Imec and Cadence Tape Out Industry’s First 3nm Test Chip

February 28, 2018

LEUVEN, Belgium & SAN JOSE, Calif., Feb. 28 — The world-leading research and innovation hub in nanoelectronics and digital technologies, imec, and Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its extensive, long-standing collaboration has resulted in the industry’s first 3nm test chip tapeout. The tapeout project, geared toward advancing 3nm chip design, was completed using extreme ultraviolet (EUV) and 193 immersion (193i) lithography-oriented design rules and the Cadence Innovus Implementation System and Genus Synthesis Solution. Imec utilized a common industry 64-bit CPU for the test chip with a custom 3nm standard cell library and a TRIM metal flow, where the routing pitch was reduced to 21nm. Together, Cadence and imec have enabled the 3nm implementation flow to be fully validated in preparation for next-generation design innovation.

Post place and route layout of 21 nm pitch metal layers

The Cadence Innovus Implementation System is a massively parallel physical implementation system that enables engineers to deliver high-quality designs with optimal power, performance and area (PPA) targets while accelerating time to market. The Cadence Genus Synthesis Solution is a next-generation, high-capacity RTL synthesis and physical synthesis engine that addresses the latest FinFET process node requirements, improving RTL designer productivity by up to 10X. For more information on the Innovus Implementation System, please visit www.cadence.com/go/innovus3nm, and to learn about the Genus Synthesis Solution, visit www.cadence.com/go/genus3nm.

For the project, EUV and 193i lithography rules were tested to provide the required resolution, while providing PPA comparison under two different patterning assumptions. For more information on EUV technology and 193i technology, visit https://www.imec-int.com/en/articles/imec-presents-patterning-solutions-for-n5-equivalent-metal-layers.

“As process dimensions reduce to the 3nm node, interconnect variation becomes much more significant,” said An Steegen, executive vice president for semiconductor technology and systems at imec. “Our work on the test chip has enabled interconnect variation to be measured and improved and the 3nm manufacturing process to be validated. Also, the Cadence digital solutions offered everything needed for this 3nm implementation. Due to Cadence’s well-integrated flow, the solutions were easy to use, which helped our engineering team stay productive when developing the 3nm rule set.”

“Imec’s state-of-the-art infrastructure enables pre-production innovations ahead of industry demands, making them a critical partner for us in the EDA industry,” said Dr. Chin-Chi Teng, corporate vice president and general manager in the Digital & Signoff Group at Cadence. “Expanding upon the work we did with imec in 2015 on the industry’s first 5nm tapeout, we are achieving new milestones together with this new 3nm tapeout, which can transform the future of mobile designs at advanced nodes.”

About Cadence

Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine’s 100 Best Companies to Work For. Learn more at cadence.com.

About imec

Imec is the world-leading research and innovation hub in nanoelectronics and digital technologies. The combination of our widely acclaimed leadership in microchip technology and profound software and ICT expertise is what makes us unique. By leveraging our world-class infrastructure and local and global ecosystem of partners across a multitude of industries, we create groundbreaking innovation in application domains such as healthcare, smart cities and mobility, logistics and manufacturing, energy and education.

As a trusted partner for companies, start-ups and universities we bring together close to 3,500 brilliant minds from over 70 nationalities. Imec is headquartered in Leuven, Belgium and has distributed R&D groups at a number of Flemish universities, in the Netherlands, Taiwan, USA, China, and offices in India and Japan. In 2016, imec’s revenue (P&L) totaled 496 million euro. Further information on imec can be found at www.imec-int.com.


Source: Imec; Cadence Design Systems, Inc. 

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industy updates delivered to you every week!

At Long Last, Supercomputing Helps to Map the Poles

August 22, 2019

For years,” Paul Morin wrote, “those of us that made maps of the Poles apologized. We apologized for the blank spaces on maps, we apologized for mountains being in the wrong place... Read more…

By Oliver Peckham

Xilinx Says Its New FPGA is World’s Largest

August 21, 2019

In this age of exploding “technology disaggregation” – in which the Big Bang emanating from the Intel x86 CPU has produced significant advances in CPU chips and a raft of alternative, accelerated architectures... Read more…

By Doug Black

Supercomputers Generate Universes to Illuminate Galactic Formation

August 20, 2019

With advanced imaging and satellite technologies, it’s easier than ever to see a galaxy – but understanding how they form (a process that can take billions of years) is a different story. Now, a team of researchers f Read more…

