Intel Announces New Details for Knights Landing

June 23, 2014

LEIPZIG, Germany, June 23 – Intel Corporation today announced new details for its next-generation Intel Xeon Phi processors, code-named Knights Landing, which promise to extend the benefits of code modernization investments being made for current generation products. These include a new high-speed fabric that will be integrated on-package and high-bandwidth, on-package memory that combined, promise to accelerate the rate of scientific discovery. Currently memory and fabrics are available as discrete components in servers limiting the performance and density of supercomputers.

The new interconnect technology, called Intel Omni Scale Fabric, is designed to address the requirements of the next generations of high-performance computing (HPC). Intel Omni Scale Fabric will be integrated in the next generation of Intel Xeon Phi processors as well as future general-purpose Intel Xeon processors. This integration along with the fabric’s HPC-optimized architecture is designed to address the performance, scalability, reliability, power and density requirements of future HPC deployments. It is designed to balance price and performance for entry-level through extreme-scale deployments.

“Intel is re-architecting the fundamental building block of HPC systems by integrating the Intel Omni Scale Fabric into Knights Landing, marking a significant inflection and milestone for the HPC industry,” said Charles Wuischpard, vice president and general manager of Workstations and HPC at Intel. “Knights Landing will be the first true many-core processor to address today’s memory and I/O performance challenges. It will allow programmers to leverage existing code and standard programming models to achieve significant performance gains on a wide set of applications. Its platform design, programming model and balanced performance makes it the first viable step towards exascale.”

Knights Landing – Unmatched Integration

Knights Landing will be available as a standalone processor mounted directly on the motherboard socket in addition to the PCIe-based card option. The socketed option removes programming complexities and bandwidth bottlenecks of data transfer over PCIe, common in GPU and accelerator solutions. Knights Landing will include up to 16GB high-bandwidth, on-package memory at launch – designed in partnership with Micron – to deliver five times better bandwidth compared to DDR4 memory, five times better energy efficiency and three times more density than current GDDR-based memory. When combined with integrated Intel Omni Scale Fabric, the new memory solution will allow Knights Landing to be installed as an independent compute building block, saving space and energy by reducing the number of components.

Powered by more than 60 HPC-enhanced Silvermont architecture-based cores, Knights Landing is expected to deliver more than 3 TFLOPS of double-precision performance and three times the single-threaded performance compared with the current generation. As a standalone server processor, Knights Landing will support DDR4 system memory comparable in capacity and bandwidth to Intel Xeon processor-based platforms, enabling applications that have a much larger memory footprint. Knights Landing will be binary-compatible with Intel Xeon processors, making it easy for software developers to reuse the wealth of existing code.

For customers preferring discrete components and a fast upgrade path without needing to upgrade other system components, both Knights Landing and Intel Omni Scale Fabric controllers will be available as separate PCIe-based add-on cards. There is application compatibility between currently available Intel True Scale Fabric and future Intel Omni Scale Fabric, so customers can transition to new fabric technology without change to their applications. For customers purchasing Intel True Scale Fabric today, Intel will offer a program to upgrade to Intel Omni Scale Fabric when it’s available.

Knights Landing processors are scheduled to power HPC systems in the second half of 2015. For instance, in April the National Energy Research Scientific Computing Center (NERSC) announced an HPC installation planned for 2016, serving more than 5,000 users and over 700 extreme-scale science projects.

“We are excited about our partnership with Cray and Intel to develop NERSC’s next supercomputer ‘Cori,’” said Dr. Sudip Dosanjh, NERSC Director, Lawrence Berkeley National Laboratory. “Cori will consist of over 9,300 Intel Knights Landing processors and will serve as an on-ramp to exascale for our users through an accessible programming model. Our codes, which are often memory-bandwidth limited, will also greatly benefit from Knights Landing’s high speed on package memory. We look forward to enabling new science that cannot be done on today’s supercomputers.”

New Fabric, New Speeds with Intel Omni Scale Fabric

Intel Omni Scale fabric is built upon a combination of enhanced acquired IP from Cray and QLogic, and Intel’s own in-house innovations. It will include a full product line offering consisting of adapters, edge switches, director switch systems, and open-source fabric management and software tools. Additionally, traditional electrical transceivers in the director switches in today’s fabrics will be replaced by Intel Silicon Photonics-based solutions, enabling increased port density, simplified cabling and reduced costs. Intel Silicon Photonics-based cabling and transceiver solutions may also be used with Intel Omni Scale-based processors, adapter cards and edge switches.

Intel Supercomputing Momentum Continues

The current generation of Intel Xeon processors and Intel Xeon Phi coprocessors powers the top-rated system in the world – the 35 PFLOPS “Milky Way 2” in China. Intel Xeon Phi coprocessors are also available in more than 200 OEM designs worldwide.

Intel-based systems account for 85 percent of all supercomputers on the 43rd edition of the TOP500 list announced today and 97 percent of all new additions. Within 18 months after the introduction of Intel’s first many-core architecture products, Intel Xeon Phi coprocessor-based systems already make up 18 percent of the aggregated performance of all TOP500 supercomputers. The complete TOP500 list is available at www.top500.org.

To help optimize applications for many-core processing, Intel has also established more than 30 Intel Parallel Computing Centers (IPCC) in cooperation with universities and research facilities around the world. Today’s parallel optimization investment with the Intel Xeon Phi coprocessor will carry forward to Knights Landing, as optimizations using standards-based, common programming languages persist with a recompile. Incremental tuning gains will be available to take advantage of innovative new functionality.

About Intel

Intel is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com, and about Intel’s conflict-free efforts at conflictfree.intel.com.

