Research Could Bring New Devices That Control Heat Flow

January 27, 2014

WEST LAFAYETTE, Ind., Jan. 27 — Researchers are proposing a new technology that might control the flow of heat the way electronic devices control electrical current, an advance that could have applications in a diverse range of fields from electronics to textiles.

The concept uses tiny triangular structures to control “phonons,” quantum-mechanical phenomena that describe how vibrations travel through a material’s crystal structure.

Findings in research using advanced simulations show the triangular or T-shaped structures – if small enough in width – are capable of “thermal rectification,” or permitting a greater flow of heat in one direction than in the opposite direction, said Xiulin Ruan, an associate professor in Purdue University’s School of Mechanical Engineering and Birck Nanotechnology Center.

Rectification has made possible transistors, diodes and memory circuits central to the semiconductor industry. The new devices are thermal rectifiers that might perform the same function, but with phonons instead of electrical current.

“In most systems, heat flow is equal in both directions, so there are no thermal devices like electrical diodes. However, if we are able to control heat flow like we control electricity using diodes then we can enable a lot of new and exciting thermal devices including thermal switches, thermal transistors, logic gates and memory,” said Ruan, whose research group collaborated with a group led by Yong Chen, an associate professor in Purdue’s Department of Physics and School of Electrical and Computer Engineering. “People are just starting to understand how it works, and it is quite far from being used in applications.”

Findings are detailed in a research paper that has appeared online in the journal Nano Letters and will be published in an upcoming issue of the journal. The paper was authored by doctoral students Yan Wang, Ajit Vallabhaneni and Jiuning Hu and former doctoral student Bo Qiu; Chen; and Ruan.

The researchers used an advanced simulation method called molecular dynamics to demonstrate thermal rectification in structures called “asymmetric graphene nanoribbons.” Molecular dynamics simulations can simulate the vibrations of atoms and predict the heat flow in a material.

Graphene, an extremely thin layer of carbon, is promising for applications in electronics and computers. The triangular structure must be tiny in width to make possible the “lateral confinement” of phonons needed for the effect. Findings also show thermal rectification is not limited to graphene but could be seen in other materials in structures such as pyramidal, trapezoidal or T-shaped designs.

Hu, Ruan, and Chen also published a paper four years ago in the journal Nano Letters, among the first to propose asymmetric graphene nanoribbons as a thermal rectifier in research using the molecular dynamics simulations. Although numerous studies have been devoted to this topic since then, until now researchers did not know the mechanism behind thermal rectification. The new findings show that this mechanism works by restricting vibrations as they travel through the small lateral direction of an asymmetrical structure.

“We demonstrate that other asymmetric materials, such as asymmetric nanowires, thin films, and quantum dots of a single material can also be high-performance thermal rectifiers, as long as you have lateral confinement,” Ruan said. “This really broadens the potential of this rectification to a much wider spectrum of applications.”

Thermal rectification is not seen in larger triangular-shape structures because they lack lateral confinement. In order for lateral confinement to be produced, the cross section of the structure must be much smaller than the “mean free path” of a phonon, or only a few to hundreds of nanometers depending on the material, Wang said.

“This is the average distance a phonon can travel before it collides with another phonon,” he said.

However, although the devices must be tiny, they could be linked in series to produce larger structures and better rectification performance.

The concept could find uses in “thermal management” applications for computers and electronics, buildings and even clothing.

“For example, on a winter night you don’t want a building to lose heat quickly to the outside, while during the day you want the building to be warmed up by the sun, so it would be good to have building materials that permit the flow of heat in one direction, but not the other,” Ruan said.

A potential, although speculative, future application could be thermal transistors.  Unlike conventional transistors, thermal transistors would not require the use of silicon, are based on phonons rather than electrons and might make use of the large amount of waste heat that is already generated in most practical electronics, said Chen.

The research was funded by the U.S. Air Force Office of Scientific Research.

—–

Source: Purdue University

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industy updates delivered to you every week!

