Hot Chips 34: Call for Presentations

January 18, 2022

Jan. 18, 2022 — 2022’s Hot Chips 34 is now seeking submissions, the deadline for which is March 22. The event will be held in Silicon Valley in August with exact location details and dates TBD. The last two years Hot Chips has been held as an online event.

The Hot Chips conference typically attracts more than 500 attendees from all over the world. It provides an opportunity for chip designers, computer architects, system engineers, press and analysts, as well as attendees from national laboratories and academia to mix, mingle and see presentations on the latest technologies and products. The three days of the conference typically feature two tutorials, two keynotes, a panel discussion and around 25 presentations on a variety of subjects related to microprocessors and integrated circuits.

Submissions are evaluated by the program committee on the basis of:

  • Performance of the device(s),
  • Degree of innovation,
  • Use of advanced technology,
  • Potential market significance, and
  • Anticipated interest to the audience

Research and software contributions will be evaluated with similar criteria. To the extent that you are describing a product, indicate its status—design, development, tape out, silicon, shipping, etc.

Schedule for Submissions

Deadline for submissions: March 22, 2022

Notification of acceptance: May 2, 2022

Deadline for final version: July 15, 2022

Deadline for poster submissions: April 28, 2022

Presentation Guidelines

Presentations at Hot Chips are in the form of 30-minute talks. Presentation slides will be published in the Hot Chips proceedings. Participants are not required to submit written papers, but a select group will be invited to submit a paper for inclusion in a special issue of the IEEE MICRO journal.

Poster Guidelines

Poster submissions are also accepted from both industry and academia, and consist of 4 slides with a one-page summary. In particular, student posters describing applied research performed at a university are encouraged. The most outstanding student poster will receive a Best Student Poster Award.

Areas of Interest

  • General-Purpose Processor Chips

    • High-Performance, Low-Power

    • Multi-Core and Highly-Reliable Systems

  • Domain-Specific Chips

    • Machine Learning, Vision and Graphics Chips

    • Data Analytics and Big Data Processing

    • IoT and Always-On Functions

    • Custom Chips for Emerging Applications

  • Reconfigurable Chips

    • FPGAs and FPGA-Based Systems

    • Coarse-Grained Reconfigurable Arrays

  • Security

    • Secure Hardware

    • Hardware Support for Software Security

  • Mobile and Embedded Devices

    • Graphics/Multimedia/Gaming

    • SoC, Security, and DSP Chips

  • Communications and Networking

    • Wireless LAN/WAN/PAN

    • Network and I/O Processors

  • Emerging Computing Architectures

    • Neuromorphic

    • Quantum Computing

  • Memory Technologies

    • Persistent Memory, Phase Change

    • Packaging, 3D, Stacked

  • Other Enabling Technologies

    • Power and Thermal Management

    • Packaging and Testing

    • Display Technologies

    • On-Chip Optics & Sensors

    • Novel Computing Technologies

  • Software and Systems for Emerging Hardware

    • Programming Models, Runtime Systems

    • Performance, Power, Debug and Evaluation

Submissions must specify “Presentation,” “Poster” or “Student Poster.” Regular presentations consist of a title, extended abstract (two pages maximum) and the presenter’s contact information (name, affiliation, job title, address, phone(s), fax, and email). Please indicate whether you have submitted, intend to submit, or have already presented or published a similar or overlapping submission to another conference or journal. Also indicate if you would like the submission to be held confidential. If so indicated, these submissions remain confidential until the first day of the conference.

To submit, visit https://www.softconf.com/k/hotchips34.

See last year’s proceedings, here.


Source: Hot Chips

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