Inspur Launches Full-Stack Liquid-Cooled Server Solutions

July 6, 2022

SAN JOSE, Calif., July 6, 2022 — Inspur Information, a leading IT infrastructure solutions provider, is rolling out full-stack liquid-cooled products, with cold plate liquid-cooling technology being available in all of its products including general-purpose servers, high-density servers, rack servers, and AI servers. This is another major step in Inspur Information’s march towards being carbon neutral following its unveiling of Asia’s largest development and manufacturing facility for liquid-cooled data centers.

As Green, low-carbon and sustainable development has become the international consensus, nearly 130 countries and regions around the world have set the goal of being carbon neutral. In 2022, with “All in Liquid-Cooling” incorporated into its strategy, Inspur Information has incorporated cold plate liquid-cooling technology into all of its products (general-purpose servers, high-density servers, rack servers, and AI servers), which can be fully customized for a diverse array of scenarios.

Inspur Information’s liquid-cooled general-purpose servers are adaptable to a wide range of scenarios due to their high flexibility. NF5280M6 is a 2U general-purpose flagship product powered by third-generation Intel Xeon Scalable processors. Its superior configuration flexibility makes highly adaptable to workloads in the ten most typical usage scenarios. It is compatible with both air-cooled and liquid-cooled technologies. Cold-plate liquid-cooling technology reduces its power consumption for cooling by 80%, greatly improving reliability, availability, and serviceability (RAS). With its liquid-cooling connectors supporting a variety of mainstream liquid-cooling devices of various specifications and standards, NF5280M6 allows the delivery of rack solutions while offering greater flexibility in decoupling from liquid-cooled racks. NF5260FM6 is an innovative general-purpose server designed for large data centers. Its hybrid air-liquid cooling system supports a liquid-cooling mode for high-power consumption modules, such as processors, and an air-cooling mode for low-power consumption modules, such as drives and I/O cards. This helps strike a perfect balance between performance, maintainability and cost-effectiveness, ensuring energy efficiency, and reducing data center TCO.

Inspur Information Full-Stack Liquid-Cooled Server Solutions. Click to enhance.

To respond to the demand of large data centers for higher cooling efficiency and lower energy consumption, Inspur Information developed the liquid-cooled rack server ORS3000S based on its experience in open-computing rack servers. Powered by cool-plate liquid cooling technology, it increases cooling efficiency by 50%. It features a centralized power supply design with N+N redundancy, allowing power for multiple nodes, and ensuring the highest power supply efficiency at all times thanks to dynamic power balancing and optimization technology. Compared to products that use a distributed power supply, it has a 10% higher overall efficiency. It also supports integrated deployment of computing, storage, and networking modules. It also enables efficient maintenance and deployment, shortening the delivery cycle by 5-10 times. The product has been deployed on a large scale in JD Cloud data centers, providing computing power for online shopping festivals with increased performance of 34%–56%, lower PUE (Power Usage Effectiveness), and reduced carbon emissions.

Universities and research institutes, which play a leading role in scientific research, have been actively promoting the development and application of AI. Building the ultra-high computing power required for AI and accelerating its implementation for research is a major priority. To satisfy the demands of applications such as simulation and R&D, Inspur Information launched several liquid-cooled high-density servers. The i24LM6 server supports 4 dual-socket nodes in a 2U space, and provides computing power of 447.5 TFLOPS in a single rack. It can operate stably and maintain high performance for an extended period of time. It can adapt to various environments, including those with high temperatures and high altitude, and provides exceptional cooling performance for CPUs with high power consumption. With warm-water cooling technology and a CPU+VR+DIMM liquid-cooling plate, it has a PUE below 1.1, which significantly reduces cooling costs. It also supports a removable air-liquid CDU to allow easy deployment. The liquid-cooled rack is also integrated with an intelligent monitoring system that sends alerts when a leakage is detected so early action can be taken.

In addition, Inspur Information launched liquid-cooled AI servers to cater to the diverse demands for computing power in the AI field. NF5688LM6 supports eight NVIDIA A100 Tensor Core GPUs with NVIDIA NVLink technology to deliver maximum GPU computing power. It comes with 13 PCIe expansion slots to provide industry-leading PCIe expandability for the training of massive AI models. Moreover, the modular design of the CPU and GPU cold plates improves ease of installation and maintenance.

NF5498LA5 is the industry’s first liquid-cooled AI server designed for open accelerated computing. It supports OAM-compliant accelerators from multiple manufacturers and has a PUE as low as 1.1. The high-bandwidth fully-connected topological structure enables the direct interaction between any two OAMs and provides peer-to-peer bandwidth of up to 896 GB/s.