TACC Researchers Test AI Traffic Monitoring Tool in Austin

December 13, 2017

Traffic jams and mishaps are often painful and sometimes dangerous facts of life. At this week’s IEEE International Conference on Big Data being held in Boston, researchers from TACC and colleagues will present a new Read more…

AMD Wins Another: Baidu to Deploy EPYC on Single Socket Servers

December 13, 2017

When AMD introduced its EPYC chip line in June, the company said a portion of the line was specifically designed to re-invigorate a single socket segment in what has become an overwhelmingly two-socket landscape in the d Read more…

By John Russell

Microsoft Wants to Speed Quantum Development

December 12, 2017

Quantum computing continues to make headlines in what remains of 2017 as tech giants jockey to establish a pole position in the race toward commercialization of quantum. This week, Microsoft took the next step in advanci Read more…

By Tiffany Trader

HPE Extreme Performance Solutions

Explore the Origins of Space with COSMOS and Memory-Driven Computing

From the formation of black holes to the origins of space, data is the key to unlocking the secrets of the early universe. Read more…

ESnet Now Moving More Than 1 Petabyte/wk

December 12, 2017

Optimizing ESnet (Energy Sciences Network), the world's fastest network for science, is an ongoing process. Recently a two-year collaboration by ESnet users – the Petascale DTN Project – achieved its ambitious goal t Read more…

AMD Wins Another: Baidu to Deploy EPYC on Single Socket Servers

December 13, 2017

When AMD introduced its EPYC chip line in June, the company said a portion of the line was specifically designed to re-invigorate a single socket segment in wha Read more…

By John Russell

Microsoft Wants to Speed Quantum Development

December 12, 2017

Quantum computing continues to make headlines in what remains of 2017 as tech giants jockey to establish a pole position in the race toward commercialization of Read more…

By Tiffany Trader

HPC Iron, Soft, Data, People – It Takes an Ecosystem!

December 11, 2017

Cutting edge advanced computing hardware (aka big iron) does not stand by itself. These computers are the pinnacle of a myriad of technologies that must be care Read more…

By Alex R. Larzelere

IBM Begins Power9 Rollout with Backing from DOE, Google

December 6, 2017

After over a year of buildup, IBM is unveiling its first Power9 system based on the same architecture as the Department of Energy CORAL supercomputers, Summit a Read more…

By Tiffany Trader

Microsoft Spins Cycle Computing into Core Azure Product

December 5, 2017

Last August, cloud giant Microsoft acquired HPC cloud orchestration pioneer Cycle Computing. Since then the focus has been on integrating Cycle’s organization Read more…

By John Russell

GlobalFoundries, Ayar Labs Team Up to Commercialize Optical I/O

December 4, 2017

GlobalFoundries (GF) and Ayar Labs, a startup focused on using light, instead of electricity, to transfer data between chips, today announced they've entered in Read more…

By Tiffany Trader

HPE In-Memory Platform Comes to COSMOS

November 30, 2017

Hewlett Packard Enterprise is on a mission to accelerate space research. In August, it sent the first commercial-off-the-shelf HPC system into space for testing Read more…

By Tiffany Trader

SC17 Cluster Competition: Who Won and Why? Results Analyzed and Over-Analyzed

November 28, 2017

Everyone by now knows that Nanyang Technological University of Singapore (NTU) took home the highest LINPACK Award and the Overall Championship from the recently concluded SC17 Student Cluster Competition. We also already know how the teams did in the Highest LINPACK and Highest HPCG competitions, with Nanyang grabbing bragging rights for both benchmarks. Read more…

By Dan Olds

US Coalesces Plans for First Exascale Supercomputer: Aurora in 2021

September 27, 2017

At the Advanced Scientific Computing Advisory Committee (ASCAC) meeting, in Arlington, Va., yesterday (Sept. 26), it was revealed that the "Aurora" supercompute Read more…

By Tiffany Trader

NERSC Scales Scientific Deep Learning to 15 Petaflops

August 28, 2017

A collaborative effort between Intel, NERSC and Stanford has delivered the first 15-petaflops deep learning software running on HPC platforms and is, according Read more…

By Rob Farber

Oracle Layoffs Reportedly Hit SPARC and Solaris Hard

September 7, 2017

Oracle’s latest layoffs have many wondering if this is the end of the line for the SPARC processor and Solaris OS development. As reported by multiple sources Read more…

