LiquidCool to Launch New Technology at SC15

November 3, 2015

ROCHESTER, Minn. and AUSTIN, Tex., Nov. 3 — LiquidCool Solutions (LCS) will launch its newest technology – the Clamshell – at SuperComputing 2015 (SC15) November 15–20 in Austin.

Traditional datacenters account for 2% of electrical energy use worldwide, and more than half of that energy is wasted.  LCS technology reduces the amount of energy needed to cool servers as much as 98%.  The Clamshell server is low-cost and flexible enough to meet Open Compute Project design standards.  Furthermore, it is possible to control dielectric fluid temperature so that it leaves the rack at 125oF, hot enough to provide useful heat via a commercially available liquid-to-liquid heat exchanger.  Preliminary bench test results suggest that 90% of all energy input to an LCS-cooled server can be recycled.

“A Clamshell server costs about the same as a comparably provisioned air-cooled server, so benefits including significantly reduced operating costs, smaller footprint, elimination of water use and silent operation come for free.” said Herb Zien, CEO, LiquidCool Solution. “With Clamshell servers and racks as an option it is difficult to justify the additional capital investment required to build and support an air-cooled datacenter.”

LCS will also display its Explorer 8 at SC15, which is eight servers in a ruggedized and shock isolated case. The Explorer 8 was launched earlier this year at the Emerald Warrior, the Department of Defense’s only exercise that focuses on irregular warfare.

Explorer 8 is a modular, go-anywhere, high performance, high reliability compute solution that overcomes harsh environment operating challenges with improved reliability and productivity.

Designed specifically for remote environments, using both the Intel Xeon processor and Intel Xeon Phi Coprocessor, the Explorer 8 provides efficient energy usage and improved scalability through modular design that expands computational capacity quickly. This modular approach also offers significantly lower initial capital costs with incremental, just-in-time expansion capability.

LiquidCool Solutions is exhibiting at booth number 3304, as well as in the Emerging Technologies exhibits on Level 4, Room 14.

About LiquidCool Solutions

LiquidCool Solutions is a technology development firm with 22 issued and 17 pending patents surrounding cooling electronics by total immersion in a dielectric fluid. LCS technology places special emphasis on scalability and rack management.  Beyond providing superior energy savings, performance and reliability, LCS technology enables a broad range of unique applications not possible with any other air or liquid cooling systems.

Source: LiquidCool Solutions

 

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