Driving the industrialization of liquid cooling and providing end-to-end services for one-stop intelligent manufacturing

Inspur Information works with local partners to deliver the best end-to-end liquid cooling solutions, covering the entire lifecycle from design and consultation to product customization, delivery and deployment. This remains true for a variety of complex needs in data center construction, whether it is building a new modular liquid-cooled data center or a prefabricated liquid-cooled data center, or renovating existing air-cooled or liquid-cooled data centers.

Inspur Information also built Asia’s largest development and manufacturing facility for liquid-cooled data centers to drive the large-scale application and industrialization of liquid cooling technology. The facility, which is dedicated to the design, manufacturing and testing of liquid-cooled servers uses intelligent manufacturing that covers the entire process from R&D to testing, manufacturing, quality control, and delivery. With an annual capacity of 100,000 servers, the facility is the first in the industry to achieve mass delivery of liquid-cooled rack servers with a total delivery cycle of 5-7 days, helping data centers reduce their PUE to below 1.1.

In its journey to build green data centers, Inspur Information goes beyond developing energy-saving servers to deliver complete energy-saving solutions for data centers by pushing the limits in the industrial chain, not just in technologies. One-stop intelligent manufacturing of liquid-cooled products paves the way for Inspur Information to develop liquid-cooled complete system solutions and projects.

About Inspur Information

Inspur Information is a leading provider of data center infrastructure, cloud computing, and AI solutions. It is the world’s 2nd largest server manufacturer. Through engineering and innovation, Inspur Information delivers cutting-edge computing hardware design and extensive product offerings to address important technology sectors such as open computing, cloud data center, AI, and deep learning. Performance-optimized and purpose-built, our world-class solutions empower customers to tackle specific workloads and real-world challenges. To learn more, visit https://www.inspursystems.com.


Source: Inspur

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industy updates delivered to you every week!

SC22 Unveils ACM Gordon Bell Prize Finalists

August 12, 2022

Courtesy of the schedule for the SC22 conference, we now have our first glimpse at the finalists for this year’s coveted Gordon Bell Prize. The Gordon Bell Prize, of course, comes with an award of $10,000 courtesy of H Read more…

Q&A with ORNL’s Bronson Messer, an HPCwire Person to Watch in 2022

August 12, 2022

HPCwire presents our interview with Bronson Messer, distinguished scientist and director of Science at the Oak Ridge Leadership Computing Facility (OLCF), ORNL, and an HPCwire 2022 Person to Watch. Messer recaps ORNL's journey to exascale and sheds light on how all the pieces line up to support the all-important science. Also covered are the role... Read more…

TACC Simulations Probe the First Days of Stars, Black Holes

August 12, 2022

The stunning images produced by the James Webb Space Telescope and recent supercomputer-enabled black hole imaging efforts have brought the early days of the universe quite literally into sharp focus. Researchers from th Read more…

Google Program to Free Chips Boosts University Semiconductor Design

August 11, 2022

A Google-led program to design and manufacture chips for free is becoming popular among researchers and computer enthusiasts. The search giant's open silicon program is providing the tools for anyone to design chips, which then get manufactured. Google foots the entire bill, from a chip's conception to delivery of the final product in a user's hand. Google's... Read more…

Argonne Deploys Polaris Supercomputer for Science in Advance of Aurora

August 9, 2022

Argonne National Laboratory has made its newest supercomputer, Polaris, available for scientific research. The system, which ranked 14th on the most recent Top500 list, is serving as a testbed for the exascale Aurora system slated for delivery in the coming months. The HPE-built Polaris system (pictured in the header) consists of 560 nodes... Read more…

AWS Solution Channel

Shutterstock 1519171757

Running large-scale CFD fire simulations on AWS for Amazon.com

This post was contributed by Matt Broadfoot, Senior Fire Strategy Manager at Amazon Design and Construction, and Antonio Cennamo ProServe Customer Practice Manager, Colin Bridger Principal HPC GTM Specialist, Grigorios Pikoulas ProServe Strategic Program Leader, Neil Ashton Principal, Computational Engineering Product Strategy, Roberto Medar, ProServe HPC Consultant, Taiwo Abioye ProServe Security Consultant, Talib Mahouari ProServe Engagement Manager at AWS. Read more…

Microsoft/NVIDIA Solution Channel

Shutterstock 1689646429

Gain a Competitive Edge using Cloud-Based, GPU-Accelerated AI KYC Recommender Systems

Financial services organizations face increased competition for customers from technologies such as FinTechs, mobile banking applications, and online payment systems. To meet this challenge, it is important for organizations to have a deep understanding of their customers. Read more…

US CHIPS and Science Act Signed Into Law

August 9, 2022

Just a few days after it was passed in the Senate, the U.S. CHIPS and Science Act has been signed into law by President Biden. In a ceremony today, Biden signed and lauded the ambitious piece of legislation, which over the course of the legislative process broadened to include hundreds of billions in additional science and technology spending. He was flanked by Speaker... Read more…

