Super Micro Exhibits Latest HPC Solutions at SC13

November 18, 2013

SAN JOSE, Calif., Nov. 18 — Super Micro Computer, Inc., a global leader in high-performance, high-efficiency server, storage technology and green computing, exhibits its latest high-performance computing (HPC) solutions at the Supercomputing 2013 (SC13) conference this week in Denver, Colorado. Highlighted at the show is Supermicro’s innovative high-density energy efficient Twin architecture and the launch of a new 4U FatTwin platform featuring two ultra high performance compute nodes, each supporting dual Intel Xeon E5-2600 v2 “Ivy Bridge” processors (up to 130W TDP) and up to six Intel Many Integrated Core (MIC) based Intel Xeon Phi Coprocessors. Also making their debut are new 2U TwinPro and TwinPro² SuperServers, the second generation Twin architecture from Supermicro featuring greater memory capacity up to 16x DIMMs, 12Gb/s SAS 3.0 support, NVMe optimized PCI-E SSD interface, additional PCI-E expansion slots, 10GbE and onboard QDR/FDR InfiniBand for maximized I/O and support for a full-length, double-width Xeon Phi coprocessor per node in the 2U TwinPro. Supermicro will also highlight the 4U 4-node FatTwin SuperServer which supports up to 3x Intel Xeon Phi 5110P coprocessors paired with dual Intel Xeon E5-2600 v2 processors.

This platform configured and deployed by Atipa Technologies supports the US Department of Energy’s (DOE) Environmental Molecular Sciences Laboratory (EMSL) supercomputer. The EMSL HPCS-4A on the DOE’s Pacific Northwest National Laboratory (PNNL) campus comprises 42x 42U rack clusters with 1,440 compute nodes and 2,880 Intel Xeon Phi coprocessors, providing 3.38 petaflops theoretical peak processing speed and 2.7 petabytes of usable storage. The HPCS-4A is expected to be ranked among the world’s top 20 fastest supercomputers.

Additional MIC based 1U, 2U, 3U, 4U SuperServer, FatTwin, SuperBlade, MicroBlade, MicroCloud, Hyper-Speed and 4-Way systems along with single/dual/multi processor (UP/DP/MP) motherboards which are the foundation of Supermicro’s server Building Block Solutions will also be on exhibit. High bandwidth 12Gb/s storage servers featuring LSI 3008 SAS3 controllers and 4U 72x hot-swap HDD bay Double-Sided Storage servers maximize I/O performance with Intel Cache Acceleration Software (CAS), offering dramatically enhanced performance for data-intensive HPC applications running on dedicated servers or virtual machines (VMs). Complete rack, network and server management software solutions round out the end-to-end server, network and storage solutions that can be configured and optimized to meet any scale supercomputing deployment.

“Supermicro’s Twin architecture delivers maximum performance per watt, per dollar, per square foot for many supercomputing deployments with its unique combination of high performance compute density coupled with energy saving technology and highest reliability,” said Charles Liang, President and CEO of Supermicro. “Indeed, we have invested a great amount of engineering effort to perfect our Twin server technology and now offer an unrivaled range of server solutions optimized for practically any scale application. With our new 4U 2-node FatTwin featuring dual Xeon CPUs and six Xeon Phi coprocessors per node, science, research and engineering programs can increase and accelerate project deliverables with maximized utilization of budget, resources and space.”

“The industry is moving from experimentation with heterogeneous computing to more efficient neo-heterogeneity which combines the benefits of heterogeneous hardware while still using the same, common and standard programming models for both the CPU and co-processor,” said Rajeeb Hazra, vice president and general manager of Technical Computing Group at Intel. “With solution providers such as Supermicro combining the high-performance Intel Xeon processors E5-2600 v2 with Intel Xeon Phi coprocessors in high-density, scalable server solutions, industry has the ideal pairing of technology to enable a neo-heterogeneous era. With a common underlying Intel architecture we provide developers with a rapid deployment environment for their programs along with enterprise class stability and reliability for the most demanding mission critical, compute intensive applications.”

Supermicro’s New HPC optimized supercomputing solutions on exhibit this week at SC’13 include:

  • 4U 12x Xeon Phi FatTwin (SYS-F647G2-FT+) – 2-node system featuring  6x Intel Xeon Phi Coprocessors per node with Front I/O, Redundant Platinum Level high efficiency power supplies and hot-swap cooling fans. Each node supports dual Intel Xeon E5-2600 v2 (up to 130W TDP) processors, 16x DDR3 Reg. ECC DIMMs, 10GbE onboard option and 8x 2.5″ hot-swap SAS/SATA/SSD bays.
  • 2U TwinPro (SYS-2027PR-DTR) / TwinPro² (SYS-2027PR-HTR) – Supermicro takes its 2U Twin architecture to the next level of performance, flexibility and expandability with the high efficiency 2-node TwinPro and high density 4-node TwinPro². Each node supports dual Intel Xeon E5-2600 v2 processors and the 2-node 2U TwinPro accommodates an Intel Xeon Phi Coprocessor with support for two additional add on cards per node. The systems feature greater memory capacity up to 16x DIMMs, 12Gb/s SAS 3.0 support, NVMe optimized PCI-E SSD interface, additional PCI-E expansion slots, 10GbE and onboard QDR/FDR InfiniBand for maximized I/O.

