Spring 2016 HPC4Mfg Solicitation Open

March 22, 2016

March 22 — The High Performance Computing for Manufacturing (“HPC4Mfg”) Program seeks qualified industry partners to participate in short-term, collaborative projects. Through support from the Advanced Manufacturing Office of the Department of Energy’s (DOE) Office of Energy Efficiency and Renewable Energy (EERE), selected projects partners will be granted access to High Performance Computing (HPC) facilities and experienced staff at DOE National Laboratories.

The collaborations will address key challenges in U.S. manufacturing by apply modeling, simulation, and data analysis to the manufacturing of materials with the intent to improve energy efficiency, increase productivity, reduce cycle time, enable next-generation technologies, test control system algorithms, investigate intensified processes, lower energy cost, and accelerate innovation. Projects must demonstrate potential impact to energy efficiency in manufacturing and/or the development of new clean energy technologies with a potential for broad national impact. Eligibility for this Program is limited to entities that manufacture products in the U.S. for commercial applications and the organizations that support them. Selected projects will be awarded up to $300,000 to support compute cycles and work performed by the national lab partners. The industry partner must provide a participant contribution of at least 20% of the DOE funding for the project. The HPC4Mfg Program anticipates making multiple awards, subject to the availability of funding.

Background

DOE maintains world-class HPC expertise and facilities, currently hosting five of the top twelve most powerful computers in the world. From detailed atomic-level simulations to massive cosmological studies, researchers use HPC to probe science and technology questions inaccessible by other experimental methods. Scientific insights gained from these computational studies have drastically impacted research and technology across industrial sectors and scientific fields. Examples include additive manufacturing, oil recovery, drug development, climate science, genomics, and exploration of fundamental particles that make up our universe. From industry to academia, the scientific need for compute power pushes the limits of current computers and continues to drive innovation and development for future high performance computers and their capabilities.

There is high potential for the U.S. manufacturing industry to utilize the power of HPC. The HPC4Mfg Program is intended to provide HPC expertise and resources to manufacturing industries to lower the risk of HPC adoption and broaden its use to support advanced clean energy manufacturing. The DOE Advanced Manufacturing Office (AMO) within EERE sponsors this HPC4Mfg Program. AMO partners with private and public stakeholders to support the research, development and deployment of innovative technologies that can improve U.S. competitiveness, save energy, and ensure global leadership in advanced manufacturing and clean energy technologies. AMO supports cost‐shared research, development, and demonstration activities in support of crosscutting next generation technologies and processes that hold high potential to significantly improve energy efficiency and reduce energy-related emissions, industrial waste, and the life‐cycle energy consumption of manufactured products.

Program Objective

The objective of the HPC4Mfg Program is to enable targeted collaboration between the national laboratories and the U.S. manufacturing industry to investigate, improve, and scale methods that will accelerate the development and deployment of innovative energy efficient manufacturing or enable the production or adoption of clean energy technologies. This solicitation is aimed at demonstrating the benefit of HPC toward these goals within one year.

Improved energy efficiency across the manufacturing industry is one of the primary goals of the HPC4Mfg Program. We solicit proposals that improve understanding and optimize manufacturing processes. To make the highest impact nation-wide proposals applicable to the following energy-intensive manufacturing industries are encouraged to apply, although proposals applicable to all manufacturing industries will be considered.

  • Petroleum refining
  • Chemicals
  • Wood pulp and paper
  • Primary metals
  • Food processing
  • Glass and cement

Applied research, development and ultimate adoption of clean energy technologies is the other primary goal of the HPC4Mfg program. We solicit proposals that demonstrate the use of HPC to help develop new, innovative clean energy technologies, optimize device design, predict device performance, shorten time to market, and reduce the number of testing cycles in product development.

Successful applicants will work collaboratively with staff from one or more of the DOE laboratories to conduct project activities across the various HPC areas of expertise, including development and optimization of modeling and simulation codes, porting and scaling of applications, application of data analytics, as well as applied research and development of tools or methods.

