Molex to Showcase Advanced Interconnect Technologies at SC13

November 11, 2013

LISLE, Ill., Nov. 11 — Molex Incorporated will present leading edge technologies for high-speed, high-density applications at the 25th annual Supercomputing 2013 (SC13) international conference, November 18-21, Colorado Convention Center, Denver, CO.  The Molex SC13 exhibition booth 1141 will feature the latest high performance I/O solutions, including:

  • iPass+ HD Interconnect System Driving next-generation SAS data rates, port densities, low-power optical consumption and long reaches up to 100m for data center solutions, the Molex iPass+ HD interconnect system improves performance and density for high-performance computing (HPC) applications.  The iPass+ HD system meets the new SAS-3 speed and density requirements (48 Gbps over four lanes) and was chosen to be the SAS-3 connector standard.
  • iPass+ HD SAS 3.0 Active Optical Cables (AOC) Designed for next-generation SAS-3 data rates, long reaches up to 100m and high port density, the Molex iPass+ HD AOC significantly extends connection distances using industry-standard iPass+ HD ports.  The iPass+ HD AOC will also function with SAS-2.1 (optically enabled) ports.
  • iPass+ Vertical zHD Connectors Enhanced iPass+ zHD connectors are designed to meet next-generation SAS-4 data rates up through 96 Gbps (4 x 24). The soon-to-be-released iPass+ zHD connectors will be backward compatible to all current miniSAS HD cable assemblies.

“Delivering new-generation SAS-3 and next-generation SAS-4 projected data rates and port densities, low-profile iPass+ zHD vertical connectors will provide excellent signal integrity performance.  Combining their small footprint on the PCB with the new short cable plugs, they will provide very efficient internal solutions for 1U and blade applications,” states Joe Dambach, product manager, Molex.

  • zQSFP+ Interconnect Solution Supporting next-generation 100 Gbps Ethernet and 100 Gbps InfiniBand Enhanced Data Rate (EDR) applications, the zQSFP+ interconnect solution transmits up to 25 Gbps per-serial-lane data rates with excellent signal integrity, electromagnetic interference protection and thermal cooling.  The zQSFP+ SMT connector’s preferential coupling design is backward compatible with the QSFP+ form factor modules and cable plugs.  System components include SMT connectors and 1-by-n EMI cages and stacked 2-by-n connectors.  Molex 1-by-n EMI cages and the 2-by-n connectors are designed to accept advanced heat-sink systems that provide a high level of heat dissipation for next-generation system-power levels. The cage spring-finger design also provides optimal EMI grounding.
  • zQSFP+ 100 Gbps 2km Long-Reach Silicon Photonics Active Optical Cable Pigtails Singlemode, long-reach silicon photonics AOCs will transmit up to 2km with significantly lower power consumption and cost than other long reach optical solutions.  Molex AOC pigtails allow for connections to singlemode structured cabling up to 2km, and for easy upgrades when next-generation bandwidth cables are introduced.  At 10e-18 BER, Molex AOCs will provide a significantly better bit error rate than other AOC offerings, thus providing a cost-effective, high-performance solution for next-generation data center architectures.  Designed to support 100 Gbps Ethernet EDR InfiniBand, Molex zQSFP+ 100 Gbps AOCs will use transceivers based on silicon photonics ICs, offering vastly improved reliability and cost advantages over traditional optical modules, while supporting the rapidly growing use of the industry standard QSFP port.
  • zQSFP+ EMI cages  Various options in die cast and sheet metal cages address the market need for optimized EMI, higher retention to the PCB and improved thermal performance.

During SC13 exhibition hours, Molex will have on display connectors designed to support the CDFP MSA and present several live demonstrations of leading-edge technology directly applicable to the HPC ecosystem.  Molex will demonstrate the Silicon Photonics based 2km reach 100 Gbps zQSFP+ AOC.  Additionally, Molex will demonstrate advanced thermal solutions for stacked zQSFP+ integrated connectors for use in 100 Gbps EDR and Ethernet applications.  Molex industry experts will be on hand to discuss these and other next-generation solutions, including the PCI Express standards for computer connector and cables.

“At Molex we are committed to providing optimal signal speed, design flexibility and scalability to propel next-generation system architectures,” adds Dambach.  “We are pleased to showcase proven solutions for HPC and enterprise data center applications.”

Visit the Molex exhibition booth 1141 at SC13 or www.molex.com to learn more.  Sign up to receive Molex e-nouncements at http://www.molex.com/link/register.

