April 16, 2020 — The Hot Chips conference organizing committee has confirmed that there will be a conference in 2020. The dates are set for August 16-18, 2020.
The conference format is not yet confirmed. Hot Chips is preparing to conduct a virtual only conference. Hot Chips is closely monitoring the health and travel situation expected in August and will decide if a physical format will be an option. The event website will be updated with the latest information. The safety and well-being of all conference participants is the top priority.
If you have any questions or need additional information, email for further details: [email protected]
Call for Submissions – Important Dates
- Submission Date: April 6, 2020
- Acceptance Notification: May 1, 2020
- Final Version Due: July 17, 2020
- Submissions Due: July 3, 2020
- Acceptance Notification: TBD
Areas of Interest:
- General-Purpose Processor Chips
- High Performance and Low Power
- Multi-Core, Highly-Reliable Systems
- Mobile and Embedded Devices
- SoC, Security, and DSP Chips
- Communications and Networking
- Wireless LAN/WAN/PAN
- Network and IO Processors
- Emerging Computation Architectures
- Machine Learning, Vision and Graphics/Compute Engines
- Data Analytics and Big Data processing
- IoT and Always-On Functions
- Neuromorphic and Quantum Computing
- Other Chips
- FPGAs and FPGA-Based Systems
- Custom Chips for Emerging Applications
- Open-Source Chips
- Other Technologies
- Power and Thermal Management
- Packaging and Testing
- Display Technologies
- On-Chip Optics & Sensors
- Novel Computing Technologies
- Memory Technologies
- Persistent Memory, Phase Change
- Packaging, 3D, Stacked
- Software for Multi-core, Heterogeneous Systems
- Programming models, Runtime systems
- Performance, Power Debug and Evaluation
Submissions must consist of the following:
- “Presentation” or “Poster”
- Extended abstract (two pages maximum)
- Presenter’s contact information (name, affiliation, job title, address, phone(s), fax, and email)
- Indication whether you have submitted, intend to submit, or have already presented or published a similar or overlapping submission to another conference or journal.
- Indication if you would like the submission to be held confidential.
Regular presentation and poster submissions are evaluated by the Program Committee on the basis of: performance of the device(s), degree of innovation, use of advanced technology, potential market significance and anticipated interest to the audience. Both regular presentation slides and posters are published in the Hot Chips proceedings.
Presentations at HOT CHIPS are in the form of 30 minute talks using PowerPoint or PDF. Presentation slides will be published in the HOT CHIPS Proceedings. Participants are not required to submit written papers, but a select group will be invited to submit a paper for inclusion in a special issue of IEEE Micro.
Poster submissions are also accepted from both industry and academia and consist of 4 slides with a one- page summary. In particular, student posters describing applied research performed at a university are encouraged. The most outstanding student poster will receive the Best Student Poster Award.
More information about Call for Contributions.
Source: Hot Chips