To make the broadest impact across the industry, the project teams will present their results at the annual HPC4Mfg Industry Day. Publications in appropriate trade journals are also encouraged.

The DOE national laboratory system provides the HPC expertise and capabilities for the HPC4Mfg Program. Lawrence Livermore National Laboratory (LLNL) administers the program, with Lawrence Berkeley National Laboratory (LBNL) and Oak Ridge National Laboratory (ORNL) as managing partners. Additional labs will be added as the program grows.

Eligibility

Eligibility is limited to U.S. manufacturers, defined as entities that are incorporated (or otherwise formed) under the laws of a particular State or territory of the United States, and which manufactures products in the United States. U.S. universities, institutes, and other non-profit organizations are also eligible to participate, although an explanation of potential impact on manufacturing should be identified for non-manufacturing applicants.

Funding Requirements

The DOE monetary contribution for each project will not exceed $300,000. An industry partner must provide a participant contribution of at least 20% of the DOE funding for the project to support industry expertise to the project. The participant contribution can take the form of monetary funds-in or “in-kind” contributions and must come from non-federal sources unless otherwise allowed by law. The DOE funding will be provided to the national laboratory (or laboratories) in support of their work under the HPC4Mfg Program. On a limited basis, students at U.S. universities may also be supported.

A special Cost Share Waiver is available for Domestic Institutions of Higher Education, Domestic Nonprofit Entities, or U.S. State, Local, or Tribal Government Entities, which may reduce the 20% participant contribution. The Assistant Secretary for the Office of Energy Efficiency and Renewable Energy has issued a Cost Share Reduction determination pursuant to Section 988(b)(3) of the Energy Policy Act of 2005 that is applicable to certain entities applying under this call.

Note: THIS IS NOT A PROCUREMENT REQUEST.

Concept Paper Guidelines

Interested parties will first submit a concept paper by the due date provided below that describes the objectives of the project. The concept paper will be evaluated against the documented criteria. Successful concept papers will be invited to submit a full proposal.

The concept paper template can be downloaded from the web site and should be used to prepare your submission. The concept paper should not exceed two (2) single-spaced pages using 12-point font (Times New Roman preferred), should be in PDF file format and should address the instructions in each section. A concept paper that does not meet the Guidelines may be rejected.

  • Title Page: (not included in page limit) Project title; company name, description and US manufacturing location(s); company principal investigator(s) (PI) contact information. Include national lab PI contact information, if known. Acknowledgement of the required 20% cost- share, and indication of business sector and process category (list provided).
  • Abstract (150 words or less): Non-proprietary, summary of problem being addressed, why problem is important to the energy future of the US, plan to address problem, and the impact the solution will have on national energy.
  • Background: Explain the technical challenge to addressed, the state-of-the-art in this area and how this work advance the state of the art, how solving this problem will meet the goals of the HPC4Mfg program, the relevant expertise of the industry partners, what national lab expertise is needed, why national laboratory HPC resources are required and how they will be used.
  • Project plan and objectives: Describe the technical scope of work to be performance and how this scope will fit into the broader solution for the challenges being addressed. Describe how the results of the project will be validated, including availability of data. If possible, describe specific simulation codes to be used in this effort.
  • Impact: Describe how this effort will result in long-term energy savings across the industry, the production or deployment of clean energy technologies with broad commercial application, and/or the ability of an industry to accelerate the development and deployment of innovative energy efficient manufacturing. Metrics include cost savings, energy savings and/or improvements in energy intensity.

Completed concept papers, derived from the provided template, must be submitted in PDF file format by email to [email protected] by 11:59pm PST on the deadline indicated below. The subject line should include: HPC4Mfg Concept Submission. Receipt of concept papers will be confirmed within one week of submission. Concept papers will be evaluated against the criteria described below.

Full Proposal Guidelines

Successful concept paper submissions will be notified and paired with a Principle Investigator (PI) from LLNL, LBNL, ORNL, or a combination of these national laboratories, to collaborate on development of a full proposal. Full proposals will be evaluated against the criteria described below.

The proposal template can be downloaded from the web site and should be used to prepare your submission. Proposals should not exceed six (6) single-spaced pages using 12-point font (Times New Roman preferred), should be in PDF file format, and should address the instructions in each section. Proposals that do not meet the guidelines may be rejected.

  • Title Page: (not included in page limit) Project title; company name, description and US manufacturing location(s); company principal investigator(s) (PI) contact information. Include national lab PI contact information, if known. Acknowledge the need to provide 20% cost- share and the agreement to enter into the DOE Short Form CRADA.
  • Abstract (150 words or less): Non-proprietary, publishable summary of problem being addressed, why problem is important to the energy future of the US, plan to address problem, and the impact the solution will have on the national energy. If selected for the HPC4Mfg Program, this abstract will appear on award announcements.
  • Background: Explain the technical challenge to addressed, the state-of-the-art in this area and how this work advance the state of the art, how solving this problem will meet the goals of the HPC4Mfg program, the relevant expertise of the industry partners, what national lab expertise is needed, why national laboratory HPC resources are required and how they will be used. Indicate if the proposed project will accelerate transformational technological advances in areas that industry by itself is not likely to undertake because of technical and financial uncertainty.
  • Project plan and objectives: Describe the technical scope of work to be performance and how this scope will fit into the broader solution for the challenges being addressed. Describe a set of tasks to be performed and define what work industry partners will perform and what work laboratory partners will perform. Describe how the results of the project will be validated, including availability of data. If possible, describe specific simulation codes to be used in this effort.
  • Tasks, Milestones, Deliverables, Schedules: Goals, timelines and due dates throughout life of project. Not every milestone needs to have a deliverable. Include deliverables from national lab and industry partner(s). Indicate responsible party(ies) for each deliverables. Include deliverables from one partner to another as well as those to AMO.
  • Impact: Estimate how this effort will result in long-term energy savings across the industry, the production or deployment of clean energy technologies with broad commercial application, and/or the ability of an industry to accelerate the development and deployment of innovative energy efficient manufacturing. Describe how this work contributes to a transformational change in the energy sector and the enduring economic impact. Metrics include cost savings, energy savings and/or improvements in energy intensity.
  • Implementation: Describe how this work will be incorporated into company and industry- wide operations. Describe the follow-on activities to extend this effort to solve the broader problem being addressed.
  • Appendix A – Project Budget (not included in page count): Summarize project costs includingamountandsourceof participantcontributioninthetableprovidedontheproposal template. Indicate in kind and/or cash contribution for industry funding. Include a description of how this funding will make a large difference relative to existing funding from other sources, including the private sector and why the government should fund this work.
  • Appendix B – Computational Resources (not included in page count): Describe the computational approach, the performance of the codes, and the resources requested (platform and number of core hours). Also describe how the results are to be disseminated to the end users.
  • Appendix C – Qualifications and Experience: (not included in page limit): Include resumes of key participants.

Completed proposals, derived from the provided template, must be submitted in PDF file format by email to [email protected] by 11:59pm PST on the deadline indicated below. The subject line should include: HPC4Mfg Proposal Submission. Receipt of proposals will be confirmed within one week of submission.

Proposal evaluation will be conducted by a Technical Merit Review Committee consisting of experts in the application of HPC modeling, simulation, and data analysis from each of the participating DOE national laboratories, and members of the DOE AMO with knowledge of the US Manufacturing industry. Subject Matter Experts will be consulted to verify claims, including description of current state of the art and estimate of project impact (e.g. cost and energy savings).

