Oct. 13, 2021 — COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications.
The COOL Chips 25 is to be held in Tokyo on April 20-22, 2022, and is targeted at the architecture, design and implementation of chips and systems with special emphasis on the areas listed below. All papers are published online via IEEE Xplore.
Areas of Interest
Contributions are solicited in the following areas:
- Low Power-High Performance Processors and Systems for AI, IoT, Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.
- Novel Architectures and Schemes for Single Core, Multi/Many-Core, NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and 3D Integration.
- Cool Software including Parallel Schedulers, Embedded Real-time Operating System, Binary Translations, Compiler Issues and Low Power Application Techniques.
Call for Papers
Proposals should consist of a title, the name, job title, address, phone number and e-mail address of the presenter in a full paper format (6 pages) or an extended abstract format (up to 3 pages) describing the product or topic to be presented.
The status of the product or topic should precisely be described.
Proposals will be selected by the program committee’s evaluation of interest to the audience. Submission should be made through website. Detailed instructions are in author’s kit obtained from https://www.coolchips.org.
Author Schedule (Paper)
Feb. 11, 2022 Paper/Extended Abstract Submission (Web-site)
Mar. 18, 2022 Acceptance Notified (by e-mail)
Apr. 1, 2022 Final Manuscript Submission
Call for Posters
You are also invited to submit proposals for poster sessions.
Submission should be made through website. Detailed instructions are in author’s kit obtained from https://www.coolchips.org.
Author Schedule (Poster)
Mar. 25, 2022 Poster Abstract Submission (Website)
Mar. 28, 2022 Poster Acceptance Notified (by e-mail)
Given the on-going Covid-19 pandemic, there is currently uncertainty in the format of the Conference. However, the safety of our speakers and attendees will remain of paramount concern. Thus, we will be fully prepared to deliver a virtual conference.
For more information, please visit https://www.coolchips.org.