New Manufacturing Institutes to be Led by DOD

February 26, 2014

WASHINGTON, D.C., Feb. 26 — President Barack Obama announced two new manufacturing innovation institutes led by the Defense Department and supported by a $140 million federal commitment combined with more than $320 million in private-sector commitments.

A consortium of businesses and universities headquartered in the Detroit area will a focus on lightweight and modern metals manufacturing, and a Chicago-headquartered consortium of businesses and universities will concentrate on digital manufacturing and design technologies.

“If we want to attract more good manufacturing jobs to America, we’ve got to make sure we’re on the cutting edge of new manufacturing techniques and technologies,” the president said. “I don’t want the next big job-creating discovery to come from Germany or China or Japan. I want it to be ‘Made in America.’”

Each institute serves as a regional hub, officials explained, bridging the gap between applied research and product development by bringing together companies, universities and other academic and training institutions, as well as federal agencies, to co-invest in key technology areas that encourage investment and production in the United States.

This type of “teaching factory” provides a unique opportunity for education and training of students and workers at all levels, they added, while providing the shared assets to help companies — most importantly small manufacturers — access the cutting-edge capabilities and equipment to design, test, and pilot new products and manufacturing processes.

The winning Lightweight and Modern Metals Manufacturing Innovation Institute team, led by EWI, brings together a 60-member consortium that pairs the world’s leading aluminum, titanium, and high strength steel manufacturers with universities and laboratories pioneering new technology development and research, officials said. Its long-term goal will be to expand the market for and create new consumers of products and systems that use new, lightweight, high performing metals and alloys by removing technological barriers to their manufacture.

Noting that car manufacturers now use stronger steel to make lighter cars that use less gas, Obama noted that advanced lightweight metals “can help us build lighter armor for our troops, planes and helicopters that bigger payloads without sacrificing safety, wind turbines that generate more power at less cost, prosthetic limbs that help people walk again who never thought they could.”

The winning Digital Manufacturing and Design Innovation Institute team, led by UI Labs, spearheads a consortium of more than 70 companies, universities, nonprofits, and research labs — creating a partnership between world-leading manufacturing experts and cutting-edge software companies to enable interoperability across the supply chain, develop enhanced digital capabilities to design and test new products, and reduce costs in manufacturing processes across multiple industries, officials said.

“[This institute] will focus on using digital technology and Big Data to help manufacturers go from ideas on paper to products at loading docks faster and cheaper than ever before,” Obama explained. “And it will include training to help more Americans earn the skills to do these digital manufacturing jobs. This is critical — the country that gets new products to market faster and at less cost will win the race for the good jobs of tomorrow.”

Frank Kendall, undersecretary of defense for acquisition, technology and logistics, said the innovation institutes will strengthen the nation’s advanced manufacturing capabilities, promote the development of cutting-edge products and systems, and attract well-paying jobs to support a growing middle class.

“Both consortia announced today will play commanding roles in the advancement of key U.S. strengths,” he said. “The Lightweight and Modern Metals Manufacturing Innovation Institute, or LM3I, represents a potent new capability in the application of high-performing metals and alloys toward forward-looking commercial and military products benefitting a multitude of industries. The Digital Manufacturing and Design Innovation Institute, or DMDI, will push technology development into a new frontier, by harnessing the power of virtual reality to accurately test and prepare high-tech products before they even leave cyberspace.”

The Defense Department has a substantial role to play in supporting and growing these organizations, Kendall added, and has made key investments since creating the first institute in Youngstown, Ohio, in 2012.

Each institute’s federal funding contribution will be about $70 million across the five years of the cooperative agreement period of performance, White House officials said. Consistent with the president’s broader proposal, they added, the institutes will be supported with federal funding through the start-up and initial operational phases, after which they are expected to become fiscally self-sustaining. Each manufacturing innovation institute solicitation required that applicants match the federal investment on no less than a 1-to-1 basis.

The Defense Department’s overarching role is to stand up individual institutes through federal acquisitions, including the provisioning of federal funding, officials said, and to provide oversight and stewardship of federal funds. The department also will contribute technical advice and assistance through participation on an advisory board.

Each institute will have substantial autonomy from its partner organizations and institutions and will have an independent fiduciary board of directors predominantly composed of industry representatives. An institute leader will be in charge of day-to-day operations, officials said.