End-to-End Scalable Computing Solutions include:

  • 1U SuperServer (SYS-1027GR-TRT2) – supports 3x Intel Xeon Phi Coprocessors and dual Intel Xeon E5-2600 v2 series processors (up to 130W TDP).
  • 2U SuperServer (SYS-2027GR-TRFH) – supports 6x Intel Xeon Phi Coprocessors and dual Intel Xeon E5-2600 v2 series processors (up to 130W TDP).
  • 3U SuperServer (SYS-6037R-72RFT+) – supports 2x Intel Xeon Phi Coprocessors and dual Intel Xeon E5-2600 v2 series processors (up to 135W TDP).
  • SuperBlade (SBI-7127RG-E) – Supports 2x Intel Xeon Phi Coprocessors, dual Intel Xeon E5-2600 v2 series processors per Blade. 10x Blades in 7U SuperBlade enclosure offers high density 120x Intel Xeon Phi Coprocessors and 120x CPUs per 42U rack.
  • MicroBlade – 6U powerful and flexible microserver platform that features 28x hot-swappable micro blades  supporting 112x Intel Atom processor C2000 or 28x Intel Xeon processor E5-2600 v2 / 56x E5-1600 v2 family configurations with 2x HDDs/SSDs per node for high-performance applications.
  • MicroCloud – 3U in 12-node (SYS-5038ML-H12TRF), 8-node (SYS-5038ML-H8TRF) and coming 24-node (SYS-5038ML-H24TRF) configurations supporting independent hot-swappable nodes, Intel Xeon processor E3-1200 v3, 32GB memory, up to 2x 3.5″ or optional 4x 2.5″ HDDs and MicroLP expansion
  • 4U 4-Way (Quad CPU) SuperServer (SYS-4048B-TRFT) – Quad Intel Xeon processor, 96x DIMMs DDR3 Reg. ECC 1600MHz (up to 6TB), 11x PCI-E 3.0 slots, Dual 10Gb LAN, up to 48x hot-swap 2.5″ HDD/SSD bays.
  • 4U/Tower SuperWorkstation (SYS-7047GR-TRF / -TPRF) – Ultimate performance and expandability with support for up to 4x Intel Xeon Phi Coprocessors and dual Intel Xeon E5-2600 v2 series processors.
  • 2U Hyper-Speed Servers (SYS-6027AX-TRF-HFT3 / -72RF-HFT3) – Highly optimized solution for low-latency applications, featuring special firmware and hardware modifications and supporting accelerated dual Intel Xeon processor E5-2687W v2 CPUs.
  • 2U SAS3 12Gb/s SuperStorage Server (SSG-2027R-AR24NV) – 24x hot-swap 2.5″ SAS3 (12Gb/s)/SATA3 HDD/SSD bays with direct attached backplane. 3x LSI 3008 SAS3 controllers in IT mode providing 12Gb/s throughput, dual Intel Xeon processor E5-2600 v2 and support for NVDIMM technology.
  • 4U Double-Sided Storage (SSG-6047R-E1R72L) – 72x hot-swap 3.5″ HDD/SSD bays plus 2x 2.5″ internal HDD/SSD bays, dual Intel Xeon processor E5-2600 v2 support, up to 1TB ECC DDR3 in 16x DIMMs.
  • Uni-Processor (UP), Dual-Processor (DP) and Quad Multi-Processor (MP) Motherboards
  • Complete Rack, Network and Server Management Solutions – SuperRack enclosures in 14U and 42U, 10/1GbE Top-of-Rack Network Switches, Supermicro Server Management Utilities and full Integration Services.

Experience Supermicro’s complete range of High Performance Computing solutions at the Supercomputing 2013 Conference this week November 18th – 22nd in Denver, Colorado in the Colorado Convention Center, Booth #3132.

Supermicro solutions will also be exhibited at partner booths

  • Fusion-io (#3709) High Performance PCI-E Storage
  • Hitachi, Ltd. (#1710) SAS3 12Gb/s Storage Solutions
  • Intel (#2701) 42U SuperRack, FatTwin 150-nodes w/50x Xeon Phi 7120P, Xeon processor E5-2697 v2
  • LSI (#3616) SAS3 12Gb/s Storage Solutions

Visit www.supermicro.com for additional product information.

About Super Micro Computer, Inc.

