvidia accelerators inside a diverse array of systems. Roughly fo Read more…

D-Wave to Go Public with SPAC Deal; Expects ~$1.6B Market Valuation

February 8, 2022

Quantum computing pioneer D-Wave today announced plans to go public via a SPAC (special purpose acquisition company) mechanism. D-Wave will merge with DPCM Capital in a transaction expected to produce $340 million in cash and result in a roughly $1.6 billion initial market valuation. The deal is expected to be completed in the second quarter of 2022 and the new company will be traded on the New York Stock... Read more…

Intel Announces Falcon Shores CPU-GPU Combo Architecture for 2024

February 18, 2022

Intel held its 2022 investor meeting yesterday, covering everything from the imminent Sapphire Rapids CPUs to the hotly anticipated (and delayed) Ponte Vecchio GPUs. But somewhat buried in its summary of the meeting was a new namedrop: “Falcon Shores,” described as “a new architecture that will bring x86 and Xe GPU together into a single socket.” The reveal was... Read more…

Industry Consortium Forms to Drive UCIe Chiplet Interconnect Standard

March 2, 2022

A new industry consortium aims to establish a die-to-die interconnect standard – Universal Chiplet Interconnect Express (UCIe) – in support of an open chipl Read more…

Julia Update: Adoption Keeps Climbing; Is It a Python Challenger?

January 13, 2021

The rapid adoption of Julia, the open source, high level programing language with roots at MIT, shows no sign of slowing according to data from Julialang.org. I Read more…

Nvidia Acquires Software-Defined Storage Provider Excelero

March 7, 2022

Nvidia has announced that it has acquired Excelero. The high-performance block storage provider, founded in 2014, will have its technology integrated into Nvidia’s enterprise software stack. Nvidia is not disclosing the value of the deal. Excelero’s core product, Excelero NVMesh, offers software-defined block storage via networked NVMe SSDs. NVMesh operates through... Read more…

India Launches Petascale ‘PARAM Ganga’ Supercomputer

March 8, 2022

Just a couple of weeks ago, the Indian government promised that it had five HPC systems in the final stages of installation and would launch nine new supercomputers this year. Now, it appears to be making good on that promise: the country’s National Supercomputing Mission (NSM) has announced the deployment of “PARAM Ganga” petascale supercomputer at Indian Institute of Technology (IIT)... Read more…

Google Launches TPU v4 AI Chips

May 20, 2021

Google CEO Sundar Pichai spoke for only one minute and 42 seconds about the company’s latest TPU v4 Tensor Processing Units during his keynote at the Google I Read more…

  • arrow
  • Click Here for More Headlines
  • arrow
HPCwire