Q&A with ORNL’s Bronson Messer, an HPCwire Person to Watch in 2022

August 12, 2022

HPCwire presents our interview with Bronson Messer, distinguished scientist and director of Science at the Oak Ridge Leadership Computing Facility (OLCF), ORNL, and an HPCwire 2022 Person to Watch. Messer recaps ORNL's journey to exascale and sheds light on how all the pieces line up to support the all-important science. Also covered are the role... Read more…

Google Program to Free Chips Boosts University Semiconductor Design

August 11, 2022

A Google-led program to design and manufacture chips for free is becoming popular among researchers and computer enthusiasts. The search giant's open silicon program is providing the tools for anyone to design chips, which then get manufactured. Google foots the entire bill, from a chip's conception to delivery of the final product in a user's hand. Google's... Read more…

Argonne Deploys Polaris Supercomputer for Science in Advance of Aurora

August 9, 2022

Argonne National Laboratory has made its newest supercomputer, Polaris, available for scientific research. The system, which ranked 14th on the most recent Top500 list, is serving as a testbed for the exascale Aurora system slated for delivery in the coming months. The HPE-built Polaris system (pictured in the header) consists of 560 nodes... Read more…

US CHIPS and Science Act Signed Into Law

August 9, 2022

Just a few days after it was passed in the Senate, the U.S. CHIPS and Science Act has been signed into law by President Biden. In a ceremony today, Biden signed and lauded the ambitious piece of legislation, which over the course of the legislative process broadened to include hundreds of billions in additional science and technology spending. He was flanked by Speaker... Read more…

12 Midwestern Universities Team to Boost Semiconductor Supply Chain

August 8, 2022

The combined stressors of Covid-19 and the invasion of Ukraine have sent every major nation scrambling to reinforce its mission-critical supply chains – including and in particular the semiconductor supply chain. In the U.S. – which, like much of the world, relies on Asia for its semiconductors – those efforts have taken shape through the recently... Read more…

Quantum Pioneer D-Wave Rings NYSE Bell, Begins Life as Public Company

August 8, 2022

D-Wave Systems, one of the early quantum computing pioneers, has completed its SPAC deal to go public. Its merger with DPCM Capital was completed last Friday, and today, D-Wave management rang the bell on the New York Stock Exchange. It is now trading under two ticker symbols – QBTS and QBTS WS (warrant shares), respectively. Welcome to the public... Read more…

Supercomputer Models Explosives Critical for Nuclear Weapons

August 6, 2022

Lawrence Livermore National Laboratory (LLNL) is one of the laboratories that operates under the auspices of the National Nuclear Security Administration (NNSA), which manages the United States’ stockpile of nuclear weapons. Amid major efforts to modernize that stockpile, LLNL has announced that researchers from its own Energetic Materials Center... Read more…

SEA Changes: How EuroHPC Is Preparing for Exascale

August 5, 2022

Back in June, the EuroHPC Joint Undertaking – which serves as the EU’s concerted supercomputing play – announced its first exascale system: JUPITER, set to be installed by the Jülich Supercomputing Centre (FZJ) in 2023. But EuroHPC has been preparing for the exascale era for a much longer time: eight months... Read more…

Nvidia R&D Chief on How AI is Improving Chip Design

April 18, 2022

Getting a glimpse into Nvidia’s R&D has become a regular feature of the spring GTC conference with Bill Dally, chief scientist and senior vice president of research, providing an overview of Nvidia’s R&D organization and a few details on current priorities. This year, Dally focused mostly on AI tools that Nvidia is both developing and using in-house to improve... Read more…

Royalty-free stock illustration ID: 1919750255

Intel Says UCIe to Outpace PCIe in Speed Race

May 11, 2022

Intel has shared more details on a new interconnect that is the foundation of the company’s long-term plan for x86, Arm and RISC-V architectures to co-exist in a single chip package. The semiconductor company is taking a modular approach to chip design with the option for customers to cram computing blocks such as CPUs, GPUs and AI accelerators inside a single chip package. Read more…

The Final Frontier: US Has Its First Exascale Supercomputer

May 30, 2022

In April 2018, the U.S. Department of Energy announced plans to procure a trio of exascale supercomputers at a total cost of up to $1.8 billion dollars. Over the ensuing four years, many announcements were made, many deadlines were missed, and a pandemic threw the world into disarray. Now, at long last, HPE and Oak Ridge National Laboratory (ORNL) have announced that the first of those... Read more…