By John Russell

AMD Showcases Growing Portfolio of EPYC and Radeon-based Systems at SC17

November 13, 2017

AMD’s charge back into HPC and the datacenter is on full display at SC17. Having launched the EPYC processor line in June along with its MI25 GPU the focus he Read more…

By John Russell

Nvidia Responds to Google TPU Benchmarking

April 10, 2017

Nvidia highlights strengths of its newest GPU silicon in response to Google's report on the performance and energy advantages of its custom tensor processor. Read more…

By Tiffany Trader

Japan Unveils Quantum Neural Network

November 22, 2017

The U.S. and China are leading the race toward productive quantum computing, but it's early enough that ultimate leadership is still something of an open questi Read more…

By Tiffany Trader

GlobalFoundries Puts Wind in AMD’s Sails with 12nm FinFET

September 24, 2017

From its annual tech conference last week (Sept. 20), where GlobalFoundries welcomed more than 600 semiconductor professionals (reaching the Santa Clara venue Read more…

By Tiffany Trader

Google Releases Deeplearn.js to Further Democratize Machine Learning

August 17, 2017

Spreading the use of machine learning tools is one of the goals of Google’s PAIR (People + AI Research) initiative, which was introduced in early July. Last w Read more…

By John Russell

Leading Solution Providers

Amazon Debuts New AMD-based GPU Instances for Graphics Acceleration

September 12, 2017

Last week Amazon Web Services (AWS) streaming service, AppStream 2.0, introduced a new GPU instance called Graphics Design intended to accelerate graphics. The Read more…

By John Russell

Perspective: What Really Happened at SC17?

November 22, 2017

SC is over. Now comes the myriad of follow-ups. Inboxes are filled with templated emails from vendors and other exhibitors hoping to win a place in the post-SC thinking of booth visitors. Attendees of tutorials, workshops and other technical sessions will be inundated with requests for feedback. Read more…

By Andrew Jones

EU Funds 20 Million Euro ARM+FPGA Exascale Project

September 7, 2017

At the Barcelona Supercomputer Centre on Wednesday (Sept. 6), 16 partners gathered to launch the EuroEXA project, which invests €20 million over three-and-a-half years into exascale-focused research and development. Led by the Horizon 2020 program, EuroEXA picks up the banner of a triad of partner projects — ExaNeSt, EcoScale and ExaNoDe — building on their work... Read more…

By Tiffany Trader

Delays, Smoke, Records & Markets – A Candid Conversation with Cray CEO Peter Ungaro

October 5, 2017

Earlier this month, Tom Tabor, publisher of HPCwire and I had a very personal conversation with Cray CEO Peter Ungaro. Cray has been on something of a Cinderell Read more…

By Tiffany Trader & Tom Tabor

IBM Begins Power9 Rollout with Backing from DOE, Google

December 6, 2017

After over a year of buildup, IBM is unveiling its first Power9 system based on the same architecture as the Department of Energy CORAL supercomputers, Summit a Read more…

By Tiffany Trader

Tensors Come of Age: Why the AI Revolution Will Help HPC

November 13, 2017

Thirty years ago, parallel computing was coming of age. A bitter battle began between stalwart vector computing supporters and advocates of various approaches to parallel computing. IBM skeptic Alan Karp, reacting to announcements of nCUBE’s 1024-microprocessor system and Thinking Machines’ 65,536-element array, made a public $100 wager that no one could get a parallel speedup of over 200 on real HPC workloads. Read more…

By John Gustafson & Lenore Mullin

Flipping the Flops and Reading the Top500 Tea Leaves

November 13, 2017

The 50th edition of the Top500 list, the biannual publication of the world’s fastest supercomputers based on public Linpack benchmarking results, was released Read more…

By Tiffany Trader

Intel Launches Software Tools to Ease FPGA Programming

September 5, 2017

Field Programmable Gate Arrays (FPGAs) have a reputation for being difficult to program, requiring expertise in specialty languages, like Verilog or VHDL. Easin Read more…

By Tiffany Trader

  • arrow
  • Click Here for More Headlines
  • arrow
Share This