Supermicro to Showcase HPC Products at ISC14

June 23, 2014

LEIPZIG, Germany, June 23 — Super Micro Computer, Inc., a global leader in high-performance, high-efficiency server, storage technology and green computing exhibits its High Performance Computing solutions at the International Supercomputing Conference (ISC ’14) this week in Leipzig, Germany. HPC Solutions designed by Supermicro feature architecture innovations that optimize performance, I/O bandwidth and compute density while providing the most efficient air flow for minimum power consumption as well as ease of installation and maintenance. With enhanced cooling and broadening support for Supermicro’s new Titanium Level, high-efficiency (96%+) power supplies, these SuperServer solutions offer peak performance with the most green computing advantages available on the market.

New innovative platforms highlighted at ISC’14 include the robust 2U TwinPro² featuring 4x dual-processor (DP) nodes and redundant Titanium Level high-efficiency (96%+) power supplies, the extreme density, ultra low power 6U 112-node Intel Atom based MicroBlade microserver (196 next-generation Xeon E5 DP per rack configuration coming), 1U NVMe/SAS3, 2U 6x GPU, 4U 8x GPU DP SuperServers, 4U Intel Xeon based 4x DP node 12x GPU FatTwin and 7U SuperBlade in 4-way, 2x and 3x GPU configurations. Supermicro will also be announcing support for Intel’s next generation HPC fabric, Intel Omni Scale Fabric, and next-generation Intel Xeon Phi processor, Knights Landing to simplify upgrade paths and accelerate access to the full parallel performance of Intel Xeon based processor and Intel Xeon Phi coprocessor technologies.

“Supermicro’s latest advances in Green Computing from optimization for advanced technologies such as NVMe to cooling architecture innovations and Titanium Level power supplies increases the overall energy efficiency and performance of our most powerful HPC systems,” said Charles Liang, President and CEO of Supermicro. “As we increase the density, efficiency, performance and functionality across our hybrid computing platforms such as TwinPro, FatTwin, SuperBlade and MicroBlade, we provide the HPC community the widest range of truly green, scalable and sustainable building block solutions optimized to meet the most challenging supercomputing applications while also protecting our environment.”

“Intel is re-architecting the future of High Performance Computing with the announcement of our end-to-end Intel Omni Scale Fabric and our plans to integrate the fabric onto future Intel Xeon and Intel Xeon Phi processors,” said Barry Davis General Manager of High Performance Fabric Organization Technical Computing Group, at Intel. “With partners such as Supermicro integrating our latest technologies across a wide range of high performance computing platforms, engineering and scientific fields will benefit from the faster data transfers, reduced latencies and higher efficiency that this new fabric provides.”

Supermicro HPC systems feature the highest hybrid compute capacity in their class and are available in the industry’s widest selection of green computing platforms supporting dual Intel Xeon processor E5-2600 v2 with NVIDIA Tesla GPUs or Intel Xeon Phi coprocessors. Notable supercomputing clusters featuring Supermicro green server solutions include the 2014 Green500 #1 ranked TSUBAME-KFC-GSIC Supercomputer at Tokyo Institute of Technology. With 1U SuperServers (SYS-1027GR-TQF) supporting 4x NVIDIA Tesla K20X GPU Accelerators submerged in Green Revolution Cooling CarnotJet liquid cooled tanks this cluster achieved a world record breaking performance/power efficiency of 4.5 GFLOPS per watt. In addition, the upcoming 2,000 node Vienna Scientific Cluster (VSC-3) featuring Supermicro’s Data Center Optimized X9DRD-iF motherboards with dual Intel Xeon processor E5-2650 v2 submerged in GRC CarnotJet racks will maximize computational performance per watt for Austrian universities.