Supermicro, the leading innovator in high-performance, high-efficiency server technology is a premier provider of advanced server Building Block Solutions for Data Center, Cloud Computing, Enterprise IT, Hadoop/Big Data, HPC and Embedded Systems worldwide. Supermicro is committed to protecting the environment through its “We Keep IT Green” initiative and provides customers with the most energy-efficient, environmentally-friendly solutions available on the market.

—–

Source: Super Micro Computer, Inc.

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industy updates delivered to you every week!

Hyperion: HPC Server Market Ekes 1 Percent Gain in 2020, Storage Poised for ‘Tipping Point’

May 12, 2021

The HPC User Forum meeting taking place virtually this week (May 11-13) kicked off with Hyperion Research’s market update, covering the 2020 period. Although the HPC server market had been facing a 6.7 percent COVID-re Read more…

Finland’s CSC Chronicles the COVID Research Performed on Its ‘Puhti’ Supercomputer

May 11, 2021

CSC, Finland’s IT Center for Science, is home to a variety of computing resources, including the 1.7 petaflops Puhti supercomputer. The 682-node, Intel Cascade Lake-powered system, which places about halfway down the T Read more…

IBM Debuts Qiskit Runtime for Quantum Computing; Reports Dramatic Speed-up

May 11, 2021

In conjunction with its virtual Think event, IBM today introduced an enhanced Qiskit Runtime Software for quantum computing, which it says demonstrated 120x speedup in simulating molecules. Qiskit is IBM’s quantum soft Read more…

AMD Chipmaker TSMC to Use AMD Chips for Chipmaking

May 8, 2021

TSMC has tapped AMD to support its major manufacturing and R&D workloads. AMD will provide its Epyc Rome 7702P CPUs – with 64 cores operating at a base clock of 2.0GHz – implemented in HPE's single-socket ProLian Read more…

Supercomputer Research Tracks the Loss of the World’s Glaciers

May 7, 2021

British Columbia – which is over twice the size of California – contains around 17,000 glaciers that cover three percent of its landmass. These glaciers are crucial for the Canadian province, which relies on its many Read more…

AWS Solution Channel

FLYING WHALES runs CFD workloads 15 times faster on AWS

FLYING WHALES is a French startup that is developing a 60-ton payload cargo airship for the heavy lift and outsize cargo market. The project was born out of France’s ambition to provide efficient, environmentally friendly transportation for collecting wood in remote areas. Read more…

Meet Dell’s Pete Manca, an HPCwire Person to Watch in 2021

May 7, 2021

Pete Manca heads up Dell's newly formed HPC and AI leadership group. As senior vice president of the integrated solutions engineering team, he is focused on custom design, technology alliances, high-performance computing Read more…

Hyperion: HPC Server Market Ekes 1 Percent Gain in 2020, Storage Poised for ‘Tipping Point’

May 12, 2021

The HPC User Forum meeting taking place virtually this week (May 11-13) kicked off with Hyperion Research’s market update, covering the 2020 period. Although Read more…

IBM Debuts Qiskit Runtime for Quantum Computing; Reports Dramatic Speed-up

May 11, 2021

In conjunction with its virtual Think event, IBM today introduced an enhanced Qiskit Runtime Software for quantum computing, which it says demonstrated 120x spe Read more…

AMD Chipmaker TSMC to Use AMD Chips for Chipmaking

May 8, 2021

TSMC has tapped AMD to support its major manufacturing and R&D workloads. AMD will provide its Epyc Rome 7702P CPUs – with 64 cores operating at a base cl Read more…

Fast Pass Through (Some of) the Quantum Landscape with ORNL’s Raphael Pooser

May 7, 2021

In a rather remarkable way, and despite the frequent hype, the behind-the-scenes work of developing quantum computing has dramatically accelerated in the past f Read more…

IBM Research Debuts 2nm Test Chip with 50 Billion Transistors

May 6, 2021

IBM Research today announced the successful prototyping of the world's first 2 nanometer chip, fabricated with silicon nanosheet technology on a standard 300mm Read more…

LRZ Announces New Phase of SuperMUC-NG Supercomputer with Intel’s ‘Ponte Vecchio’ GPU

May 5, 2021

At the Leibniz Supercomputing Centre (LRZ) in München, Germany – one of the constituent centers of the Gauss Centre for Supercomputing (GCS) – the SuperMUC Read more…

Crystal Ball Gazing at Nvidia: R&D Chief Bill Dally Talks Targets and Approach

May 4, 2021

There’s no quibbling with Nvidia’s success. Entrenched atop the GPU market, Nvidia has ridden its own inventiveness and growing demand for accelerated computing to meet the needs of HPC and AI. Recently it embarked on an ambitious expansion by acquiring Mellanox (interconnect)... Read more…

Intel Invests $3.5 Billion in New Mexico Fab to Focus on Foveros Packaging Technology

May 3, 2021

Intel announced it is investing $3.5 billion in its Rio Rancho, New Mexico, facility to support its advanced 3D manufacturing and packaging technology, Foveros. Read more…

Julia Update: Adoption Keeps Climbing; Is It a Python Challenger?