The portfolio of proposals recommended by the committee will be submitted to AMO senior managers for final funding approval, subject to the availability of funding. All AMO funding decisions shall be final. Upon approval from AMO, the HPC4Mfg Program Director will issue a response to each applicant and successful applicants will begin CRADA initiation. Once both parties approve the CRADA, the projects can begin execution. Failure to engage promptly in CRADA negotiations can result in the rejection of the project. The portfolio of projects will be posted on http://hpc4mfg.llnl.gov/. The HPC4MfgProgram reserves the right to select all, a portion, or none of the submissions.

Evaluation Criteria

  • Degree to which the proposed effort advances the current “State of the Art” • Appropriateness for national laboratories
  • Technical feasibility
  • Industry participant contribution and participation
  • Impact, including Lifecycle Energy Impact, broad industrial impact through new clean energy technology development and/or energy efficient manufacturing technologies, as well as impact on employment and manufacturing in the United States
  • Strength and balance of the technical team, including modeling expertise on both the national laboratory and industry sides and process experts for the model validation

Timeline

Estimates will be replaced by firm dates as the solicitation progresses.

Event

Date (2016)

Call for Proposal

March 17

Concept Paper due

April 21

Request for full proposal

Early June

Full proposal due

Mid July

Finalists notified

August

Expected project start

October

Point of Contact

During the period of the call for proposals, all questions relating to this announcement should be directed to the HPC4Mfg Director at [email protected] Answers will be posted on http://hpc4mfg.llnl.gov/. Industrial partners that are interested in submitting applications should refrain from contacting members of the HPC4Mfg Program during the call for proposals.

Intellectual Property and Proprietary Data

The HPC4Mfg Program respects the importance of industry’s intellectual property and data security. Provisions relating to proprietary information and intellectual property are set forth in the standard Short Form CRADA. A Non-Disclosure Agreement can be put into place during development and submission of the proposal to facilitate discussions while protecting the partner’s proprietary information.

To the extent possible, it is preferred that proprietary information NOT be included in the submitted proposal. If company proprietory information is included in the proposal, the specific information should be marked as such, and HPC4Mfg Program officials will utilize reasonable efforts to treat the information as business sensitive.

Cooperative Research and Development Agreement (CRADA) Information

Awardees are expected to enter into a DOE Model Short Form CRADA with the national laboratory or laboratories that will be performing the work. Because of the need for accelerated placement and execution of the projects, terms of the CRADA will not be subject to negotiation. Significant delays by the industry partner to finalize the CRADA could result in rejection of the proposal.

Source: HPC4Mfg

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industy updates delivered to you every week!

Is Amazon’s Plunge into Server Chips a Watershed Moment?

December 11, 2018

For several years now the big cloud providers – Amazon, Microsoft Azure, Google, et al – have been transforming from technology consumers into technology creators in hardware and software. The most recent example bei Read more…

By John Russell

Mellanox Uses Univa to Extend Silicon Design HPC Operation to Azure

December 11, 2018

Call it a corollary to Murphy’s Law: When a system is most in demand, when end users are most dependent on the system performing as required, when it’s crunch time – that’s when the system is most likely to blow up. Or make you wait in line to use it. Read more…

By Doug Black

Clemson’s Cautionary Cryptomining Tale

December 11, 2018

In some ways, the bigger the computer, the more vulnerable it is to cryptomining as Clemson University discovered after cryptominers dug into its Palmetto supercomputer. When a number of nodes on Clemson University’s P Read more…

By Staff

HPE Extreme Performance Solutions

AI Can Be Scary. But Choosing the Wrong Partners Can Be Mortifying!

As you continue to dive deeper into AI, you will discover it is more than just deep learning. AI is an extremely complex set of machine learning, deep learning, reinforcement, and analytics algorithms with varying compute, storage, memory, and communications needs. Read more…

IBM Accelerated Insights

Blurring the Lines Between HPC and AI @ SC18

The dominant topic at SC18 was the convergence of HPC and Artificial Intelligence (AI) with some of the biggest research and enterprise HPC users providing perspectives on how HPC and AI are moving closer together. Read more…