Supermicro’s ISC’14 Exhibits include:

  • 1U NVMe/SAS3 SuperServer (SYS-1027R-WC1NRT) – Dual Intel Xeon processor E5-2600 v2, up to 1TB ECC DDR3 1866MHz in 16x DIMMs, 1x PCI-E 3.0 (x16) FHHL slot, 10x hot-swap 2.5” HDD/SSD bays (2x NVMe PCIe SSD/SATA3, 8x SAS3 12Gb/s), dual-port 10GBase-T, redundant 700W power supplies
  • 1U A+ Server (AS-1042G-TF) – Quad AMD Opteron 6300P (G34) processors, up to 1TB in 32 DIMMs, 1x PCI-E 2.0 (x16) LP slot, dual-port GbE, 3x 3.5” hot-swap SATA HDD bays, 1400W high efficiency power supply
  • 2U TwinPro² (SYS- 2028TP-HC1R) – 4x nodes, dual Intel Xeon E5-2600 v3 “Haswell” (Static Demo), up to 1TB in 16x DIMMs, onboard Infiniband 40GbE FDR or dual 10GBase-T, mSATA and SATA-DOM with SuperCap support, 1x PCI-E 3.0 (x16) LP slot, 2.5” LSI3308 SAS3 12Gb/s or 3.5” SAS/SATA hot-swap HDD/SSD bay configurations and redundant Titanium Level high-efficiency (96%+) digital power supplies.
  • 4U 8x NVIDIA Tesla GPU/Intel Xeon Phi DP SuperServer (SYS-4027GR-TRT) – Dual Intel Xeon processor E5-2600 v2, up to 1.5TB ECC DDR3 1866MHz in 24x DIMMs, up to 48x hot-swap 2.5” SAS2/SATA3 HDD/SSD bays, dual-port 10GBase-T and redundant Platinum Level high-efficiency (95%+) digital power supplies.
  • 4U 12x NVIDIA Tesla GPU/Intel Xeon Phi 4-Node FatTwin (SYS-F627G3-FTPT+) – Each node supports dual Intel Xeon processor E5-2600 v2, up to 1TB ECC DDR3 1866MHz in 16x DIMMs, 3x PCI-E 3.0 (x16) double-width slots, 2x PCI-E 3.0 (x8) slots, front I/O dual-port 10GBase-T, 2x 3.5” hot-swap SATA HDD bays and redundant Platinum Level (1620W) high-efficiency digital power supplies.
  • 6U MicroBlade – Ultra low power, extreme density microserver featuring 112x Intel Atom C2750 (8-core, 2.4GHz) nodes, 4x SDN enabled Ethernet switch modules with 2x 40Gb/s QSFP or 8x 10Gb/s SFP+ uplinks and 56x 2.5Gb/s downlinks, up to 99% cable reduction and 8x (N+1 or N+N redundant) 1600W Platinum Level high-efficiency (95%+) digital power supplies.
  • 7U SuperBlade  – TwinBlade (SBI-7227R-T2) 2x nodes each supporting dual Intel Xeon E5-2600 v2 processors, 4-Way Processor Blade (SBI-7147R-S4F_FDR 56G / SBI-7147R-S4X_10GbE) supporting quad Intel Xeon processor E5-4600 v2, GPU Blades (SBI-7127RG-ESBI-7127RG3) supporting dual Intel Xeon processor E5-2600 v2, 2x NVIDIA Tesla GPU/Intel Xeon Phi and 3x NVIDIA Tesla (SXM) GPU/Intel Xeon Phi, for up to 180x GPUs in 42U racks.

Visit Supermicro at ISC ‘14 in Leipzig, Germany, June 23rd through the 26th at the Congress Center Leipzig (CCL), Booth #430.

For complete information on Supermicro solutions visit www.supermicro.com.

About Super Micro Computer, Inc.

Supermicro, the leading innovator in high-performance, high-efficiency server technology is a premier provider of advanced server Building Block Solutions for Data Center, Cloud Computing, Enterprise IT, Hadoop/Big Data, HPC and Embedded Systems worldwide. Supermicro is committed to protecting the environment through its “We Keep IT Green” initiative and provides customers with the most energy-efficient, environmentally-friendly solutions available on the market.

Source: Super Micro Computer, Inc.

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industy updates delivered to you every week!

Graphcore Readies Launch of 16nm Colossus-IPU Chip

July 20, 2017

A second $30 million funding round for U.K. AI chip developer Graphcore sets up the company to go to market with its “intelligent processing unit” (IPU) in 2017 with scale-up production for enterprise datacenters and Read more…

By Tiffany Trader

Fine-Tuning Severe Hail Forecasting with Machine Learning

July 20, 2017

Depending on whether you’ve been caught outside during a severe hail storm, the sight of greenish tinted clouds on the horizon may cause serious knots in the pit of your stomach, or at least give you pause. There’s g Read more…