Source: Intel

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industy updates delivered to you every week!

TACC Supercomputing Powers Climate Modeling for Fisheries

January 28, 2023

A tremendous portion of the world depends on the output of the oceans’ major fisheries, which have, in recent decades, found themselves under near-constant threat from mismanagement (e.g. overfishing). Climate change, Read more…

PFAS Regulations, 3M Exit to Impact Two-Phase Cooling in HPC

January 27, 2023

Per- and polyfluoroalkyl substances (PFAS), known as “forever chemicals,” pose a number of health risks to humans, with more suspected but not yet confirmed – and, as a result, PFAS are coming under increasing regu Read more…

Sweden Plans Expansion for Nvidia-Powered Berzelius Supercomputer

January 26, 2023

The Atos-built, Nvidia SuperPod-based Berzelius supercomputer – housed in and operated by Sweden’s Linköping-based National Supercomputer Centre (NSC) – is already no slouch. But now, Nvidia and NSC have announced Read more…

Multiverse, Pasqal, and Crédit Agricole Tout Progress Using Quantum Computing in FS

January 26, 2023

Europe-based quantum computing pioneers Multiverse Computing and Pasqal, and global bank Crédit Agricole CIB today announced successful conclusion of a 1.5-year POC study “to evaluate the contribution of an algorithmi Read more…

Critics Don’t Want Politicians Deciding the Future of Semiconductors

January 26, 2023

The future of the semiconductor industry was partially being decided last week by a mix of politicians, policy hawks and chip industry executives jockeying for influence at the World Economic Forum. Intel CEO Pat Gels Read more…

AWS Solution Channel

Shutterstock_1687123447

Numerix Scales HPC Workloads for Price and Risk Modeling Using AWS Batch

  • 180x improvement in analytics performance
  • Enhanced risk management
  • Decreased bottlenecks in analytics
  • Unlocked near-real-time analytics
  • Scaled financial analytics

Overview

Numerix, a financial technology company, needed to find a way to scale its high performance computing (HPC) solution as client portfolios ballooned in size. Read more…

Microsoft/NVIDIA Solution Channel

Shutterstock 1453953692

Microsoft and NVIDIA Experts Talk AI Infrastructure

As AI emerges as a crucial tool in so many sectors, it’s clear that the need for optimized AI infrastructure is growing. Going beyond just GPU-based clusters, cloud infrastructure that provides low-latency, high-bandwidth interconnects and high-performance storage can help organizations handle AI workloads more efficiently and produce faster results. Read more…

Riken Plans ‘Virtual Fugaku’ on AWS

January 26, 2023

The development of a national flagship supercomputer aimed at exascale computing continues to be a heated competition, especially in the United States, the European Union, China, and Japan. What is the value to be gained Read more…

PFAS Regulations, 3M Exit to Impact Two-Phase Cooling in HPC

January 27, 2023

Per- and polyfluoroalkyl substances (PFAS), known as “forever chemicals,” pose a number of health risks to humans, with more suspected but not yet confirmed Read more…

Critics Don’t Want Politicians Deciding the Future of Semiconductors

January 26, 2023

The future of the semiconductor industry was partially being decided last week by a mix of politicians, policy hawks and chip industry executives jockeying for Read more…

Riken Plans ‘Virtual Fugaku’ on AWS

January 26, 2023

The development of a national flagship supercomputer aimed at exascale computing continues to be a heated competition, especially in the United States, the Euro Read more…

Shutterstock 1134313550

Semiconductor Companies Create Building Block for Chiplet Design

January 24, 2023

Intel's CEO Pat Gelsinger last week made a grand proclamation that chips will be for the next few decades what oil and gas was to the world over the last 50 years. While that remains to be seen, two technology associations are joining hands to develop building blocks to stabilize the development of future chip designs. The goal of the standard is to set the stage for a thriving marketplace that fuels... Read more…

Royalty-free stock photo ID: 1572060865

Fujitsu Study Says Quantum Decryption Threat Still Distant

January 23, 2023

Global computer and chip manufacturer Fujitsu today reported that a new study performed on its 39-qubit quantum simulator suggests it will remain difficult for Read more…

At ORNL, Jeff Smith Becomes Interim Director, as Search for Permanent Lab Chief Continues

January 20, 2023

UT-Battelle, which manages Oak Ridge National Laboratory (ORNL) for the U.S. Department of Energy, has appointed Jeff Smith as interim director for the lab as t Read more…

Top HPC Players Creating New Security Architecture Amid Neglect

January 20, 2023

Security of high-performance computers is being neglected in the pursuit of horsepower, and there are concerns that the ignorance may be costly if safeguards ar Read more…

Ohio Supercomputer Center Debuts ‘Ascend’ GPU Cluster

January 19, 2023

Less than 10 months after it was announced, the Columbus-based Ohio Supercomputer Center (OSC) has debuted its Dell-built GPU cluster, “Ascend.” Designed to Read more…

Leading Solution Providers

Contributors

SC22 Booth Videos

AMD @ SC22
Altair @ SC22
AWS @ SC22
Ayar Labs @ SC22
CoolIT @ SC22
Cornelis Networks @ SC22
DDN @ SC22
Dell Technologies @ SC22
HPE @ SC22
Intel @ SC22
Intelligent Light @ SC22
Lancium @ SC22
Lenovo @ SC22
Microsoft and NVIDIA @ SC22
One Stop Systems @ SC22
Penguin Solutions @ SC22
QCT @ SC22
Supermicro @ SC22
Tuxera @ SC22
Tyan Computer @ SC22
  • arrow
  • Click Here for More Headlines
  • arrow
HPCwire