Feb. 28, 2020 — This year’s Hot Chips 32 (2020) will be held at Stanford University in Palo Alto, Calif., on August 16-18, 2020. The submission deadline for papers is March 23, and the submission deadline for posters is July 3, 2020.
The Hot Chips conference typically attracts more than 500 attendees from all over the world. It provides an opportunity for chip designers, computer architects, system engineers, press and analysts, as well as attendees from national laboratories and academia to mix, mingle and see presentations on the latest technologies and products. The three days of the conference typically feature two tutorials, two keynotes, a panel discussion and around 25 presentations on a variety of subjects related to microprocessors and integrated circuits.
Both regular presentation slides and posters are published in the Hot Chips proceedings. Each regular presentation and poster submissions are evaluated by the Program Committee on the basis of:
- Performance of the device(s),
- Degree of innovation,
- Use of advanced technology,
- Potential market significance, and
- Anticipated interest to the audience
Presentation Guidelines
Presentations at HOT CHIPS are in the form of 30-minute talks using PowerPoint or PDF. Presentation slides will be published in the HOT CHIPS Proceedings. Participants are not required to submit written papers, but a select group will be invited to submit a paper for inclusion in a special issue of IEEE Micro.
Poster Guidelines
Poster submissions are also accepted from both industry and academia and consist of 4 slides with a one- page summary. In particular, student posters describing applied research performed at a university are encouraged. The most outstanding student poster will receive the Best Student Poster Award.
Areas of Interest:
- General-Purpose Processor Chips
- High Performance and Low Power
- Multi-Core, Highly-Reliable Systems
- Mobile and Embedded Devices
- Graphics/Multimedia/Game
- SoC, Security, and DSP Chips
- Communications and Networking
- Wireless LAN/WAN/PAN
- Network and IO Processors
- Emerging Computation Architectures
- Machine Learning, Vision and Graphics/Compute Engines
- Data Analytics and Big Data processing
- IoT and Always-On Functions
- Neuromorphic and Quantum Computing
- Other Chips
- FPGAs and FPGA-Based Systems
- Custom Chips for Emerging Applications
- Open-Source Chips
- Other Technologies
- Power and Thermal Management
- Packaging and Testing
- Display Technologies
- On-Chip Optics & Sensors
- Novel Computing Technologies
- Memory Technologies
- Persistent Memory, Phase Change
- Packaging, 3D, Stacked
- Software for Multi-core, Heterogeneous Systems
- Programming models, Runtime systems
- Performance, Power Debug and Evaluation
For full details on submission guidelines and the conference, visit: https://www.hotchips.org/
For any program related questions or comments, please contact the Program Committee Co-Chairs at [email protected]
Source: Hot Chips