By Sean Thielen

Trinity Supercomputer’s Haswell and KNL Partitions Are Merged

July 19, 2017

Trinity supercomputer’s two partitions – one based on Intel Xeon Haswell processors and the other on Xeon Phi Knights Landing – have been fully integrated are now available for use on classified work in the Nationa Read more…

By HPCwire Staff

Fujitsu Continues HPC, AI Push

July 19, 2017

Summer is well under way, but the so-called summertime slowdown, linked with hot temperatures and longer vacations, does not seem to have impacted Fujitsu's output. The Japanese multinational has made a raft of HPC and A Read more…

By Tiffany Trader

HPE Extreme Performance Solutions

HPE Servers Deliver High Performance Remote Visualization

Whether generating seismic simulations, locating new productive oil reservoirs, or constructing complex models of the earth’s subsurface, energy, oil, and gas (EO&G) is a highly data-driven industry. Read more…

Researchers Use DNA to Store and Retrieve Digital Movie

July 18, 2017

From abacus to pencil and paper to semiconductor chips, the technology of computing has always been an ever-changing target. The human brain is probably the computer we use most (hopefully) and understand least. This mon Read more…

By John Russell

The Exascale FY18 Budget – The Next Step

July 17, 2017

On July 12, 2017, the U.S. federal budget for its Exascale Computing Initiative (ECI) took its next step forward. On that day, the full Appropriations Committee of the House of Representatives voted to accept the recomme Read more…

By Alex R. Larzelere

Summer Reading: IEEE Spectrum’s Chip Hall of Fame

July 17, 2017

Take a trip down memory lane – the Mostek MK4096 4-kilobit DRAM, for instance. Perhaps processors are more to your liking. Remember the Sh-Boom processor (1988), created by Russell Fish and Chuck Moore, and named after Read more…

By John Russell

Women in HPC Luncheon Shines Light on Female-Friendly Hiring Practices

July 13, 2017

The second annual Women in HPC luncheon was held on June 20, 2017, during the International Supercomputing Conference in Frankfurt, Germany. The luncheon provides participants the opportunity to network with industry lea Read more…

By Tiffany Trader

Graphcore Readies Launch of 16nm Colossus-IPU Chip

July 20, 2017

A second $30 million funding round for U.K. AI chip developer Graphcore sets up the company to go to market with its “intelligent processing unit” (IPU) in Read more…

By Tiffany Trader

Fine-Tuning Severe Hail Forecasting with Machine Learning

July 20, 2017

Depending on whether you’ve been caught outside during a severe hail storm, the sight of greenish tinted clouds on the horizon may cause serious knots in the Read more…

By Sean Thielen

Fujitsu Continues HPC, AI Push

July 19, 2017

Summer is well under way, but the so-called summertime slowdown, linked with hot temperatures and longer vacations, does not seem to have impacted Fujitsu's out Read more…

By Tiffany Trader

Researchers Use DNA to Store and Retrieve Digital Movie

July 18, 2017

From abacus to pencil and paper to semiconductor chips, the technology of computing has always been an ever-changing target. The human brain is probably the com Read more…

By John Russell

The Exascale FY18 Budget – The Next Step

July 17, 2017

On July 12, 2017, the U.S. federal budget for its Exascale Computing Initiative (ECI) took its next step forward. On that day, the full Appropriations Committee Read more…

By Alex R. Larzelere

Women in HPC Luncheon Shines Light on Female-Friendly Hiring Practices

July 13, 2017

The second annual Women in HPC luncheon was held on June 20, 2017, during the International Supercomputing Conference in Frankfurt, Germany. The luncheon provid Read more…

By Tiffany Trader

Satellite Advances, NSF Computation Power Rapid Mapping of Earth’s Surface

July 13, 2017

New satellite technologies have completely changed the game in mapping and geographical data gathering, reducing costs and placing a new emphasis on time series Read more…

By Ken Chiacchia and Tiffany Jolley

Intel Skylake: Xeon Goes from Chip to Platform

July 13, 2017

With yesterday’s New York unveiling of the new “Skylake” Xeon Scalable processors, Intel made multiple runs at multiple competitive threats and strategic Read more…

By Doug Black

Google Pulls Back the Covers on Its First Machine Learning Chip

April 6, 2017

This week Google released a report detailing the design and performance characteristics of the Tensor Processing Unit (TPU), its custom ASIC for the inference Read more…

