MILPITAS, Calif., March 31, 2020 — Global semiconductor materials market revenues edged down 1.1 percent in 2019, SEMI, the global industry association representing the electronics manufacturing and design supply chain, reported today in its Materials Market Data Subscription (MMDS).
While worldwide total wafer fabrication materials logged a slight decrease of 0.4 percent, from $33.0 billion to $32.8 billion, wafer fab materials, process chemicals, sputtering targets, and CMP registered declines of more than 2 percent year-over-year (YoY). Packaging materials slipped 2.3 percent, from $19.7 billion to $19.2 billion, in 2019. The only two categories to notch increases last year were substrate and other packaging materials.
For the 10th consecutive year, Taiwan, at $11.3 billion, was the largest consumer of semiconductor materials on the strength of its large foundry and advanced packaging base. Korea remained in the second spot, while, China, the only materials market to register an increase in 2019, was third. All other regions saw flat revenue or low single-digit declines.
Note: Summed subtotals may not equal the total due to rounding.
* The ROW region is defined as Singapore, Malaysia, Philippines, other areas of Southeast Asia and smaller global markets.
** 2018 data have been updated based on SEMI data collection programs.
The SEMI Materials Market Data Subscription (MMDS) provides current revenue data along with seven years of historical data and a two-year forecast. The annual subscription includes four quarterly updates for the materials segment and reports revenue for seven market regions (North America, Europe, ROW, Japan, Taiwan, South Korea, and China). The report also features detailed historical data for silicon shipments and revenues for photoresist, photoresist ancillaries, process gases and leadframes.
For more information or to subscribe, please contact the SEMI Industry Research and Statistics Group at [email protected] .
SEMI connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter .