BUFFALO, N.Y., Nov. 17, 2020 — Motivair Corporation, a global leader and innovator in IT and Electronics Cooling, will launch its Dynamic Cold Plates for direct liquid cooling at SC20, the international conference for high performance computing, networking, storage, and analysis. Attendees can virtually learn more about Motivair’s comprehensive End-to-End Liquid Cooling Portfolio designed exclusively for HPC, AI and Big Data users.

BREAKTHROUGH LIQUID COOLING PERFORMANCE

Motivair’s Dynamic Cold Plates deliver robust and scalable thermal performance up to 1000 watts per processor. The patent pending technology allows CPUs and GPUs to operate at peak performance without the use of skived microchannels.

Additionally, the technology helps reduce the risk of cooling degradation and costly system failures caused by exposure to particulate contamination. Dynamic Cold Plates can be connected in series or parallel utilizing leak-free push lock connections and dripless quick connects.

This simple and highly customizable technology provides OEMs, ODMs a wide range of design customization that can be produced in variable production volumes and short lead times. The entire product is manufactured in the USA, mitigating the risks of global supply chain disruptions, and ensuring the highest levels of quality control.

END-TO-END DIRECT LIQUID COOLING SYSTEMS

Motivair’s End-to-End Liquid Cooling Portfolio includes all aspects of a complete direct liquid cooling system providing customers with an efficient and reliable solution that is designed to work together. All products including Coolant Distribution Units, Heat Dissipation Units, In-Rack Manifolds, Memory Cooling, Quick Connects and Hose Systems are all designed and manufactured in the USA intended for use in the world’s most advanced HPC, AI and Exascale class systems.

“Computer chip cooling has evolved from simple gaming computers, a very low risk environment, and extended to the data center, where the stakes are much, much higher,” CEO Rich Whitmore said. “Motivair’s enterprise class clients depend on us to supply and support much of their critical cooling infrastructure already. Our Dynamic Cold Plate technology is simply an extension of the trust that we’ve built over the last 30 years.”

ADDITIONAL INFORMATION AVAILABLE AT SC20

• Motivair’s ChilledDoor: an active rear-door heat exchanger that cools rack densities up to 75 kW per rack. It is a leader in high efficiency and high-density server rack cooling systems for small, medium, and larger data centers.
• Modular HPC Data Center Product Deployments: A purpose-built, modular HPC data center that addresses the needs of both IT professionals and corporate leadership. Backed by Motivair’s Data Center and IT Cooling technology, our data center helps compress time to market, improve server performance, profitability, and uptime.

About Motivair Corporation

Motivair enables industry leaders to push the boundaries of what’s possible by leveraging over 30 years of insights and innovations creating dependable mission critical cooling systems. Based in Buffalo, NY, Motivair creates, develops, and manufactures a portfolio of specialty chillers and high-density computer cooling systems that cool vital industries and propel the world’s most complex and advanced technologies. Its technology is featured in numerous Top500 supercomputers. For more information, visit www.MotivairCorp.com

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Source: Motivair