By Tiffany Trader

Quantum Bits: D-Wave and VW; Google Quantum Lab; IBM Expands Access

March 21, 2017

For a technology that’s usually characterized as far off and in a distant galaxy, quantum computing has been steadily picking up steam. Just how close real-wo Read more…

By John Russell

HPC Compiler Company PathScale Seeks Life Raft

March 23, 2017

HPCwire has learned that HPC compiler company PathScale has fallen on difficult times and is asking the community for help or actively seeking a buyer for its a Read more…

By Tiffany Trader

Nvidia Responds to Google TPU Benchmarking

April 10, 2017

Nvidia highlights strengths of its newest GPU silicon in response to Google's report on the performance and energy advantages of its custom tensor processor. Read more…

By Tiffany Trader

Trump Budget Targets NIH, DOE, and EPA; No Mention of NSF

March 16, 2017

President Trump’s proposed U.S. fiscal 2018 budget issued today sharply cuts science spending while bolstering military spending as he promised during the cam Read more…

By John Russell

CPU-based Visualization Positions for Exascale Supercomputing

March 16, 2017

In this contributed perspective piece, Intel’s Jim Jeffers makes the case that CPU-based visualization is now widely adopted and as such is no longer a contrarian view, but is rather an exascale requirement. Read more…

By Jim Jeffers, Principal Engineer and Engineering Leader, Intel

Nvidia’s Mammoth Volta GPU Aims High for AI, HPC

May 10, 2017

At Nvidia's GPU Technology Conference (GTC17) in San Jose, Calif., this morning, CEO Jensen Huang announced the company's much-anticipated Volta architecture a Read more…

By Tiffany Trader

Facebook Open Sources Caffe2; Nvidia, Intel Rush to Optimize

April 18, 2017

From its F8 developer conference in San Jose, Calif., today, Facebook announced Caffe2, a new open-source, cross-platform framework for deep learning. Caffe2 is the successor to Caffe, the deep learning framework developed by Berkeley AI Research and community contributors. Read more…

By Tiffany Trader

Leading Solution Providers

How ‘Knights Mill’ Gets Its Deep Learning Flops

June 22, 2017

Intel, the subject of much speculation regarding the delayed, rewritten or potentially canceled “Aurora” contract (the Argonne Lab part of the CORAL “ Read more…

By Tiffany Trader

Reinders: “AVX-512 May Be a Hidden Gem” in Intel Xeon Scalable Processors

June 29, 2017

Imagine if we could use vector processing on something other than just floating point problems.  Today, GPUs and CPUs work tirelessly to accelerate algorithms Read more…

By James Reinders

MIT Mathematician Spins Up 220,000-Core Google Compute Cluster

April 21, 2017

On Thursday, Google announced that MIT math professor and computational number theorist Andrew V. Sutherland had set a record for the largest Google Compute Engine (GCE) job. Sutherland ran the massive mathematics workload on 220,000 GCE cores using preemptible virtual machine instances. Read more…

By Tiffany Trader

Google Debuts TPU v2 and will Add to Google Cloud

May 25, 2017

Not long after stirring attention in the deep learning/AI community by revealing the details of its Tensor Processing Unit (TPU), Google last week announced the Read more…

By John Russell

Russian Researchers Claim First Quantum-Safe Blockchain

May 25, 2017

The Russian Quantum Center today announced it has overcome the threat of quantum cryptography by creating the first quantum-safe blockchain, securing cryptocurrencies like Bitcoin, along with classified government communications and other sensitive digital transfers. Read more…

By Doug Black

Groq This: New AI Chips to Give GPUs a Run for Deep Learning Money

April 24, 2017

CPUs and GPUs, move over. Thanks to recent revelations surrounding Google’s new Tensor Processing Unit (TPU), the computing world appears to be on the cusp of Read more…

By Alex Woodie

Six Exascale PathForward Vendors Selected; DoE Providing $258M

June 15, 2017

The much-anticipated PathForward awards for hardware R&D in support of the Exascale Computing Project were announced today with six vendors selected – AMD Read more…

By John Russell

Top500 Results: Latest List Trends and What’s in Store

June 19, 2017

Greetings from Frankfurt and the 2017 International Supercomputing Conference where the latest Top500 list has just been revealed. Although there were no major Read more…

By Tiffany Trader

  • arrow
  • Click Here for More Headlines
  • arrow
Share This