DOD’s $140 million stake in the new institutes is a matter of funding the nation’s highest defense and national priorities, White House officials said. The department already is investing in critical additive manufacturing, lightweight and modern metals manufacturing, and digital manufacturing and design needs, they noted. Engaging in sustainable public-private partnerships that build strong innovation capacity around these manufacturing technologies is the administration’s chosen investment strategy, they added.

Kendall said DOD’s investment in the new institutes continues the department’s support toward the president’s goal of establishing a much larger network of up to 45 innovative manufacturing centers throughout the nation. The department is committed to their success, he added, “and will continue to work to maintain and embolden America’s innovation and manufacturing advantage.”

—–

Source: Department of Defense

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industy updates delivered to you every week!

IBM Launches Commercial Quantum Network with Samsung, ORNL

December 14, 2017

In the race to commercialize quantum computing, IBM is one of several companies leading the pack. Today, IBM announced it had signed JPMorgan Chase, Daimler AG, Samsung and a number of other corporations to its IBM Q Net Read more…

By Tiffany Trader

TACC Researchers Test AI Traffic Monitoring Tool in Austin

December 13, 2017

Traffic jams and mishaps are often painful and sometimes dangerous facts of life. At this week’s IEEE International Conference on Big Data being held in Boston, researchers from TACC and colleagues will present a new Read more…

By HPCwire Staff

AMD Wins Another: Baidu to Deploy EPYC on Single Socket Servers

December 13, 2017

When AMD introduced its EPYC chip line in June, the company said a portion of the line was specifically designed to re-invigorate a single socket segment in what has become an overwhelmingly two-socket landscape in the d Read more…

By John Russell

HPE Extreme Performance Solutions

Explore the Origins of Space with COSMOS and Memory-Driven Computing

From the formation of black holes to the origins of space, data is the key to unlocking the secrets of the early universe. Read more…

Microsoft Wants to Speed Quantum Development

December 12, 2017

Quantum computing continues to make headlines in what remains of 2017 as several tech giants jockey to establish a pole position in the race toward commercialization of quantum. This week, Microsoft took the next step in Read more…

By Tiffany Trader

IBM Launches Commercial Quantum Network with Samsung, ORNL

December 14, 2017

In the race to commercialize quantum computing, IBM is one of several companies leading the pack. Today, IBM announced it had signed JPMorgan Chase, Daimler AG, Read more…

By Tiffany Trader

AMD Wins Another: Baidu to Deploy EPYC on Single Socket Servers

December 13, 2017

When AMD introduced its EPYC chip line in June, the company said a portion of the line was specifically designed to re-invigorate a single socket segment in wha Read more…

By John Russell

Microsoft Wants to Speed Quantum Development

December 12, 2017

Quantum computing continues to make headlines in what remains of 2017 as several tech giants jockey to establish a pole position in the race toward commercializ Read more…

By Tiffany Trader

HPC Iron, Soft, Data, People – It Takes an Ecosystem!

December 11, 2017

Cutting edge advanced computing hardware (aka big iron) does not stand by itself. These computers are the pinnacle of a myriad of technologies that must be care Read more…

By Alex R. Larzelere

IBM Begins Power9 Rollout with Backing from DOE, Google

December 6, 2017

After over a year of buildup, IBM is unveiling its first Power9 system based on the same architecture as the Department of Energy CORAL supercomputers, Summit a Read more…

By Tiffany Trader

Microsoft Spins Cycle Computing into Core Azure Product

December 5, 2017

Last August, cloud giant Microsoft acquired HPC cloud orchestration pioneer Cycle Computing. Since then the focus has been on integrating Cycle’s organization Read more…

By John Russell

GlobalFoundries, Ayar Labs Team Up to Commercialize Optical I/O

December 4, 2017

GlobalFoundries (GF) and Ayar Labs, a startup focused on using light, instead of electricity, to transfer data between chips, today announced they've entered in Read more…

By Tiffany Trader

HPE In-Memory Platform Comes to COSMOS

November 30, 2017

Hewlett Packard Enterprise is on a mission to accelerate space research. In August, it sent the first commercial-off-the-shelf HPC system into space for testing Read more…

By Tiffany Trader

US Coalesces Plans for First Exascale Supercomputer: Aurora in 2021

September 27, 2017

At the Advanced Scientific Computing Advisory Committee (ASCAC) meeting, in Arlington, Va., yesterday (Sept. 26), it was revealed that the "Aurora" supercompute Read more…

By Tiffany Trader

NERSC Scales Scientific Deep Learning to 15 Petaflops

August 28, 2017

A collaborative effort between Intel, NERSC and Stanford has delivered the first 15-petaflops deep learning software running on HPC platforms and is, according Read more…

