May 30, 2023 — Dr. Dongkai Shangguan, a Strategic Advisor at Indium Corporation, is scheduled to give a keynote speech at NordPac, a conference organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference will take place from June 12 to June 14 in Oslo, Norway.
Dr. Shangguan’s speech, titled “Interconnect Reliability: From the Chip to the System,” will discuss the significant role of interconnect reliability in the integrity of semiconductor packaging and electronic systems. As the technology evolves, newer, more complex forms of interconnects are emerging to meet the demand for high performance and high density in this field. The increase in heterogeneous integration leads to a larger variety of interconnects within the same package, leading to more complex failure modes and mechanisms.
“As an international gathering of microelectronics packaging experts, from both academia and industry, NordPac is a tremendously valuable forum for discussing the groundbreaking research taking place throughout the field,” said Dr. Shangguan. “I am honored that IMAPS has invited me to deliver a keynote presentation to my esteemed colleagues at this important event.”
Dr. Shangguan is a Strategic Advisor to Indium Corporation. In this role, he works on specific trends related to the advanced semiconductor packaging and SMT industries, and applies his significant industry experience to supporting customers. Dr. Shangguan is an IEEE Fellow and IMAPS Fellow, and has served on the boards of directors for several professional organizations and industry associations, including IPC, IEEE EPS, and iNEMI. He also served as a Distinguished Lecturer for IEEE EPS.
He has been honored with some of the industry’s most prestigious awards, including IPC’s President’s Award, the Society of Manufacturing Engineers’ (SME) Total Excellence in Electronics Manufacturing Award, the Outstanding Sustained Technical Contribution Award from IEEE EPS, and the William D. Ashman Achievement Award from IMAPS, among others. Dr. Shangguan received a bachelor’s degree in mechanical engineering from Tsinghua University, China, an MBA from San Jose State University, Calif., and a Ph.D. in materials from the University of Oxford, U.K. He has held postdoctoral positions at the University of Cambridge, U.K., and the University of Alabama, and has served as a guest professor at several universities. Dr. Shangguan has published two books, more than 200 scientific papers and technical articles, and has given numerous presentations to share knowledge and expertise with the industry. He is the inventor/co-inventor of 30 U.S. patents and several foreign patents.
About Indium Corporation
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through premier professional events, an exclusive microelectronics packaging research library, local chapter networks, and other efforts. Founded in 1967 as ISHM, then merging with the International Electronic and Packaging Society (IEPS) in 1996, the Society has over 50 years of networking, education, and publication history.
Source: Indium Corporation