Data West Brings Technology Leaders to SDSC

December 6, 2018

Data and technology enthusiasts from around the world descended upon the San Diego Supercomputing Center (SDSC) for the third annual Data West conference, which is taking place this week on the campus of the University o Read more…

By Alex Woodie

Topology Can Help Us Find Patterns in Weather

December 6, 2018

Topology--–the study of shapes-- seems to be all the rage. You could even say that data has shape, and shape matters. Shapes are comfortable and familiar conc Read more…

By James Reinders

Zettascale by 2035? China Thinks So

December 6, 2018

Exascale machines (of at least a 1 exaflops peak) are anticipated to arrive by around 2020, a few years behind original predictions; and given extreme-scale performance challenges are not getting any easier, it makes sense that researchers are already looking ahead to the next big 1,000x performance goal post: zettascale computing. Read more…

By Tiffany Trader

Robust Quantum Computers Still a Decade Away, Says Nat’l Academies Report

December 5, 2018

The National Academies of Science, Engineering, and Medicine yesterday released a report – Quantum Computing: Progress and Prospects – whose optimism about Read more…

By John Russell

Revisiting the 2008 Exascale Computing Study at SC18

November 29, 2018

A report published a decade ago conveyed the results of a study aimed at determining if it were possible to achieve 1000X the computational power of the the Read more…

By Scott Gibson

AWS Debuts Lustre as a Service, Accelerates Data Transfer

November 28, 2018

From the Amazon re:Invent main stage in Las Vegas today, Amazon Web Services CEO Andy Jassy introduced Amazon FSx for Lustre, citing a growing body of applicati Read more…

By Tiffany Trader

AWS Launches First Arm Cloud Instances

November 28, 2018

AWS, a macrocosm of the emerging high-performance technology landscape, wants to be everywhere you want to be and offer everything you want to use (or at least Read more…

By Doug Black

Move Over Lustre & Spectrum Scale – Here Comes BeeGFS?

November 26, 2018

Is BeeGFS – the parallel file system with European roots – on a path to compete with Lustre and Spectrum Scale worldwide in HPC environments? Frank Herold Read more…

By John Russell

DOE Under Secretary for Science Paul Dabbar Interviewed at SC18

November 21, 2018

During the 30th annual SC conference in Dallas last week, SC18 hosted U.S. Department of Energy Under Secretary for Science Paul M. Dabbar. In attendance Nov. 13-14, Dabbar delivered remarks at the Top500 panel, met with a number of industry stakeholders and toured the show floor. He also met with HPCwire for an interview, where we discussed the role of the DOE in advancing leadership computing. Read more…

By Tiffany Trader

Quantum Computing Will Never Work

November 27, 2018

Amid the gush of money and enthusiastic predictions being thrown at quantum computing comes a proposed cold shower in the form of an essay by physicist Mikhail Read more…

By John Russell

Cray Unveils Shasta, Lands NERSC-9 Contract

October 30, 2018

Cray revealed today the details of its next-gen supercomputing architecture, Shasta, selected to be the next flagship system at NERSC. We've known of the code-name "Shasta" since the Argonne slice of the CORAL project was announced in 2015 and although the details of that plan have changed considerably, Cray didn't slow down its timeline for Shasta. Read more…

By Tiffany Trader

IBM at Hot Chips: What’s Next for Power

August 23, 2018

With processor, memory and networking technologies all racing to fill in for an ailing Moore’s law, the era of the heterogeneous datacenter is well underway, Read more…

By Tiffany Trader

House Passes $1.275B National Quantum Initiative

September 17, 2018

Last Thursday the U.S. House of Representatives passed the National Quantum Initiative Act (NQIA) intended to accelerate quantum computing research and developm Read more…

By John Russell

Summit Supercomputer is Already Making its Mark on Science

September 20, 2018

Summit, now the fastest supercomputer in the world, is quickly making its mark in science – five of the six finalists just announced for the prestigious 2018 Read more…