By Oliver Peckham

AWS Solution Channel

Efficiency and Cost-Optimization for HPC Workloads – AWS Batch and Amazon EC2 Spot Instances

High Performance Computing on AWS leverages the power of cloud computing and the extreme scale it offers to achieve optimal HPC price/performance. With AWS you can right size your services to meet exactly the capacity requirements you need without having to overprovision or compromise capacity. Read more…

HPE Extreme Performance Solutions

Bring the combined power of HPC and AI to your business transformation

FPGA (Field Programmable Gate Array) acceleration cards are not new, as they’ve been commercially available since 1984. Typically, the emphasis around FPGAs has centered on the fact that they’re programmable accelerators, and that they can truly offer workload specific hardware acceleration solutions without requiring custom silicon. Read more…

IBM Accelerated Insights

Keys to Attracting the Newest HPC Talent – Post-Millennials

[Connect with HPC users and learn new skills in the IBM Spectrum LSF User Community.]

For engineers and scientists growing up in the 80s, the current state of HPC makes perfect sense. Read more…

Singularity Moves Up the Container Value Chain

August 20, 2019

The enterprise version of the Singularity HPC container platform released this week by Sylabs is designed to allow users to create, secure and share the high-end containers in self-hosted production deployments. The e Read more…

By George Leopold

At Long Last, Supercomputing Helps to Map the Poles

August 22, 2019

For years,” Paul Morin wrote, “those of us that made maps of the Poles apologized. We apologized for the blank spaces on maps, we apologized for mountains being in the wrong place... Read more…

By Oliver Peckham

IBM Deepens Plunge into Open Source; OpenPOWER to Join Linux Foundation

August 20, 2019

IBM today announced it was contributing the instruction set (ISA) for its Power microprocessor and the designs for the Open Coherent Accelerator Processor Inter Read more…

By John Russell

Ayar Labs to Demo Photonics Chiplet in FPGA Package at Hot Chips

August 19, 2019

Silicon startup Ayar Labs continues to gain momentum with its DARPA-backed optical chiplet technology that puts advanced electronics and optics on the same chip Read more…

By Tiffany Trader

Scientists to Tap Exascale Computing to Unlock the Mystery of our Accelerating Universe

August 14, 2019

The universe and everything in it roared to life with the Big Bang approximately 13.8 billion years ago. It has continued expanding ever since. While we have a Read more…

By Rob Johnson

AI is the Next Exascale – Rick Stevens on What that Means and Why It’s Important

August 13, 2019

Twelve years ago the Department of Energy (DOE) was just beginning to explore what an exascale computing program might look like and what it might accomplish. Today, DOE is repeating that process for AI, once again starting with science community town halls to gather input and stimulate conversation. The town hall program... Read more…

By Tiffany Trader and John Russell

Cray Wins NNSA-Livermore ‘El Capitan’ Exascale Contract

August 13, 2019

Cray has won the bid to build the first exascale supercomputer for the National Nuclear Security Administration (NNSA) and Lawrence Livermore National Laborator Read more…

By Tiffany Trader

AMD Launches Epyc Rome, First 7nm CPU

August 8, 2019

From a gala event at the Palace of Fine Arts in San Francisco yesterday (Aug. 7), AMD launched its second-generation Epyc Rome x86 chips, based on its 7nm proce Read more…

By Tiffany Trader

Lenovo Drives Single-Socket Servers with AMD Epyc Rome CPUs

August 7, 2019

No summer doldrums here. As part of the AMD Epyc Rome launch event in San Francisco today, Lenovo announced two new single-socket servers, the ThinkSystem SR635 Read more…

By Doug Black

High Performance (Potato) Chips

May 5, 2006

In this article, we focus on how Procter & Gamble is using high performance computing to create some common, everyday supermarket products. Tom Lange, a 27-year veteran of the company, tells us how P&G models products, processes and production systems for the betterment of consumer package goods. Read more…

By Michael Feldman

Supercomputer-Powered AI Tackles a Key Fusion Energy Challenge

August 7, 2019

Fusion energy is the Holy Grail of the energy world: low-radioactivity, low-waste, zero-carbon, high-output nuclear power that can run on hydrogen or lithium. T Read more…

By Oliver Peckham

Cray, AMD to Extend DOE’s Exascale Frontier

May 7, 2019

Cray and AMD are coming back to Oak Ridge National Laboratory to partner on the world’s largest and most expensive supercomputer. The Department of Energy’s Read more…