January 13, 2021

The rapid adoption of Julia, the open source, high level programing language with roots at MIT, shows no sign of slowing according to data from Julialang.org. I Read more…

AMD Chipmaker TSMC to Use AMD Chips for Chipmaking

May 8, 2021

TSMC has tapped AMD to support its major manufacturing and R&D workloads. AMD will provide its Epyc Rome 7702P CPUs – with 64 cores operating at a base cl Read more…

Intel Launches 10nm ‘Ice Lake’ Datacenter CPU with Up to 40 Cores

April 6, 2021

The wait is over. Today Intel officially launched its 10nm datacenter CPU, the third-generation Intel Xeon Scalable processor, codenamed Ice Lake. With up to 40 Read more…

CERN Is Betting Big on Exascale

April 1, 2021

The European Organization for Nuclear Research (CERN) involves 23 countries, 15,000 researchers, billions of dollars a year, and the biggest machine in the worl Read more…

HPE Launches Storage Line Loaded with IBM’s Spectrum Scale File System

April 6, 2021

HPE today launched a new family of storage solutions bundled with IBM’s Spectrum Scale Erasure Code Edition parallel file system (description below) and featu Read more…

10nm, 7nm, 5nm…. Should the Chip Nanometer Metric Be Replaced?

June 1, 2020

The biggest cool factor in server chips is the nanometer. AMD beating Intel to a CPU built on a 7nm process node* – with 5nm and 3nm on the way – has been i Read more…

Saudi Aramco Unveils Dammam 7, Its New Top Ten Supercomputer

January 21, 2021

By revenue, oil and gas giant Saudi Aramco is one of the largest companies in the world, and it has historically employed commensurate amounts of supercomputing Read more…

Quantum Computer Start-up IonQ Plans IPO via SPAC

March 8, 2021

IonQ, a Maryland-based quantum computing start-up working with ion trap technology, plans to go public via a Special Purpose Acquisition Company (SPAC) merger a Read more…

Leading Solution Providers

Contributors

Can Deep Learning Replace Numerical Weather Prediction?

March 3, 2021

Numerical weather prediction (NWP) is a mainstay of supercomputing. Some of the first applications of the first supercomputers dealt with climate modeling, and Read more…

AMD Launches Epyc ‘Milan’ with 19 SKUs for HPC, Enterprise and Hyperscale

March 15, 2021

At a virtual launch event held today (Monday), AMD revealed its third-generation Epyc “Milan” CPU lineup: a set of 19 SKUs -- including the flagship 64-core, 280-watt 7763 part --  aimed at HPC, enterprise and cloud workloads. Notably, the third-gen Epyc Milan chips achieve 19 percent... Read more…

Livermore’s El Capitan Supercomputer to Debut HPE ‘Rabbit’ Near Node Local Storage

February 18, 2021

A near node local storage innovation called Rabbit factored heavily into Lawrence Livermore National Laboratory’s decision to select Cray’s proposal for its CORAL-2 machine, the lab’s first exascale-class supercomputer, El Capitan. Details of this new storage technology were revealed... Read more…

African Supercomputing Center Inaugurates ‘Toubkal,’ Most Powerful Supercomputer on the Continent

February 25, 2021

Historically, Africa hasn’t exactly been synonymous with supercomputing. There are only a handful of supercomputers on the continent, with few ranking on the Read more…

GTC21: Nvidia Launches cuQuantum; Dips a Toe in Quantum Computing

April 13, 2021

Yesterday Nvidia officially dipped a toe into quantum computing with the launch of cuQuantum SDK, a development platform for simulating quantum circuits on GPU-accelerated systems. As Nvidia CEO Jensen Huang emphasized in his keynote, Nvidia doesn’t plan to build... Read more…

New Deep Learning Algorithm Solves Rubik’s Cube

July 25, 2018

Solving (and attempting to solve) Rubik’s Cube has delighted millions of puzzle lovers since 1974 when the cube was invented by Hungarian sculptor and archite Read more…

The History of Supercomputing vs. COVID-19

March 9, 2021

The COVID-19 pandemic poses a greater challenge to the high-performance computing community than any before. HPCwire's coverage of the supercomputing response t Read more…

HPE Names Justin Hotard New HPC Chief as Pete Ungaro Departs

March 2, 2021

HPE CEO Antonio Neri announced today (March 2, 2021) the appointment of Justin Hotard as general manager of HPC, mission critical solutions and labs, effective Read more…

  • arrow
  • Click Here for More Headlines
  • arrow
HPCwire