By Rob Farber

Oracle Layoffs Reportedly Hit SPARC and Solaris Hard

September 7, 2017

Oracle’s latest layoffs have many wondering if this is the end of the line for the SPARC processor and Solaris OS development. As reported by multiple sources Read more…

By John Russell

AMD Showcases Growing Portfolio of EPYC and Radeon-based Systems at SC17

November 13, 2017

AMD’s charge back into HPC and the datacenter is on full display at SC17. Having launched the EPYC processor line in June along with its MI25 GPU the focus he Read more…

By John Russell

Nvidia Responds to Google TPU Benchmarking

April 10, 2017

Nvidia highlights strengths of its newest GPU silicon in response to Google's report on the performance and energy advantages of its custom tensor processor. Read more…

By Tiffany Trader

Japan Unveils Quantum Neural Network

November 22, 2017

The U.S. and China are leading the race toward productive quantum computing, but it's early enough that ultimate leadership is still something of an open questi Read more…

By Tiffany Trader

GlobalFoundries Puts Wind in AMD’s Sails with 12nm FinFET

September 24, 2017

From its annual tech conference last week (Sept. 20), where GlobalFoundries welcomed more than 600 semiconductor professionals (reaching the Santa Clara venue Read more…

By Tiffany Trader

Amazon Debuts New AMD-based GPU Instances for Graphics Acceleration

September 12, 2017

Last week Amazon Web Services (AWS) streaming service, AppStream 2.0, introduced a new GPU instance called Graphics Design intended to accelerate graphics. The Read more…

By John Russell

Leading Solution Providers

IBM Begins Power9 Rollout with Backing from DOE, Google

December 6, 2017

After over a year of buildup, IBM is unveiling its first Power9 system based on the same architecture as the Department of Energy CORAL supercomputers, Summit a Read more…

By Tiffany Trader

Perspective: What Really Happened at SC17?

November 22, 2017

SC is over. Now comes the myriad of follow-ups. Inboxes are filled with templated emails from vendors and other exhibitors hoping to win a place in the post-SC thinking of booth visitors. Attendees of tutorials, workshops and other technical sessions will be inundated with requests for feedback. Read more…

By Andrew Jones

EU Funds 20 Million Euro ARM+FPGA Exascale Project

September 7, 2017

At the Barcelona Supercomputer Centre on Wednesday (Sept. 6), 16 partners gathered to launch the EuroEXA project, which invests €20 million over three-and-a-half years into exascale-focused research and development. Led by the Horizon 2020 program, EuroEXA picks up the banner of a triad of partner projects — ExaNeSt, EcoScale and ExaNoDe — building on their work... Read more…

By Tiffany Trader

Delays, Smoke, Records & Markets – A Candid Conversation with Cray CEO Peter Ungaro

October 5, 2017

Earlier this month, Tom Tabor, publisher of HPCwire and I had a very personal conversation with Cray CEO Peter Ungaro. Cray has been on something of a Cinderell Read more…

By Tiffany Trader & Tom Tabor

Tensors Come of Age: Why the AI Revolution Will Help HPC

November 13, 2017

Thirty years ago, parallel computing was coming of age. A bitter battle began between stalwart vector computing supporters and advocates of various approaches to parallel computing. IBM skeptic Alan Karp, reacting to announcements of nCUBE’s 1024-microprocessor system and Thinking Machines’ 65,536-element array, made a public $100 wager that no one could get a parallel speedup of over 200 on real HPC workloads. Read more…

By John Gustafson & Lenore Mullin

Flipping the Flops and Reading the Top500 Tea Leaves

November 13, 2017

The 50th edition of the Top500 list, the biannual publication of the world’s fastest supercomputers based on public Linpack benchmarking results, was released Read more…

By Tiffany Trader

Intel Launches Software Tools to Ease FPGA Programming

September 5, 2017

Field Programmable Gate Arrays (FPGAs) have a reputation for being difficult to program, requiring expertise in specialty languages, like Verilog or VHDL. Easin Read more…

By Tiffany Trader

HPC Chips – A Veritable Smorgasbord?

October 10, 2017

For the first time since AMD's ill-fated launch of Bulldozer the answer to the question, 'Which CPU will be in my next HPC system?' doesn't have to be 'Whichever variety of Intel Xeon E5 they are selling when we procure'. Read more…

By Dairsie Latimer

  • arrow
  • Click Here for More Headlines
  • arrow
Share This