By Tiffany Trader

Graphene Surprises Again, This Time for Quantum Computing

May 8, 2019

Graphene is fascinating stuff with promise for use in a seeming endless number of applications. This month researchers from the University of Vienna and Institu Read more…

By John Russell

AMD Verifies Its Largest 7nm Chip Design in Ten Hours

June 5, 2019

AMD announced last week that its engineers had successfully executed the first physical verification of its largest 7nm chip design – in just ten hours. The AMD Radeon Instinct Vega20 – which boasts 13.2 billion transistors – was tested using a TSMC-certified Calibre nmDRC software platform from Mentor. Read more…

By Oliver Peckham

TSMC and Samsung Moving to 5nm; Whither Moore’s Law?

June 12, 2019

With reports that Taiwan Semiconductor Manufacturing Co. (TMSC) and Samsung are moving quickly to 5nm manufacturing, it’s a good time to again ponder whither goes the venerable Moore’s law. Shrinking feature size has of course been the primary hallmark of achieving Moore’s law... Read more…

By John Russell

Cray Wins NNSA-Livermore ‘El Capitan’ Exascale Contract

August 13, 2019

Cray has won the bid to build the first exascale supercomputer for the National Nuclear Security Administration (NNSA) and Lawrence Livermore National Laborator Read more…

By Tiffany Trader

Deep Learning Competitors Stalk Nvidia

May 14, 2019

There is no shortage of processing architectures emerging to accelerate deep learning workloads, with two more options emerging this week to challenge GPU leader Nvidia. First, Intel researchers claimed a new deep learning record for image classification on the ResNet-50 convolutional neural network. Separately, Israeli AI chip startup Hailo.ai... Read more…

By George Leopold

Leading Solution Providers

ISC 2019 Virtual Booth Video Tour

CRAY
CRAY
DDN
DDN
DELL EMC
DELL EMC
GOOGLE
GOOGLE
ONE STOP SYSTEMS
ONE STOP SYSTEMS
PANASAS
PANASAS
VERNE GLOBAL
VERNE GLOBAL

Nvidia Embraces Arm, Declares Intent to Accelerate All CPU Architectures

June 17, 2019

As the Top500 list was being announced at ISC in Frankfurt today with an upgraded petascale Arm supercomputer in the top third of the list, Nvidia announced its Read more…

By Tiffany Trader

Top500 Purely Petaflops; US Maintains Performance Lead

June 17, 2019

With the kick-off of the International Supercomputing Conference (ISC) in Frankfurt this morning, the 53rd Top500 list made its debut, and this one's for petafl Read more…

By Tiffany Trader

AMD Launches Epyc Rome, First 7nm CPU

August 8, 2019

From a gala event at the Palace of Fine Arts in San Francisco yesterday (Aug. 7), AMD launched its second-generation Epyc Rome x86 chips, based on its 7nm proce Read more…

By Tiffany Trader

A Behind-the-Scenes Look at the Hardware That Powered the Black Hole Image

June 24, 2019

Two months ago, the first-ever image of a black hole took the internet by storm. A team of scientists took years to produce and verify the striking image – an Read more…

By Oliver Peckham

Cray – and the Cray Brand – to Be Positioned at Tip of HPE’s HPC Spear

May 22, 2019

More so than with most acquisitions of this kind, HPE’s purchase of Cray for $1.3 billion, announced last week, seems to have elements of that overused, often Read more…

By Doug Black and Tiffany Trader

Chinese Company Sugon Placed on US ‘Entity List’ After Strong Showing at International Supercomputing Conference

June 26, 2019

After more than a decade of advancing its supercomputing prowess, operating the world’s most powerful supercomputer from June 2013 to June 2018, China is keep Read more…

By Tiffany Trader

In Wake of Nvidia-Mellanox: Xilinx to Acquire Solarflare

April 25, 2019

With echoes of Nvidia’s recent acquisition of Mellanox, FPGA maker Xilinx has announced a definitive agreement to acquire Solarflare Communications, provider Read more…

By Doug Black

Qualcomm Invests in RISC-V Startup SiFive

June 7, 2019

Investors are zeroing in on the open standard RISC-V instruction set architecture and the processor intellectual property being developed by a batch of high-flying chip startups. Last fall, Esperanto Technologies announced a $58 million funding round. Read more…

By George Leopold

  • arrow
  • Click Here for More Headlines
  • arrow
Do NOT follow this link or you will be banned from the site!
Share This