About Molex Incorporated

Providing more than connectors, Molex delivers complete interconnect solutions for a number of markets including: data communications, telecommunications, consumer electronics, industrial, automotive, commercial vehicle, aerospace and defense, medical, and lighting.  Established in 1938, the company operates 45 manufacturing locations in 17 countries.  The Molex website is www.molex.com.  Follow us at www.twitter.com/molexconnectors, watch our videos at www.youtube.com/molexconnectors, connect with us at www.facebook.com/molexconnectors and read our blog at www.connector.com.

—–

Source: Molex Incorporated

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industy updates delivered to you every week!

Spoiler Alert: Glimpse Next Week’s Solar Eclipse Via Simulation from TACC, SDSC, and NASA

August 17, 2017

Can’t wait to see next week’s solar eclipse? You can at least catch glimpses of what scientists expect it will look like. A team from Predictive Science Inc. (PSI), based in San Diego, working with Stampede2 at the Read more…

By John Russell

Dell EMC will Build OzStar – Swinburne’s New Supercomputer to Study Gravity

August 16, 2017

Dell EMC announced yesterday it is building a new supercomputer – the OzStar – for the Swinburne University of Technology (Australia) in support the ARC Centre of Excellence for Gravitational Wave Discovery (OzGrav) Read more…

By John Russell

Microsoft Bolsters Azure With Cloud HPC Deal

August 15, 2017

Microsoft has acquired cloud computing software vendor Cycle Computing in a move designed to bring orchestration tools along with high-end computing access capabilities to the cloud. Terms of the acquisition were not Read more…

By George Leopold

HPE Extreme Performance Solutions

Leveraging Deep Learning for Fraud Detection

Advancements in computing technologies and the expanding use of e-commerce platforms have dramatically increased the risk of fraud for financial services companies and their customers. Read more…

HPE Ships Supercomputer to Space Station, Final Destination Mars

August 14, 2017

With a manned mission to Mars on the horizon, the demand for space-based supercomputing is at hand. Today HPE and NASA sent the first off-the-shelf HPC system into space aboard the SpaceX Dragon Spacecraft to explore if Read more…

By Tiffany Trader

Microsoft Bolsters Azure With Cloud HPC Deal

August 15, 2017

Microsoft has acquired cloud computing software vendor Cycle Computing in a move designed to bring orchestration tools along with high-end computing access capa Read more…

By George Leopold

HPE Ships Supercomputer to Space Station, Final Destination Mars

August 14, 2017

With a manned mission to Mars on the horizon, the demand for space-based supercomputing is at hand. Today HPE and NASA sent the first off-the-shelf HPC system i Read more…

By Tiffany Trader

AMD EPYC Video Takes Aim at Intel’s Broadwell

August 14, 2017

Let the benchmarking begin. Last week, AMD posted a YouTube video in which one of its EPYC-based systems outperformed a ‘comparable’ Intel Broadwell-based s Read more…

By John Russell

Deep Learning Thrives in Cancer Moonshot

August 8, 2017

The U.S. War on Cancer, certainly a worthy cause, is a collection of programs stretching back more than 40 years and abiding under many banners. The latest is t Read more…

By John Russell

IBM Raises the Bar for Distributed Deep Learning

August 8, 2017

IBM is announcing today an enhancement to its PowerAI software platform aimed at facilitating the practical scaling of AI models on today’s fastest GPUs. Scal Read more…

By Tiffany Trader

IBM Storage Breakthrough Paves Way for 330TB Tape Cartridges

August 3, 2017

IBM announced yesterday a new record for magnetic tape storage that it says will keep tape storage density on a Moore's law-like path far into the next decade. Read more…

By Tiffany Trader

AMD Stuffs a Petaflops of Machine Intelligence into 20-Node Rack

August 1, 2017

With its Radeon “Vega” Instinct datacenter GPUs and EPYC “Naples” server chips entering the market this summer, AMD has positioned itself for a two-head Read more…

By Tiffany Trader

Cray Moves to Acquire the Seagate ClusterStor Line

July 28, 2017

This week Cray announced that it is picking up Seagate's ClusterStor HPC storage array business for an undisclosed sum. "In short we're effectively transitioning the bulk of the ClusterStor product line to Cray," said CEO Peter Ungaro. Read more…