By John Russell

CERN Project Sees Orders-of-Magnitude Speedup with AI Approach

August 14, 2018

An award-winning effort at CERN has demonstrated potential to significantly change how the physics based modeling and simulation communities view machine learni Read more…

By Rob Farber

AMD Sets Up for Epyc Epoch

November 16, 2018

It’s been a good two weeks, AMD’s Gary Silcott and Andy Parma told me on the last day of SC18 in Dallas at the restaurant where we met to discuss their show news and recent successes. Heck, it’s been a good year. Read more…

By Tiffany Trader

US Leads Supercomputing with #1, #2 Systems & Petascale Arm

November 12, 2018

The 31st Supercomputing Conference (SC) - commemorating 30 years since the first Supercomputing in 1988 - kicked off in Dallas yesterday, taking over the Kay Ba Read more…

By Tiffany Trader

Leading Solution Providers

SC 18 Virtual Booth Video Tour

Advania @ SC18 AMD @ SC18
ASRock Rack @ SC18
DDN Storage @ SC18
HPE @ SC18
IBM @ SC18
Lenovo @ SC18 Mellanox Technologies @ SC18
NVIDIA @ SC18
One Stop Systems @ SC18
Oracle @ SC18 Panasas @ SC18
Supermicro @ SC18 SUSE @ SC18 TYAN @ SC18
Verne Global @ SC18

TACC’s ‘Frontera’ Supercomputer Expands Horizon for Extreme-Scale Science

August 29, 2018

The National Science Foundation and the Texas Advanced Computing Center announced today that a new system, called Frontera, will overtake Stampede 2 as the fast Read more…

By Tiffany Trader

HPE No. 1, IBM Surges, in ‘Bucking Bronco’ High Performance Server Market

September 27, 2018

Riding healthy U.S. and global economies, strong demand for AI-capable hardware and other tailwind trends, the high performance computing server market jumped 28 percent in the second quarter 2018 to $3.7 billion, up from $2.9 billion for the same period last year, according to industry analyst firm Hyperion Research. Read more…

By Doug Black

Nvidia’s Jensen Huang Delivers Vision for the New HPC

November 14, 2018

For nearly two hours on Monday at SC18, Jensen Huang, CEO of Nvidia, presented his expansive view of the future of HPC (and computing in general) as only he can do. Animated. Backstopped by a stream of data charts, product photos, and even a beautiful image of supernovae... Read more…

By John Russell

Germany Celebrates Launch of Two Fastest Supercomputers

September 26, 2018

The new high-performance computer SuperMUC-NG at the Leibniz Supercomputing Center (LRZ) in Garching is the fastest computer in Germany and one of the fastest i Read more…

By Tiffany Trader

Houston to Field Massive, ‘Geophysically Configured’ Cloud Supercomputer

October 11, 2018

Based on some news stories out today, one might get the impression that the next system to crack number one on the Top500 would be an industrial oil and gas mon Read more…

By Tiffany Trader

Intel Confirms 48-Core Cascade Lake-AP for 2019

November 4, 2018

As part of the run-up to SC18, taking place in Dallas next week (Nov. 11-16), Intel is doling out info on its next-gen Cascade Lake family of Xeon processors, specifically the “Advanced Processor” version (Cascade Lake-AP), architected for high-performance computing, artificial intelligence and infrastructure-as-a-service workloads. Read more…

By Tiffany Trader

Google Releases Machine Learning “What-If” Analysis Tool

September 12, 2018

Training machine learning models has long been time-consuming process. Yesterday, Google released a “What-If Tool” for probing how data point changes affect a model’s prediction. The new tool is being launched as a new feature of the open source TensorBoard web application... Read more…

By John Russell

The Convergence of Big Data and Extreme-Scale HPC

August 31, 2018

As we are heading towards extreme-scale HPC coupled with data intensive analytics like machine learning, the necessary integration of big data and HPC is a curr Read more…

By Rob Farber

  • arrow
  • Click Here for More Headlines
  • arrow
Do NOT follow this link or you will be banned from the site!
Share This