US Senate Passes CHIPS Act Temperature Check, but Challenges Linger

July 19, 2022

The U.S. Senate on Tuesday passed a major hurdle that will open up close to $52 billion in grants for the semiconductor industry to boost manufacturing, supply chain and research and development. U.S. senators voted 64-34 in favor of advancing the CHIPS Act, which sets the stage for the final consideration... Read more…

Top500: Exascale Is Officially Here with Debut of Frontier

May 30, 2022

The 59th installment of the Top500 list, issued today from ISC 2022 in Hamburg, Germany, officially marks a new era in supercomputing with the debut of the first-ever exascale system on the list. Frontier, deployed at the Department of Energy’s Oak Ridge National Laboratory, achieved 1.102 exaflops in its fastest High Performance Linpack run, which was completed... Read more…

Newly-Observed Higgs Mode Holds Promise in Quantum Computing

June 8, 2022

The first-ever appearance of a previously undetectable quantum excitation known as the axial Higgs mode – exciting in its own right – also holds promise for developing and manipulating higher temperature quantum materials... Read more…

AMD’s MI300 APUs to Power Exascale El Capitan Supercomputer

June 21, 2022

Additional details of the architecture of the exascale El Capitan supercomputer were disclosed today by Lawrence Livermore National Laboratory’s (LLNL) Terri Read more…

PsiQuantum’s Path to 1 Million Qubits

April 21, 2022

PsiQuantum, founded in 2016 by four researchers with roots at Bristol University, Stanford University, and York University, is one of a few quantum computing startups that’s kept a moderately low PR profile. (That’s if you disregard the roughly $700 million in funding it has attracted.) The main reason is PsiQuantum has eschewed the clamorous public chase for... Read more…

Leading Solution Providers

Contributors

ISC 2022 Booth Video Tours

AMD
AWS
DDN
Dell
Intel
Lenovo
Microsoft
PENGUIN SOLUTIONS

Exclusive Inside Look at First US Exascale Supercomputer

July 1, 2022

HPCwire takes you inside the Frontier datacenter at DOE's Oak Ridge National Laboratory (ORNL) in Oak Ridge, Tenn., for an interview with Frontier Project Direc Read more…

AMD Opens Up Chip Design to the Outside for Custom Future

June 15, 2022

AMD is getting personal with chips as it sets sail to make products more to the liking of its customers. The chipmaker detailed a modular chip future in which customers can mix and match non-AMD processors in a custom chip package. "We are focused on making it easier to implement chips with more flexibility," said Mark Papermaster, chief technology officer at AMD during the analyst day meeting late last week. Read more…

Intel Reiterates Plans to Merge CPU, GPU High-performance Chip Roadmaps

May 31, 2022

Intel reiterated it is well on its way to merging its roadmap of high-performance CPUs and GPUs as it shifts over to newer manufacturing processes and packaging technologies in the coming years. The company is merging the CPU and GPU lineups into a chip (codenamed Falcon Shores) which Intel has dubbed an XPU. Falcon Shores... Read more…

Nvidia, Intel to Power Atos-Built MareNostrum 5 Supercomputer

June 16, 2022

The long-troubled, hotly anticipated MareNostrum 5 supercomputer finally has a vendor: Atos, which will be supplying a system that includes both Nvidia and Inte Read more…

India Launches Petascale ‘PARAM Ganga’ Supercomputer

March 8, 2022

Just a couple of weeks ago, the Indian government promised that it had five HPC systems in the final stages of installation and would launch nine new supercomputers this year. Now, it appears to be making good on that promise: the country’s National Supercomputing Mission (NSM) has announced the deployment of “PARAM Ganga” petascale supercomputer at Indian Institute of Technology (IIT)... Read more…

Is Time Running Out for Compromise on America COMPETES/USICA Act?

June 22, 2022

You may recall that efforts proposed in 2020 to remake the National Science Foundation (Endless Frontier Act) have since expanded and morphed into two gigantic bills, the America COMPETES Act in the U.S. House of Representatives and the U.S. Innovation and Competition Act in the U.S. Senate. So far, efforts to reconcile the two pieces of legislation have snagged and recent reports... Read more…

AMD Lines Up Alternate Chips as It Eyes a ‘Post-exaflops’ Future

June 10, 2022

Close to a decade ago, AMD was in turmoil. The company was playing second fiddle to Intel in PCs and datacenters, and its road to profitability hinged mostly on Read more…

Exascale Watch: Aurora Installation Underway, Now Open for Reservations

May 10, 2022

Installation has begun on the Aurora supercomputer, Rick Stevens (associate director of Argonne National Laboratory) revealed today during the Intel Vision event keynote taking place in Dallas, Texas, and online. Joining Intel exec Raja Koduri on stage, Stevens confirmed that the Aurora build is underway – a major development for a system that is projected to deliver more... Read more…

  • arrow
  • Click Here for More Headlines
  • arrow
HPCwire