By Tiffany Trader

Nvidia’s Mammoth Volta GPU Aims High for AI, HPC

May 10, 2017

At Nvidia's GPU Technology Conference (GTC17) in San Jose, Calif., this morning, CEO Jensen Huang announced the company's much-anticipated Volta architecture a Read more…

By Tiffany Trader

How ‘Knights Mill’ Gets Its Deep Learning Flops

June 22, 2017

Intel, the subject of much speculation regarding the delayed, rewritten or potentially canceled “Aurora” contract (the Argonne Lab part of the CORAL “ Read more…

By Tiffany Trader

Reinders: “AVX-512 May Be a Hidden Gem” in Intel Xeon Scalable Processors

June 29, 2017

Imagine if we could use vector processing on something other than just floating point problems.  Today, GPUs and CPUs work tirelessly to accelerate algorithms Read more…

By James Reinders

Nvidia Responds to Google TPU Benchmarking

April 10, 2017

Nvidia highlights strengths of its newest GPU silicon in response to Google's report on the performance and energy advantages of its custom tensor processor. Read more…

By Tiffany Trader

Quantum Bits: D-Wave and VW; Google Quantum Lab; IBM Expands Access

March 21, 2017

For a technology that’s usually characterized as far off and in a distant galaxy, quantum computing has been steadily picking up steam. Just how close real-wo Read more…

By John Russell

Russian Researchers Claim First Quantum-Safe Blockchain

May 25, 2017

The Russian Quantum Center today announced it has overcome the threat of quantum cryptography by creating the first quantum-safe blockchain, securing cryptocurrencies like Bitcoin, along with classified government communications and other sensitive digital transfers. Read more…

By Doug Black

HPC Compiler Company PathScale Seeks Life Raft

March 23, 2017

HPCwire has learned that HPC compiler company PathScale has fallen on difficult times and is asking the community for help or actively seeking a buyer for its a Read more…

By Tiffany Trader

Trump Budget Targets NIH, DOE, and EPA; No Mention of NSF

March 16, 2017

President Trump’s proposed U.S. fiscal 2018 budget issued today sharply cuts science spending while bolstering military spending as he promised during the cam Read more…

By John Russell

Leading Solution Providers

CPU-based Visualization Positions for Exascale Supercomputing

March 16, 2017

In this contributed perspective piece, Intel’s Jim Jeffers makes the case that CPU-based visualization is now widely adopted and as such is no longer a contrarian view, but is rather an exascale requirement. Read more…

By Jim Jeffers, Principal Engineer and Engineering Leader, Intel

Groq This: New AI Chips to Give GPUs a Run for Deep Learning Money

April 24, 2017

CPUs and GPUs, move over. Thanks to recent revelations surrounding Google’s new Tensor Processing Unit (TPU), the computing world appears to be on the cusp of Read more…

By Alex Woodie

Google Debuts TPU v2 and will Add to Google Cloud

May 25, 2017

Not long after stirring attention in the deep learning/AI community by revealing the details of its Tensor Processing Unit (TPU), Google last week announced the Read more…

By John Russell

MIT Mathematician Spins Up 220,000-Core Google Compute Cluster

April 21, 2017

On Thursday, Google announced that MIT math professor and computational number theorist Andrew V. Sutherland had set a record for the largest Google Compute Engine (GCE) job. Sutherland ran the massive mathematics workload on 220,000 GCE cores using preemptible virtual machine instances. Read more…

By Tiffany Trader

Six Exascale PathForward Vendors Selected; DoE Providing $258M

June 15, 2017

The much-anticipated PathForward awards for hardware R&D in support of the Exascale Computing Project were announced today with six vendors selected – AMD Read more…

By John Russell

Top500 Results: Latest List Trends and What’s in Store

June 19, 2017

Greetings from Frankfurt and the 2017 International Supercomputing Conference where the latest Top500 list has just been revealed. Although there were no major Read more…

By Tiffany Trader

IBM Clears Path to 5nm with Silicon Nanosheets

June 5, 2017

Two years since announcing the industry’s first 7nm node test chip, IBM and its research alliance partners GlobalFoundries and Samsung have developed a proces Read more…

By Tiffany Trader

Messina Update: The US Path to Exascale in 16 Slides

April 26, 2017

Paul Messina, director of the U.S. Exascale Computing Project, provided a wide-ranging review of ECP’s evolving plans last week at the HPC User Forum. Read more…

By John Russell

  • arrow
  • Click Here for More Headlines
  • arrow
Share This